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echnology in Japan (A)Henry H. Utsunomiya,METI Registered Management ConsultantInterconnection Technologies, Inc.10:30 – 10:50Break10:50 – 11:40The technology and application trend of Embedded active technology in Japan (B)Henry H. Utsunomiya,11:40 – 12:30Chip in Substrate Packaging Technology – Concept and Trend張世明經(jīng)理/ ITRI/ERSO12:30 – 13:30Lunch13:30 – 14:10Chip in Substrate Packaging Technology – Process Evaluation陳裕華課長(zhǎng)/ ITRI/ERSO14:10 – 15:00Advanced Packaging for Flexible Applications (A)Andreas Ostmann,德國IZM15:00 – 15:20Break15:20 – 16:10Advanced Packaging for Flexible Applications (B)Andr