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2025-05-21 20:12本頁面
【正文】 At slice data memory RAM (128B/256B),it use not depositting not can reading /data that write, such as result not middle of operation, final result and data wanted to show, etc. ( 3) Procedure memory ROM/EPROM (4KB/8KB ), is used to preserve the procedure , some initial data and form in slice. But does not take ROM/EPROM within some onechip puters, such as 8031 , 8032, 80C ,etc.. ( 4) Four 8 run side by side I/O interface P0 four P3, each mouth can use as introduction , may use as exporting too. ( 5) Two timer / counter, each timer / counter may set up and count in the way, used to count to the external incident, can set up into a timing way too, and can according to count or result of timing realize the control of the puter. ( 6) Five cut off cutting off the control system of the source . ( 7) One all duplexing serial I/O mouth of UART (universal asynchronous receiver/transmitter (UART) ), is it realize onechip puter or onechip puter and serial 第 頁 共 頁 munication of puter to use for. ( 8) Stretch oscillator and clock produce circuit, quartz crystal finely tune electric capacity need outer. Allow oscillation frequency as 12 megahertas now at most. Every the abovementioned part was joined through the inside data bus .Among them, CPU is a core of the onechip puter, it is the control of the puter and mand centre, made up of such parts as arithmetic unit and controller , etc.. The arithmetic unit can carry on 8 persons of arithmetic operation and unit ALU of logic operation while including one, the 1 storing device temporarilies of 8, storing device 2 temporarily, 839。 but even a microprocessor will have memory on the chip. Although the structures are intricate – with widths which have been shrinking for decades – the layers remain much thinner than the device widths. The layers of material are fabricated much like a photographic process, although light waves in the visible spectrum cannot be used to expose a layer of material, as they would be too large for the features. Thus photons of higher frequencies (typically ultraviolet) are used to create the patterns for each layer. Because each feature is so small, electron microscopes are essential tools for a process engineer who might be debugging a fabrication process. The earliest integrated circuits were packaged in ceramic flat packs, which continued to be used by the military for their reliability and small size for many years. Commercial circuit packaging quickly moved to the dual inline package (DIP), first in ceramic and later in plastic. In the 1980s pin counts of VLSI circuits exceeded the practical limit for DIP packaging, leading to pin grid array (PGA) and leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with leads formed as either gullwing or Jlead, as exemplified by smalloutline integrated circuit a carrier which occupies an area about 30 – 50% less than an equivalent DIP, with a typical thickness that is 70% less. This package has gull wing leads protruding from the two long sides and a lead spacing of inches. 第 頁 共 頁 In the late 1990s, PQFP and TSOP packages became the most mon for high pin count devices, though PGA packages are still often used for highend microprocessors. Intel and AMD are currently transitioning from PGA packages on highend microprocessors to land grid ar
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