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【正文】 ? If this specification conflicts with any other documents the following order of precedence shall apply: ? a) Purchase order ? b) Printed wiring board drawings and drill and trim documentation ? c) This specification ? d) Documents referred to in this speciation. ? ? Supplier shall use applicable fabrication panel coupon as defined in coupon ,and solder samples shall be provided with each shipment for validation requirement. ? 1. Maximum 3 repair operations are allowed on each board and the number of repaired PCB’S cannot exceed the 10 percent of the entire lot population. ? ? 2. Unless otherwise specified on the engineering drawing ,plated through via holes with a nominal size of or less may be partially or pletely plugged with solder. ? ? 3. As a preventive precaution .before the laying down of the solder ,the PCB’S will have to be washed to remove the residuals due to the production process, the clearing degree of the PCB’S before the coating has to be the following one MAX 1 ug /square cm.. 1. Solder mask (SMOBC)Apply LPI solder masks per IPCSM840 type B. class 3. color green and minimum solder masks thickness over the edges shall be ”.LPI solder mask and solder shall meet the UL 94vo requirements. There shall be no solder masks over the SMT pads ,there shall be no exposed traces on outside layers and solder mask o
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