半導(dǎo)體制程簡介-(nxpowerlite)-資料下載頁
2025-08-05 03:55本頁面
【正文】 00 Ti/250 TiN) ? MET2 AL (4000 AlCu/50 Ti/300 TiN) ? Inanic BARC SION DEP 320A+32 ? M2 Photo ? Metal etch ? Resist Strip DR(L/S) = Met 1 NWell PWell P+ P+ N+ N+ 160197。 Ti / 70197。 TiN Met 2 50197。 Ti / 300197。 TiN 4k197。 AlCu 200197。 Ti / 250197。 TiN VIA 2: DEP amp。 ETCH ? 6k197。 HDP USG amp。 PETEOS depOx ? CMP for IMD ? PESiON 600A ? Via2 Photo ? Via etch ? Resist Strip Met 1 NWell PWell P+ P+ N+ N+ Met 2 METAL 3 DEPamp。 ETCH WPLUG ?VIA GLUE LAYER ?ETCH 130 /160Ti/70TiN (IMP/CVD) ? W CVD ?W CMP for IMD ?MET3 GLUE (200 Ti/250 TiN) ?MET3 AL (8000 AlCu/50 Ti/600 TiN) ?Inanic BARC ?SION DEP 320A+32 ?M3 Photo ?Metal etch ?Resist Strip Met 1 NWell PWell P+ P+ N+ N+ Met 2 Met 3 DR: VIA 3: DEPamp。ETCH Met 1 NWell PWell P+ P+ N+ N+ Met 2 Met 3 ?6k197。 HDP USG amp。 PETEOS depOx ?CMP for IMD ?PESiON 600A ?Via3 Photo ?Via etch ?Resist Strip DR: METAL 4 DEP amp。 ETCH WPLUG ?MET4 GLUE (200 Ti/250 TiN) ?MET4 AL (4000 AlCu/50 Ti/600 TiN) ?Inanic BARC ?SION DEP 320A+32 ?M4 Photo ?Metal etch ?Resist Strip ?VIA GLUE LAYER ?ETCH 130 /160Ti/70TiN (IMP/CVD) ? W CVD ?W CMP for IMD Met 1 NWell PWell P+ P+ N+ N+ Met 2 Met 3 Met 4 DR: VIA 4: DEPamp。ETCH ?6k197。 HDP USG amp。 PETEOS depOx ?CMP for IMD ?PESiON 600A ?Via4 Photo ?Via etch ?Resist Strip Met 1 NWell PWell P+ P+ N+ N+ Met 2 Met 3 Met 4 DR: METAL 5: DEPamp。ETCH WPLUG ?MET5 GLUE (200 Ti/250 TiN) ?MET5 AL (4000 AlCu/50 Ti/600 TiN) ?Inanic BARC ?SION DEP 320A+32 ?M5 Photo ?Metal etch ?Resist Strip ?VIA GLUE LAYER ?ETCH 130 /160Ti/70TiN (IMP/CVD) ? W CVD ?W CMP for IMD Met 1 NWell PWell P+ P+ N+ N+ Met 2 Met 3 Met 4 Met 5 DR: VIA 5: DEPamp。ETCH NWell PWell P+ P+ N+ N+ Met 1 Met 2 Met 3 Met 4 Met 5 ?6k197。 HDP USG amp。 PETEOS ?CMP for IMD ?PESiON 600A ?Via5 Photo ?Via etch ?Resist Strip DR: METAL 6: DEPamp。ETCH WPLUG ?MET6 GLUE (200 Ti/250 TiN) ?MET6 AL (6000 AlCu/375 TiN) ?Inanic BARC ?SION DEP 320A+32 ?M6 Photo ?Metal etch ?Resist Strip ?VIA GLUE LAYER ?ETCH 130 /160Ti/70TiN (IMP/CVD) ? W CVD ?W CMP for IMD NWell PWell P+ P+ N+ N+ Met 1 Met 2 Met 3 Met 4 Met 5 Met 6 DR: PASSIVATION ?10k197。 HDP oxide dep ?PESION DEP ?PESIN 6K DEP ?PD Photo for bond pad ?HDP passivation etch ?Resist Strip ?Alloy 410186。C, 30’ NWell PWell P+ P+ N+ N+ Met 1 Met 2 Met 3 Met 4 Met 5 Met 6 +6kA SIN 10k197。 HDP NWell PWell P+ P+ N+ N+ Met 1 Met 2 Met 3 Met 4 Met 5 Met 6 Poly Contact Via 1 Via 2 ?m STI, Ti Salicide, 6LM Logic Device Stack Via(1~5) Chai
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鄂ICP備17016276號-1