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半導(dǎo)體制造流程與ic產(chǎn)業(yè)鏈簡介[1]-資料下載頁

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【正文】 3. Filed application 4. The Trend UMC Confidential, No Disclosure Data Prepared by Morris Page 41 wafer processing Frontend Lot/wafer Backend wafer Sorting ( C/P testing) C/P : Circuit probing Wafer/dice System Design Synthesis, simulation, and physical layout Design Mask Tooling Designing stage Reticle .gds dB System 2. IC manufacturing chain Frontend IDM Fabless Turnkey Fundry UMC Confidential, No Disclosure Data Prepared by Morris Page 42 Die sawing Wire bond Solder bumped Package Final Test Burnin Backend Wafer/dice Dice/chip chip chip chip Field Application module 2. IC manufacturing chain Backend Assembly and Testing IDM System House UMC Confidential, No Disclosure Data Prepared by Morris Page 43 IC Design flow Simulation and Testbility design Level Design Verification, Physical layout generation ,design optimization,Test pattern generation Level Tape out , DRC, Mask Tooling and Fab Pilot Level System Design Entry and Analysis System Synthesis and Technology Optimization Level UMC Confidential, No Disclosure Data Prepared by Morris Page 44 Backend Assembly flow InterWafer SortBack lipping \Die sawingLead frame \SubstrateWire bondingC/P YieldreportFilpchip onsubstrateSolder BumpCappingassemblyFinal TestingBurninProgram / EraseShippingFinal YieldreportBurninreportFab outFab EDA dBCustomerdBUMC Confidential, No Disclosure Data Prepared by Morris Page 45 IC manufacturing chain Capital, cycle and gross margin Design Production Time To Market = ~ year (without qualification) UMC Confidential, No Disclosure Data Prepared by Morris Page 46 Outline 1. Fab flow and Transistor working 2. IC manufacturing chain 3. Filed application 4. The Trend UMC Confidential, No Disclosure Data Prepared by Morris Page 47 CMOS TechnologyStorageDigital SignalProcessMixed SignalProcessPhotoElectronicVolatile :SRAMl Low power SRAMl High speedSRAMl nicheDRAMl SDRAMl DDRDRAMl Rambus DRAMl eDRAMl NichenonVolatile :FlashEPROM / E2ROMMask ROMeFlashFPGAOTPPC basedl MPU, CPUl Chipsetl Graphicsl peripherall controllerpostPC eral PDAl ebookl STBl GPS, eMAPl DSPConsumerl MPEGl DVD/VCDl mp3 decoderl SmartCardl nichePC basedl audio processorl Modem (xDSL , Cable)l LANl Router SwitchRF based(wireless, bluetooth)Mobil unication(DECT, cellular , satellite,CDMA....)Image Sensorl CCDl CISDisplayl m Displayl LCD driverl LCD controllerSecurityl Touch Chipl Image Identify3. Filed application UMC Confidential, No Disclosure Data Prepared by Morris Page 48 Outline 1. Fab flow and Transistor working 2. IC manufacturing chain 3. Filed application 4. The Trend UMC Confidential, No Disclosure Data Prepared by Morris Page 49 Device Integration and Technology drive UMC Confidential, No Disclosure Data Prepared by Morris Page 50 Notes: (1) Box Center represents start at Pilot Production Schedule. (2) Based on logic and eSRAM roadmap. (3) SIA = Semiconductor Industry Association UMC / SIA Technology Road Map 1999 2023 2023 2023 Cu Cu 2023 2023 SIA Cu Cu Cu Cu UMC UMC Confidential, No Disclosure Data Prepared by Morris Page 51 Technology Road Map Note: (1) Box Center represents Pilot Production Schedule begins. 1998 1999 2023 2023 eDRAM Logic eSRAM MixedMode/RF Embedded Flash Memory Cu Cu UMC Confidential, No Disclosure Data Prepared by Morris Page 52 Hardware and process limitation The two major limitations : one is Gate high k dielectric material , the other is Gate line width limitation, it means that beyond DUV light source should be developed, and the cooperating should be developed which contained Reticle, Photo Resist, Stepper, Inspection and Metrology tools. UMC Confidential, No Disclosure Data Prepared by Morris Page 53 Generation and Application mix %%%%%%%%%%%%%%% %%%%%%% %%%%%% %%0%25%50%75%100%1999 2023 2023 2023 2023 2023≧ um~ um~ um~ um~ um*Based on Current Demand/Forecast Projections UMC technology mix ASET product mix There’re two significant trend in these two figures : The technology will be driven into deep submicron technology, and the PC didn’t dominate the the field application mix. UMC Confidential, No Disclosure Data Prepared by Morris Page 54 Man Stanley : Semi growth follows GDP movement Me and my shadow: Semi growth follows GDP movement Upward or Downward ? UMC Confidential, No Disclosure Data Prepared by Morris Page 55 演講完畢,謝謝觀看!
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