【正文】
芯片節(jié)溫估算,由于環(huán)境溫度為85℃,只能得到環(huán)境溫度信息,PCB板或者芯片的Case的溫度均不能得到,故只能使用θja 進(jìn)行大致估算。4 Discussion 熱仿真軟件的使用(TBD)若使用熱仿真軟件,則可將各種參數(shù)輸入,而不僅是只使用θja ,將會(huì)得到較精確的仿真參數(shù)。5 Conclusions6 Abbreviations, Definitiones, Glossary7 VersionVersionCommentsDateRevision by0001Initial18/12/2015Bai Page 13 of 13 Doc. No.: WI00000Ver No.: 01Ver Date: 00MMM2014Information included in this document is the property of IEE . Copy, use or disclosure of its contents, even in part, is not permitted without the prior written agreement of IEE. This document is strictly IEE confidential.