熱分析的基本參數(shù)與概念-資料下載頁(yè)
2025-06-27 06:01本頁(yè)面
【正文】 芯片節(jié)溫估算，由于環(huán)境溫度為85℃，只能得到環(huán)境溫度信息，PCB板或者芯片的Case的溫度均不能得到，故只能使用θja 進(jìn)行大致估算。4 Discussion 熱仿真軟件的使用(TBD)若使用熱仿真軟件，則可將各種參數(shù)輸入，而不僅是只使用θja ，將會(huì)得到較精確的仿真參數(shù)。5 Conclusions6 Abbreviations, Definitiones, Glossary7 VersionVersionCommentsDateRevision by0001Initial18/12/2015Bai Page 13 of 13 Doc. No.: WI00000Ver No.: 01Ver Date: 00MMM2014Information included in this document is the property of IEE . Copy, use or disclosure of its contents, even in part, is not permitted without the prior written agreement of IEE. This document is strictly IEE confidential.
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