【正文】 ze:) 系統(tǒng)格式設(shè)置 reopen_window_fit (Image::Maxextent,Row,Col:WindowHandle) 獲取圖像長(zhǎng)寬 write_message (::WindowHandle,Row,Column,String,WindowCoordinates:) 依據(jù)字體大小估算文本的拓展，在指定位置繪制矩形并顯示信息 dev_display_shape_matching_results(::ModelID,Color,Row,Column,Angle,ScaleC,Model:) 顯示基于形狀匹配的結(jié)果 dev_open_window_fit_image(Image::Row,Cloumn,WidthLimit,HeightLimit : WindowHandle) 打開一個(gè)新的圖形窗口并調(diào)整大小，它能在保持正確的圖像長(zhǎng)寬比前提下而適用于如 WidthLimit 和 HeightLimit 的規(guī)定限制 dev_display_shape_matching_results(::ModeID,Color,Row,Column,Angle,ScaleC,Model:) 顯示匹配的結(jié)果 disp_3d_coord_system (:: WindowHandle,CamParam,Pose,CoordAxesLength:) 顯示3D 坐標(biāo)系統(tǒng) disp_continue_message (::WindowHandle,Color,Box:) 在圖形窗口上顯示“ Click 39。Run39。 to continue” disp_message (::WindowHandle,String,CoordSystem,Row,Column,Color,Box:) 在圖像窗口上按代碼要求顯示不同的文本 gen_arrow_contour_xld(:Arrow:Row,Column1,Row2,Column2,HeadLength,HeadWidth:) 生成箭頭形的 XLD 輪廓 list_image_files (::ImageDirectory,Extensions,Options:ImageFiles) 返回?cái)U(kuò)展中一個(gè)特定后綴的特定目錄中所有的文件 parse_filename (::FileName:BaseName,Extension,Directory) 獲得文件名（全路徑），輸入并按三種不同的字符串返回目錄路徑、基本文件名和擴(kuò)展 scale_image_range (Image:ImageScaled:Min,Max:) 改變圖像的灰度值 set_display_font (::WindowHandle,Size,Font,Bold,Slant:) 按照指定屬性設(shè)置當(dāng)前窗口的文本字體 sort_pairs (::T1,T2,SortMode:Sorted1,Sorted2) 輸入?yún)?shù)對(duì)原組排序 tuple_gen_sequence (::Start,End,Step:Sequence) 產(chǎn)生一個(gè)等間距值序列的數(shù)組 第二，基于半導(dǎo)體晶片的切割定位主函數(shù)代碼及 功能如下： main(:::) * 初始化 read_image (WaferDies, 39。wafer_dies39。) reopen_window_fit (WaferDies, 700, 0, 0, WindowHandle) init_font (WindowHandle, 1, 2) get_window_extents (WindowHandle, _, _, WindowWidth, WindowHeight) 畢業(yè)論文 34 dev_update_all (39。off39。) dev_set_draw (39。margin39。) get_image_pointer1 (WaferDies, _, _, Width, Height) dev_display (WaferDies) write_message (WindowHandle, 1, 1, 39。Image of a wafer39。, true) write_message (WindowHandle, WindowHeight 30, 1, 39。Press \39。Run\39。 to continue39。, true) stop () * 1. 利用自相關(guān)算法獲取晶片大 小 rft_generic (WaferDies, ImageFFT, 39。to_freq39。, 39。none39。, 39。plex39。, Width) correlation_fft (ImageFFT, ImageFFT, CorrelationFFT) rft_generic (CorrelationFFT, Correlation, 39。from_freq39。, 39。n39。, 39。real39。, Width) * 排除圖像邊緣的局部最大值，因?yàn)樽韵嚓P(guān)是一個(gè)偶函數(shù)，所以提取左上四分之一的最大值就可以了 gen_rectangle1 (Rectangle, 1, 1, Height/2, Width/2) reduce_domain (Correlation, Rectangle, CorrelationReduced) * 提取自相關(guān)函數(shù)的局部最大值 local_max_sub_pix (CorrelationReduced, 39。gauss39。, 2, 5000000, Row, Col) * 提取晶片尺寸 * 找到接近原點(diǎn)的最大值 . 這個(gè)最大值相當(dāng)于晶片中相應(yīng)矩形的中心 distance_pp (gen_tuple_const(|Row|,0), gen_tuple_const(|Col|,0), Row, Col, Distance) SortedIndex := sort_index(Distance) Row1 := Row[SortedIndex[0]] Col1 := Col[SortedIndex[0]] DiagonalLength := sqrt(Row1*Row1 + Col1*Col1) Phi := atan2(Row1,Col1) DieWidth := DiagonalLength * cos(Phi) DieHeight := DiagonalLength * sin(Phi) * 中心、第一個(gè)極大值和第二個(gè)極大值合在一起就可以定義晶片的方位和大小 dev_set_color (39。blue39。) gen_cross_contour_xld (Crosses, Row, Col, 8, ) gen_ellipse_contour_xld (Circle, Row1, Col1, 0, 8, 8, 0, , 39。positive39。, ) dev_display (Correlation) dev_display (Crosses) dev_display (Circle) dev_set_color (39。green39。) dev_display (Rectangle) write_message (WindowHandle, 1, 1, 39。Autocorrelation, region of interest, and local 畢業(yè)論文 35 maxima39。, true) write_message (WindowHandle, WindowHeight 30, 1, 39。Press \39。Run\39。 to continue39。, true) stop () * 構(gòu)想提取出的晶片尺寸 gen_rectangle2_contour_xld (Die, Height/2, Width/2, 0, DieWidth/2, DieHeight/2) reopen_window_fit (WaferDies, 700, 0, 0, WindowHandle) init_font (WindowHandle, 1, 2) dev_display (WaferDies) dev_set_color (39。blue39。) dev_display (Die) write_message (WindowHandle, 1, 1, 39。Extracted die size39。, true) write_message (WindowHandle, WindowHeight 30, 1, 39。Press \39。Run\39。 to continue39。, true) stop () * 2. 利用基于形狀的匹配方法提取芯片的位置 LineWidth := 7 LineWidthFraction := * 從晶 片中生成一個(gè)人為的切割線模型圖像 gen_image_const (Template, 39。byte39。, Width, Height) scale_image (Template, Template, 1, 128) RefRow := round(*Height) RefCol := round(*Width) for Row := to by 1 for Col := to by 1 gen_rectangle2_contour_xld (Rectangle, RefRow + Row*DieHeight, RefCol + Col*DieWidth, 0, *DieWidth *LineWidth, *DieHeight *LineWidth) paint_xld (Rectangle, Template, Template, 0) endfor endfor gen_rectangle2_contour_xld (Rectangle, RefRow, RefCol, 0, *LineWidthFraction*LineWidth, DieHeight) paint_xld (Rectangle, Template, Template, 0) gen_rectangle2_contour_xld (Rectangle, RefRow, RefCol, 0, DieWidth, *LineWidthFraction*LineWidth) paint_xld (Rectangle, Template, Template, 0) gen_rectangle2 (ROI, RefRow, RefCol, 0, DieWidth+5, DieHeight+5) reduce_domain (Template, ROI, TemplateReduced) create_shape_model (TemplateReduced, 39。auto39。, 0, 0, 39。auto39。, 39。auto39。, 39。ignore_local_polarity39。, 39。auto39。, 5, ModelID) 畢業(yè)論文 36 dev_display (Template) dev_set_color (39。blue39。) dev_display (ROI) write_message (WindowHandle, 1, 1, 39。Template of 4 adjacent dies39。, true) write_message (WindowHandle, WindowHeight 30, 1, 39。Press \39。Run\39。 to continue39。, true) stop () * 在原始圖上找到最好的人工模型匹配 MinScore := Greediness := NumMatches := 1 find_shape_model (WaferDies, ModelID, 0, 0, MinScore, NumMatches, , 39。least_squares39。, 0, Greediness, MatchRow, MatchColumn, MatchAngle, MatchScore) * get_shape_model_contours (ModelContours, ModelID, 1) vector_angle_to_rigid (0, 0, 0, MatchRow, MatchColumn, MatchAngle, HomMat2D) affine_trans_contour_xld (ModelContours, ContoursAffinTrans, HomMat2D) dev_display (WaferDies) dev_set_color (39。blue39。) dev_display (ContoursAffinTrans) write_message (WindowHandle, 1, 1, 39。Best match39。, true) write_message (WindowHandle, WindowHeight 30, 1, 39。Press \39。Run\39。 to continue39。, true) stop () * 3. 按芯片的尺寸和位置估計(jì)切割線的位置 dev_clear_window () dev_display (WaferDies) dev_set_color (39。blue39。)