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電子類文獻(xiàn)中英文翻譯(編輯修改稿)

2025-07-15 15:04 本頁面
 

【文章內(nèi)容簡介】 the size of wafers was no small matter. Originally, wafers were one or two inches in diameter, and by 2000 they were as much as twelve inches. At first, it puzzled me that, when shrinkage presented so many other problems, the industry should make things harder for itself by going to larger wafers. I now see that reducing unit cost was just as important to the industry as increasing the number of transistors on a chip, and that this justified the additional investment in foundries and the increased risk. The degree of integration is measured by the feature size, which, for a given technology, is best defined as the half the distance between wires in the densest chips made in that technology. At the present time, production of 90 nm chips is still building upSuspension of Law In March 1997, Gordon Moore was a guest speaker at the celebrations of the centenary of the discovery of the electron held at the Cavendish Laboratory. It was during the course of his lecture that I first heard the fact that you can have silicon chips that are both fast and low in cost described as a violation of Murphy’s Sod’s law as it is usually called in the UK. Moore said that experience in other fields would lead you to expect to have to choose between speed and cost, or to promise between them. In fact, in the case of silicon chips, it is possible to have both.In a reference book available on the web, Murphy is identified as an engineer working on human acceleration tests for the US Air Force in 1949. However, we were perfectly familiar with the law in my student days, when we called it by a much more prosaic name than either of those mentioned above, namely, the Law of General Cussedness. We even had a mock examination question in which the law featured. It was the type of question in which the first part asks for a definition of some law or principle and the second part contains a problem to be solved with the aid of it. In our case the first part was to define the Law of General Cussedness and the second was the problem。A cyclist sets out on a circular cycling tour. Derive an equation giving the direction of the wind at any time. The singlechip puter At each shrinkage the number of chips was reduced and there were fewer wires going from one chip to another. This led to an additional increment in overall speed, since the transmission of signals from one chip to another takes a long time. Eventually, shrinkage proceeded to the point at which the whole processor except for the caches could be put on one chip. This enabled a workstation to be built that outperformed the fastest miniputer of the day, and the result was to kill the miniputer stone dead. As we all know, this had severe consequences for the puter industry and for the people working in it. From the above time the high density CMOS silicon chip was Cock of the Roost. Shrinkage went on until millions of transistors could be put on a single chip and the speed went up in proportion. Processor designers began to experiment with new architectural features designed to give extra speed. One very successful experiment concerned methods for predicting the way program branches would go. It was a surprise to me how successful this was. It led to a significant speeding up of program execution and other forms of prediction followedEqually surprising is what it has been found possible to put on a single chip puter by way of advanced features. For example, features that had been developed for the IBM Model giant puter at the top of the System 360 now to be found on microputers Murphy’s Law remained in a state of suspension. No longer did it make sense to build experimental puters out of chips with a small scale of integration, such as that provided by the 7400 series. People who wanted to do hardware research at the circuit level had no option but to design chips and seek for ways to get them made. For a time, this was possible, if not easy Unfortunately, there has since been a dramatic increase in the cost of making chips, mainly because of the increased cost of making masks for lithography, a photographic process used in the manufacture of chips. It has, in consequence, again bee very difficult to finance the making of research chips, and this is a currently cause for some concern. The Semiconductor Road Map The extensive research and development work underlying the above advances has been made possible by a remarkable cooperative effort on the part of the international semiconductor industry.At one time US monopoly laws would probably have made it illegal for US panies to participate in such an effort. However about 1980 significant and far reaching changes took place in the laws. The concept of prepetitive research was introduced. Companies can now collaborate at the prepetitive stage and later go on to develop products of their own in the regular petitive manner. The agent by which the prepetitive research in the semiconductor industry is managed is known as the Semiconductor Industry Association (SIA). This has been active as a US organisation since 1992 and it became international in 1998. Membership is open to any organisation that can contribute to the research effort. Every two years SIA produces a new version of a document known as the International Technological Roadmap for Semiconductors (ITRS), with an update in the intermediate years. The first volume bearing the title ‘Roadmap’ was issued in 1994 but two reports, written in 1992 and distributed in 1993, are regarded as the true beginning of the series. Successive roadmaps aim at providing the best available industrial consensus on the way that the industry should move forward. They set out in great a 15 year horizon. the targets that must be achieved if the number of ponents on a chip is to be doubled every eighteen is, if Moore’s law is to be if the cost per chip is to fall.In the case of some items, the way ahead is clear. In others, manufacturing
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