半導(dǎo)體封裝制程與設(shè)備材料知識(shí)介紹-fe-免費(fèi)閱讀
【正文】 01 二月 20234:46:46 上午 04:46:46二月 21l 1最具挑 戰(zhàn) 性的挑 戰(zhàn) 莫 過 于提升自我。 2023/2/1 4:46:4604:46:4601 February 2023l 1空山新雨后，天氣晚來秋。 二月 21二月 21Monday, February 01, 2023l 很多事情努力了未必有 結(jié) 果，但是不努力卻什么改 變 也沒有。 二月 2104:46:4604:46Feb2101Feb21l 1故人江海 別 ，幾度隔山川。CULL等離子工藝Plasma Processl 氣相 固相表面相互作用 Gas Phase Solid Phase Interaction? Physical and Chemicall 分子級(jí)污染物去除Molecular Level Removal of Contaminants? 30 to 300 Angstromsl 可去除污染物包括 Contaminants Removedl 難去除污染物包括 Difficult Contaminants – Finger Prints– Flux– Gross Contaminants– Oxides– Epoxy– Solder Mask– Organic Residue– Photoresist– Metal Salts (Nickel Hydroxide)Plasma Clean – March AP1000 Key Technology:1. Argon Condition, No oxidation.2. Vacuum Pump dust collector.3. Clean Level : blob Test Angle 8 PCB SubstrateDie+ ++++ ++ ++++++Electrode+ArWell Cleaned with Plasma? 8 o ChipArAr No Clean (Organic Contamination) Well Cleaned with Plasma?? 80 o ? 8 o Organic Contamination vs Contact AngleWater DropChip ChipMold(模塑 )To mold strip with plastic pound then protect the chip to prevent from damaged塑封元件的線路，以保護(hù)元件免受外力損壞，同時(shí)加強(qiáng)元件 的物理特性 ,便于使用 .在模塑前要經(jīng)過等離子清洗 (PreMold Plasma Clean),以確保模塑質(zhì)量 .在模塑后要經(jīng)過模塑后固化(Post Mold Cure),以固化模塑料 .塑封塑封 (Molding)A TOWA YPS YSeriesB ASA OMEGA 機(jī)器上指示燈的說明：Die PadSubstrate LeadGold WireCapillaryUltrasonic PowerHeaterBond Force焊線焊線 (Wire Bond) Bond 相關(guān)工藝u Pad Open Bond Pad Pitchu Ball Sizeu Ball Thicknessu Loop heightu Wire Pullu Ball shortu Crater Test焊線焊線 (Wire Bond) Bond 相關(guān)材料u Substrate with dieu Capillary u Gold Wire l TIP ..…… Pad Pitch Pad pitch x = TIPl Hole ..…. .Wire Diameter Wire diameter + ~ = Hl CD………Pad size/open/1 st Ball CD + ~ = 1st Bond Ball sizel FA OR….Pad pitch(um) FA 100 0,4 ~90/100 4,8,11 90 11,15 l IC type …… loop typeCapillary Gold Wireu Gold Wire Manufacturer (Nippon , SUMTOMO , TANAKA…. )u Gold Wire Data ( Wire Diameter , Type , EL , TS)焊線焊線 (Wire Bond) Bond 輔助設(shè)備A Microscope 用于測(cè) loop heightB Wire Pull 拉力計(jì)（ DAGE4000）C Ball Shear 球剪切力計(jì)D Plasma 微波 /等離子清洗計(jì)Ball SizeBall Thicknessu 單位 : um， Milu 量測(cè)倍率 : 50Xu Ball Thickness 計(jì)算公式u 60 um BPP ≧ 1/2 WD=50%u 60 um BPP ≦ 1/2 WD=40%~50%Ball SizeBall Size Ball ThicknessLoop Heightu 單位 : um， Milu 量測(cè)倍率 : 20XLoop Height 線長(zhǎng)Wire Pullu 1 Lifted Bond (Rejected)u 2 Break at neck (Refer wirepull spec)u 3 Break at wire ( Refer wirepull spec)u 4 Break at stitch (Refer stitchpull spec)u 5 Lifted weld (Rejected)Ball Shearu 單位 : gram or g/mil178。HoleBall 2. Bonding Accuracy X/Y: 25 um。沒有飛 3.切割街區(qū)的 DDYRPM27HEED:30000~45000,DYRearFro
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