半導(dǎo)體封裝制程與設(shè)備材料知識介紹-fe(存儲版)
【正文】 ntA Few Conceptsl BBD (Blade Broken Detector)l Cutterset: Contact and Opticall Precision Inspectionl UpCut and DownCutl Cutin and Cutremain晶晶 圓圓 切切 割割 (Dicing)Dicing 相關(guān)工藝A Die Chipping 芯片崩角B Die Corrosive 芯片腐蝕C Die Flying 芯片飛片WmaxTapeTapingBack Side Upward半半 導(dǎo)導(dǎo) 體體 制制 程程Oxidization(氧化處理 )Lithography(微影 )Etching(蝕刻 )Diffusion Ion Implantation(擴散離子植入 )Deposition(沉積 )Wafer Inspection(晶圓檢查 )Grind Dicing(晶圓 研磨及 切割 )Die Attach(上片 )WireBonding(焊線 ) Molding(塑封 ) Package(包裝 )Wafer Cutting(晶圓切斷 )Wafer Reduce (晶圓減薄 )Laser Cut package saw(切割 成型 )Testing(測試 )Laser mark(激光印字 )IC制造開始前段結(jié)束后段封裝開始製造完成封封 裝裝 型型 式式 (PACKAGE)Through HoleMountShapeMaterial Lead Pitch No of I/OTypical FeaturesCeramicPlastic mm(100miles) 8 ~64DIPDual InlinePackagePlastic mm(100miles)1 direction lead3~25SIPSingle InlinePackage封封 裝裝 型型 式式 Through HoleMountShapeMaterial Lead Pitch No of I/OTypical FeaturesPlastic mm(100miles)1 directionlead16~24ZIPZigzagInlinePackagePlastic mm(70miles) 20 ~64SDIPShrinkDual InlinePackage封封 裝裝 型型 式式 Through HoleMountShapeMaterial Lead Pitch No of I/OTypical FeaturesCeramicPlastic mm(100miles)halfsize pitch in the width direction24~32SKDIPSkinnyDualInlinePackageCeramicPlastic mm(100miles)PBGAPin GridArray封封 裝裝 型型 式式 SurfaceMount Shape Material Lead Pitch No of I/OTypical FeaturesPlastic mm(50miles)2 direction lead8 ~40SOPSmallOutlinePackagePlastic, , mm4 direction lead88~200QFPQuadFlatPack封封 裝裝 型型 式式 SurfaceMount Shape Material Lead Pitch No of I/OTypical FeaturesCeramic, mm(50, 30miles)2, 4 direction lead20~80FPGFlatPackageof GlassCeramic, mm(50, 40, 30 miles)20~40LCCLeadlessChipCarrier封封 裝裝 型型 式式 SurfaceMount Shape Material Lead Pitch No of I/OTypical FeaturesCeramic mm(50miles)jshape bend4 direction lead18~124PLCCPlastic LeadedChip CarrierCeramic mm 32~200VSQFVerySmallQuadFlatpackAssembly Main ProcessDie Cure(Optional)Die BondDie Saw PlasmaCard AsyMemory TestCleaner Card Test Packing for OutgoingDetaping(Optional)Grinding(Optional)Taping(Optional)WaferMountUV Cure(Optional)Laser markPost Mold CureMolding Laser Cut Package SawWire Bond SMT(Optional)半導(dǎo)體設(shè)備供應(yīng)商介紹半導(dǎo)體設(shè)備供應(yīng)商介紹 前道部分前道部分半導(dǎo)體設(shè)備供應(yīng)商介紹半導(dǎo)體設(shè)備供應(yīng)商介紹 前道部分前道部分常用術(shù)語介紹常用術(shù)語介紹1. SOPStandard Operation Procedure 標準操作手冊2. WI – Working Instruction 作業(yè)指導(dǎo)書3. PM – Preventive Maintenance 預(yù)防性維護4. FMEA Failure Mode Effect Analysis 失效模式影響分析5. SPC Statistical Process Control 統(tǒng)計制程控制6. DOE Design Of Experiment 工程試驗
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