《微機(jī)電系統(tǒng)》ppt課件(文件)
【正文】 ??? tABAdBA422) Deposition (no chemical reaction on surface) Vacuum chambers are needed + thin film deposition Al, Au, Cr 3) Sputtering A momentumexchange process (not heating) Low temperature process We can sputter anything onto substrate theoretically 4)CVD (Chemical Vapor Deposition) (1) ( 300~500176。 C, 4hr) Wet oxidation: ( 800176。CHAPTER 2. Micro fabrication technology 1. Semiconductor industry and MEMS materials. 1) Introduction to modern Semiconductor industry Semiconductor industry is playing more and more important role in modern society. We can say, no semiconductor industry, no modern civilization! 2) Commonly used MEMS materials Category Material Property or application Metal Au,Al,Cu,Ni,Cr Conductor Semiconductor Silicon Structure, semiconductor Polycrystalline silicon Structure, semiconductor Singlecrystalline silicon Structure, Anisotropic etch properties GaAs Structure, optical properties Quartz Crystalline SiO2 Substrate, structures Polymer ParyleneC Nafion Polymeric materials Nonmetals Diamond(C) structure 3) Crystal structure of Silicon 4) Crystal planes 5) Types of silicon wafer ① Geometric representation of crystal Si Definition: ―( )‖ specific plane ―{ }‖ equivalent plane ―[ ]‖ specific direction ― ‖ equivalent direction ② Wafers are classified as how they are dop
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