微機電系統(tǒng)ppt課件-wenkub.com
2025-04-30 23:16 本頁面
【正文】 C ) 5um~50um polySi 2224 2HS iOOS iH ???P o ly S iS iH ?424334 12HNSi4 NH3 S i H ???LPCVD（低壓 CVD） P102 Pa PECVD (等離子增強 CVD) 5)Electroplating Another way to add thin film on surface. Coating of an object with a thin layer of metal by use of electricity. A classical method to ―grow‖ metal onto surface Typical materials used for plating: Cu, Au, Ag, Cr Thickness 100um 7. Micro Fabrication Technologies （一） Surface micromachining （二） Bulk micromachining concept for Bulk Micromachining 1) Selectivity—A process is selectivity if it etches the desired direction at a higher rate and all other surface at a lower rate. 2) Isotropic Same etching rate at all directions. 3) Anisotropic– direction selected 4) Wet etching This is the simplest etching technology. All it requires is a container with a liquid solution that will dissolve the material in question. Isotropic enchants (HNA):HF,HNO3,CH3COOH Anisotropic enchants: KOH, EDP, TMAH 176。 C ) Typically CVD films are ~2um thickness in MEMS use. (2) (700176。 C~1200176。 F) If we need to maintain a ―clean‖ environment, we need to pay a lot of cost. Definition of cleanroom class: number of particles of size of air. 100class, 10class 31/ ftum3. XRay lithography A type of light lithography techniques using short wavelength XRays Pros ? Fast p
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