【正文】 Exit C5 Activity C5 Entry C6 Exit C6 Activity C6 Entry Time Detail Activities ?Subject ?Scope ?Definition ?Procedure ?…. Activities Definition Record amp。 PreLoad WIH/WPH/WZS/WKS MRS Check Service Cost Estimate Simulation Design Peer Review Lessons Learned Availability Develop Plan Launch FAI amp。 Responsibility Function Responsibility PD (Production) PD has to work with PE, PME and IE respectively to get testing equipment amp。D轄下所屬之測(cè)試單位人員 ,主要負(fù)責(zé)各項(xiàng)產(chǎn)品之測(cè)試 ,諸如COMPATIBILITY TEST, SOFTWARE TEST, S/W PRELOAD TEST, DIAGNOSTIC PROGRAM TEST ,ETC., CE/Reliability 組件承認(rèn)測(cè)試 、 不良品故障分析及其他附件等材料品質(zhì)之管制及保證 產(chǎn)品相關(guān)之可靠度與環(huán)境實(shí)驗(yàn) ， 以及可靠度工程之研究與制定 . PCB PCB Layout之申請(qǐng)、 PCB之設(shè)計(jì)、 Orcad library amp。D 人員負(fù)責(zé)產(chǎn)品之開發(fā)、設(shè)計(jì)、測(cè)試規(guī)劃，包括 H/W、 S/W及 ID的開發(fā)、設(shè)計(jì)、提出新發(fā)明及著作權(quán)揭露書 . Wistron Case Role amp。D RELEASE 開發(fā)階段 BOM CHANGE NOTICE. Ramp。 Responsibility (Ramp。R) ? Process – Cx Stage: ? C0: Proposal phase 構(gòu)想階段 ? C1: Planning phase 規(guī)劃階段 ? C2: Ramp。D Ramp。 Responsibility Function Responsibility HW (Hardware Design) * Hardware is responsible for Electronic Engineering Design * Coworks with S/W and QT to make sure that the every function works well according to spec. * H/W should conduct technical transfer to PE. * H/W should input, update, and maintain the bugs/issues information in the bug tracking system. SW (Software Design) * Software is responsible for the design of BIOS, Driver, Utilities, and S/W Preload. * S/W coworks with H/W and QT to make sure that every function works well according to the specification. * S/W has to release the SCD and the Cert. Team Document. * S/W should conduct technical transfer to TE. * S/W has to input/update/maintain the bugs/issues information in the bug tracking system. ID/ME (Industrial Design/ Mechanical Engineering) * ID/ME is responsible for Mechanical Engineering, Thermal and Packing designs. * ID/ME should conduct technical transfer to PME. * ID/ME should input, update, and maintain the bugs/issues information in the bug tracking system used. Wistron Case Role amp。 Mentor library的建立與管理 . 信號(hào)品質(zhì) CAE分析 , PCB layout外包廠商之管理， PCB製造廠商之管理 . OS Certification 執(zhí)行公司各產(chǎn)品之 OS 相容性認(rèn)證測(cè)試及 LOGO 申請(qǐng) . . Beta Site 測(cè)試 PDM 料號(hào)編碼及控管 ,BOM製作 Wistron Case Role amp。 tools, assembly tools, and SOP ready before C5 Exit. PD is responsible to produce the product. PD is not just for efficiency only but also quality. PSE (Process Engineer) PSE is responsible for SMT process and for releasing the SMT pilot run report. PSE is also responsible for the process continuous improvement (CIP). FAE (Failure Analysis Engineer) or RE FAE is responsible for issuing the failure analysis report and forwarding this to related departments for product quality improvement. FAE is also responsible for preparing repair SOP if applicable. TE TE is responsible for providing and maintaining Test Plan and Test Program. TE also implement all the preload to production line and report the problems related to preload to preload team. PMC/GPMC (Plan Material Control/ Global Plan Material Control) GPMC/PMC is responsible for product fulfillment, final shipping model, supply site and capacity plan, and ramp up plan for all sites. Wistron Case Wistron CSystem Quality Control Proposal Phase Planning Phase Ramp。 SPC MTBF Demo CIP/CLCA Pareto Analysis EWG Ready AFR Test Reports PreQVL Ready Diagnostics Program Bug List amp。 Report Format Definition Escalation Rule Measurement Standard Project Management amp。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C0 Checklist ?MRS C0/PM C0 Meeting 階段 C0構(gòu)想階段 (Proposal Phase) 負(fù)責(zé)單位 計(jì)畫經(jīng)理 (Project Manager) 或產(chǎn)品經(jīng)理 (Product Manager) 目的 * 確訂提案構(gòu)想或市場(chǎng)需求規(guī)格書 (MRS) * 可行性分析 工作重點(diǎn) * 相關(guān)提案之市場(chǎng)資料搜集 * 相關(guān)提案之關(guān)鍵技術(shù)資料搜集 * Ramp。 jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C1 checklist ?Invention disclosure ?Time