【正文】 主 機(jī) 板 SMT DIP 零 件 組 裝外 觀 檢 驗(yàn) 規(guī) 範(fàn)The Visual Inspection Specification for SMT DIP Assembly on M/B前 言 PAGE 1前 言 PAGE 2前 言 PAGE 3前 言 PAGE 4前 言 PAGE 5PCB對(duì)角長(zhǎng)度 L板翹標(biāo)準(zhǔn) : H / L *100%= / 1000H 郵票孔 : CPU或 VGA卡類之二 聯(lián)板或 4 聯(lián)板 ,在折板時(shí)產(chǎn)生郵票孔必須與板邊齊平 , 不得有毛邊存在。 零件匹配性 : SMT與 DIP零件組裝 ,一片主機(jī)板限用同一種廠牌 ,不得一片主機(jī)版匹配 組裝多種廠牌零件 (二種或二種以上 )在同一塊主機(jī)板上。 前 言 PAGE 6理想狀況 (TARGET CONDITION) 允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT) 戴防靜電手套。 antistatic ring and glove before hold a M/B. hold the M/B side to inspect. 無(wú)戴防靜電手套。 (PS:不得碰觸金手指 ) antistatic ring but no antistatic glove is prepared.2. To hold the M/B side to inspect. (Don’t touch gold finger) 施 ,並直接接觸機(jī)板焊錫 面與零件面 is no antistatic action is prepared. contacts M/B and ponent directly.理想狀況 (TARGET CONDITION) SMT1 零件組裝標(biāo)準(zhǔn) — (次缺 Minor)零件橫向超出焊墊以外，但尚未大於其零件寬度的 50% 。零件已橫向超出焊墊，大於零件寬度的 50% 。SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)Component is excess the area ofsolder pads, but the “P” is lessthan 50% of ponent width .330 上視圖 側(cè)視圖WCP零件恰能座落在焊墊 的中央且未發(fā)生偏出，所 有各金屬封頭都能完全與 焊墊接觸。Compo is over solder pad and “P” is over 50% of ponent’s width允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)330≦ 1/2W ≦ 1/2W 零件歪斜P P拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)3301/2W 1/2W 零件歪斜PP330330CP ponent is at the solderpads’ center and ponentcontamination can contact solderpads fully. PAGE 1PS :Samsung SPEC ≦ 1/10WPS :Samsung SPEC 1/10WSMT2 零件組裝標(biāo)準(zhǔn) — (主缺 Major)拒收狀況 (NONCONFORMING DEFECT)SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)金屬封頭縱向滑出焊墊， 但仍蓋住焊墊330 上視圖 側(cè)視圖W理想狀況 (TARGET CONDITION) CP零件恰能座落在焊墊 的中央且未發(fā)生偏出，所 有各金屬封頭都能完全與 焊墊接觸。CP ponent is at the solderpads’ center and ponentcontamination can contact solderpads fully. 允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)偏移方向偏移方向 偏移圖End of overhang is permitted 偏移圖 金屬封頭縱向滑出焊墊End of overhang is not permittedPAGE 2330330SMT3 零件組裝標(biāo)準(zhǔn) — (次缺 Minor) PAGE 3SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)組件端寬 (短邊 )突出焊墊端部份是組件端直徑 25% 以下 (≦1/4D) 。組件端寬 (短邊 )突出焊墊端 部 份超過(guò)組件端直徑 25%(1/4D)See Fig32 34, the P measureis over 1/4 D.理想狀況 (TARGET CONDITION) 允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION) 上視圖 側(cè)視圖DTP≦ 1/4D 上視圖 上視圖拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)CP零件恰能座落在焊墊 的中央且未發(fā)生偏出，且接觸點(diǎn)在焊墊中心。The contact point between solderpad and ponent should be atthe center point of padSee Fig32 33, the P measureshould be within 1/4 diameter ofponent.P1/4DSMT4 零件組裝標(biāo)準(zhǔn) QFP零件腳面之對(duì)準(zhǔn)度 (次缺 Minor) SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)理想狀況 (TARGET CONDITION) W W允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)P ≦ 1/4W 各接腳都能座落在各焊墊的中央，而未發(fā)生偏 滑。The flat bottom of ponent leadsare deposited on the center of padand no shift is occurred.各接腳已發(fā)生偏滑，所偏出焊墊以外的接腳，尚未超過(guò)接腳本身寬度的 1/4W 。The “P” measure is within 1/4 ofleads’ width.拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)P 1/4W 各接腳已發(fā)生偏滑，所偏出焊墊以外的接腳，已超過(guò)接腳本身寬度的 1/4W 。The “P” measure is greater than 1/4of leads’ width.偏移方向PAGE 4SMT5 零件組裝標(biāo)準(zhǔn) QFP零件腳趾之對(duì)準(zhǔn)度 (次缺 Minor)SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)W理想狀況 (TARGET CONDITION) 允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)偏移方向拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)偏移方向各接腳都能座落在各焊墊的中央，而未發(fā)生偏 滑。The flat bottom of ponent leads are located on the center of pad and no shift is occurred.各接腳已發(fā)生偏滑，所偏出焊墊以外的接腳，尚未超過(guò)焊墊外緣。Component is shift but no overhangis occurred.各接腳已發(fā)生偏滑，所偏出焊墊以外的接腳，已超過(guò)焊墊外緣。Component is shift and overhang isoccurred.PAGE 5SMT6 零件組裝標(biāo)準(zhǔn) QFP零件腳跟之對(duì)準(zhǔn)度 (次缺 Minor) SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)理想狀況 (TARGET CONDITION) 允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)接腳沒(méi)有超過(guò)焊墊 (No overhang)各接腳都能座落在各焊墊的中央，而未發(fā)生偏滑。The flat bottom of ponent leadsare deposited on the center of padand no shift is occurred.各接腳已發(fā)生偏滑，但 接腳沒(méi)有超過(guò)焊墊 。No overhang接腳超過(guò)焊墊 (Overhang)各接腳已發(fā)生偏滑，且 接腳已超過(guò)焊墊 。OverhangPAGE 6SMT17 零件組裝標(biāo)準(zhǔn) J型腳零件對(duì)準(zhǔn)度 (次缺 Minor) SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)各接腳都能座落在各焊墊的中央，而未發(fā)生偏滑。The flat bottom of ponent leadsare deposited on the center of padand no shift is occurred.理想狀況 (TARGET CONDITION) 允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)≦ 1/2W 拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)1/2W 各接腳偏出焊墊以外尚未超出腳寬的 50% 。Overhang is occurred, but the flatbottom of ponent leads arewithin 1/2 width of leads.各接腳偏出焊墊以外尚未超出腳寬的 50% 。Overhang is occurred, but the flatbottom of ponent leads arewithin 1/2 width of leads.PAGE 7CP 零件浮高允收狀況SMT8 零件組裝標(biāo)準(zhǔn) QFP浮件允收狀況 (主缺 Major) 足夠的錫將錫墊焊住J 型腳零件浮高允收標(biāo)準(zhǔn) SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)QFP 浮高允收標(biāo)準(zhǔn)SolderPCB足夠的錫將錫墊焊住Must have sufficient solder to form a properly wetted fillet 足夠的錫將錫墊焊住Must have sufficient solder to form a properly wetted filletMust have sufficient solder to form a properly wetted filletPAGE 8SMT19 焊點(diǎn)性標(biāo)準(zhǔn) QFP腳面焊點(diǎn)最小量 (主缺 Major) 面銲錫帶。 錫、金屬外露SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)理想狀況 (TARGET CONDITION) 允收標(biāo)準(zhǔn) (ACCEPT