【正文】 。3. 零件腳未折腳與短路。 is mounted on M/B closely. line match to PCB closely. 浮高傾斜 ≦ 零件。Component is mounted on M/B closely and no floating phenomenon..、浮高高度小於 內(nèi) 。 PCB板 邊邊緣。 P is greater than 189。 ( Lh,Wh≦) is less than . is less than .1. 浮高、傾斜大於 ，判定 拒收。Bent pin or lead does not be inserted into hole.1. 應(yīng)有之零件腳出焊錫面，無(wú)零 件腳之折腳、未入孔、未出孔 或零件腳短、缺零件腳等缺點(diǎn) 判定允收。 damage on Component body on surface of ponent is clear.1. 零件本體不能破裂，內(nèi)部金 屬元件無(wú)外露。 package is broken. damage is on IC lead.理想狀況 (TARGET CONDITION)拒收狀況 (NONCONFORMING DEFECT)DIP217 焊錫性標(biāo)準(zhǔn) 焊錫性其它標(biāo)準(zhǔn) 1 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)沾錫角≦ 90度 + +(沾錫角 )沾錫角 90度DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 17可目視見(jiàn)孔填錫，錫墊上已達(dá) 75% 孔內(nèi)填錫無(wú)法目視見(jiàn)孔填錫，錫墊上未達(dá) 75% 孔內(nèi)填錫焊錫觸及零漸本體1. 完全被焊點(diǎn)覆蓋。5. 焊錫不超越過(guò)錫墊邊緣與觸 及零件或 PCB板面。There is no short phenomenon between leads. 錫裂1. 因不適當(dāng)之外力或不銳利之修 整工具，造成零件腳與焊錫面 產(chǎn)生裂紋，影響焊錫性與電氣 特性之可靠度時(shí)，判定拒收。 (DIMM底座有突塊 )5. 零件腳未折腳與短路 is less than . is less than .3. LH is less .(forDIMM stand off)4. WH is less .(for DIMM stand off) bent pin or short phenomenon for ponent1. 浮高高於 。DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn)理想狀況 (TARGET CONDITION) 允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)No solder ball, residue or solder spike remain on M/B 不易被剝除者 L≦ 10mil 可被剝除者 D≦ 5mil or 面積 ≦ 600mm2 ,數(shù)目 5個(gè)D L 不易被剝除者 L ＞ 10mil 可被剝除者 D ＞ 5mil or 面積 ≦ 600mm2 ,數(shù)目超過(guò) 5個(gè)D L1. Solder ball’s diameter or length of solder residue must be less than 5mil.2. The quantity which solder residue’s surface area is more than 600mm2 must be less than 5.PAGE 22理想狀況 (TARGET CONDITION)DIP223 零件組裝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (JUMPER PINS)剪 PIN規(guī)定 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 231. PIN被 剪平 ,無(wú)任何毛邊 is no bur1. PIN針未剪平 ,其高度 小等於 ，判定允收。 (電容 底座有突塊 )5. 零件腳未折腳與短路 is less than . is less than .3. LH is less than .(for Cap stand off)4. WH is less .(for Cap stand off) bent pin or short phenomenon for ponent1. 浮高高於 。 。 P is over than of pin.理想狀況 (TARGET CONDITION)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 24DIP224 零件組裝標(biāo)準(zhǔn) ﹝ 電解電容 ﹞ 浮件、傾斜 (次缺 Minor)1. 零件平貼於機(jī)板表面。 。There solder residue contact two leads at the same time.PCB短路理想狀況 (TARGET CONDITION)DIP220 零件組裝標(biāo)準(zhǔn) ﹝ DIMM,SIMM,PCI CONNECTOR ﹞ 浮件、傾斜 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)拒收狀況 (NONCONFORMING DEFECT)Lh、 Wh≦DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 20PCBDIMM CONNECTORDIMM CONNECTORLh、 Wh≦Lh、 Wh Lh、 Wh1. 零件平貼於機(jī)板表面。 angle is less than 90o. doesn’t contact body. 75% is covered by solder in PTH and no solder spike.1. 沾錫角度大於 90度。3. 無(wú)冷焊現(xiàn)象或其表面光亮。 nick on ponent body but package is not broken. materials of ponent is not exposed on air.1. 零件本體破裂，內(nèi)部金屬元件 外露，絕緣外皮已破損判定拒 收。 插於腳座時(shí)不得浮高Component lead protrude over solder.理想狀況 (TARGET CONDITION)拒收狀況 (NONCONFORMING DEFECT)DIP214 零件組裝標(biāo)準(zhǔn) 零件腳與線路間距 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)≧ ( 4 mil ) ( 4 mil )DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 141. 零件如需彎腳方向應(yīng)與所在位 置 PCB線路平行。 is greater than . is greater than .PCB理想狀況 (TARGET CONDITION)DIP212 零件組裝標(biāo)準(zhǔn) K/B JACK 、 POWER 零件浮件與傾斜 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)浮高 .傾斜 Lh .Wh ≦ mm 拒收狀況 (NONCONFORMING DEFECT)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 12POWER CONNPOWER CONN浮高 .傾斜 Lh .Wh mm POWER CONNK/B JACKK/B JACKK/B JACK1. K/B JACK與 POWER SET 平 貼於 PCB零件面。2. PIN表面光亮電鍍良好、無(wú)毛 邊扭曲不良現(xiàn)象。 . Wh over than . isn’t protruded over solder. tilt pin can’t over the PCB edge or contact other ponent.PCB理想狀況 (TARGET CONDITION)DIP29 零件組裝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 ﹝ JUMPER PINS﹞ 組裝性 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 91. PIN排列直立2. 無(wú) PIN歪與變形不良。 ( Lh .Wh 0. 5mm )2. 錫面零件腳未出孔判定拒收。 is over than . line isn’t fixed on ponent.理想狀況 (TARGET CONDITION)DIP26 零件組裝標(biāo)準(zhǔn) ﹝ CONNECTOR 、 HEATSINK﹞ 浮件、傾斜 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)拒收狀況 (NONCONFORMING DEFECT)Lh、 Wh Lh、 Wh ≦DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 61. 機(jī)構(gòu)零件基座平貼 PCB零件面 ，無(wú)浮高傾斜。 is over than . is over than isn’t protruded over solder.PCB最佳狀況 (TARGET CONDITION)DIP24 零件組裝標(biāo)準(zhǔn) 直立 電子零組件浮件、傾斜 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)Lh ≦ mm拒收狀況 (NONCONFORMING DEFECT)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 41500μF 10V1500μF 10VLh mm1500μF 10V。 PIN Lmax 零件腳 最長(zhǎng)長(zhǎng)度 、未入孔、未出 孔、缺件等缺點(diǎn)，判定拒收1. Dimension L is over than 2. Kink bost PIN L is over then PCBKink腳 。SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)理想狀況 (TARGET CONDITION) 允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)No solder ball, residue or solder spike remain on M/B 不易被剝除者 L≦ 10mil 可被剝除者 D≦ 5mil or 面積 ≦ 600mm2 ,數(shù)目 5個(gè)D L1. Solder ball’s diameter or length of solder residue must be less than 5mil.2. The quantity which solder residue’s surface area is more than 600mm2 must be less than 5..PAGE 17SMT118 零件組裝標(biāo)準(zhǔn) R