【正文】 2. 傾斜低於 。2. 傾斜低於 。 cover all pad and luminous. solder residue. 90度。2. 需彎腳零件腳之尾端和相鄰 其它導(dǎo)體短路，判定拒收。 is bur or poor plating phenomenon on pin surface. is deformed or bent. PCB理想狀況 (TARGET CONDITION)DIP211 零件組裝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 ﹝ CPU SOCKET﹞ 浮件與傾斜 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)浮高 Lh浮高 Lh 浮高 Lh傾斜 Wh ≦ 浮件 Lh≦ 拒收狀況 (NONCONFORMING DEFECT)浮高 Lh 浮高 Lh傾斜 Wh 浮件 LhDIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 11Socket 7Socket 7Socket 7Socket 7Socket 71. 浮高與傾斜之判定量測(cè)應(yīng)以 PCB零件面與零件基座之最低 點(diǎn)為判定量測(cè)距離依據(jù)。 is mounted on M/B closely. tilt or floating phenomenon.1. 浮高、傾斜小於 。2. 錫面零件腳折腳未出孔或零件 腳短路判定拒收。 ﹝ 缺件 ﹞ specification can’t be matched to BOM. is inserted on wrong position. polarity (direction) is missing.理想狀況 (TARGET CONDITION)DIP22 零件組裝標(biāo)準(zhǔn) 零件腳長(zhǎng)度標(biāo)準(zhǔn) (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)Lmin :零件腳出錫面Lmax ~LminLmax :L≦ mm拒收狀況 (NONCONFORMING DEFECT)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 2一般零件腳 L Lmax ~Lmin零件腳沒有露出錫面1. 插件之零件焊錫後無短路 可目視零件腳出錫 面1. The Solder side not short2. Lead is protruded over solder. 長(zhǎng)度下限標(biāo)準(zhǔn)，為可目 視零件腳出錫面為基準(zhǔn)， Lmax 零件腳最長(zhǎng)長(zhǎng)度低於 。The height of wetting solder must be greater than 1/2 of lead’s thickness.接腳前端的焊錫帶延伸到引線上,且超過腳厚 1/2 (H ≧ 1/2T )。組件端寬 (短邊 )突出焊墊端 部 份超過組件端直徑 25%(1/4D)See Fig32 34, the P measureis over 1/4 D.理想狀況 (TARGET CONDITION) 允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION) 上視圖 側(cè)視圖DTP≦ 1/4D 上視圖 上視圖拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)CP零件恰能座落在焊墊 的中央且未發(fā)生偏出，且接觸點(diǎn)在焊墊中心。SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)Component is excess the area ofsolder pads, but the “P” is lessthan 50% of ponent width .330 上視圖 側(cè)視圖WCP零件恰能座落在焊墊 的中央且未發(fā)生偏出，所 有各金屬封頭都能完全與 焊墊接觸。Overhang is occurred, but the flatbottom of ponent leads arewithin 1/2 width of leads.PAGE 7CP 零件浮高允收狀況SMT8 零件組裝標(biāo)準(zhǔn) QFP浮件允收狀況 (主缺 Major) 足夠的錫將錫墊焊住J 型腳零件浮高允收標(biāo)準(zhǔn) SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)QFP 浮高允收標(biāo)準(zhǔn)SolderPCB足夠的錫將錫墊焊住Must have sufficient solder to form a properly wetted fillet 足夠的錫將錫墊焊住Must have sufficient solder to form a properly wetted filletMust have sufficient solder to form a properly wetted filletPAGE 8SMT19 焊點(diǎn)性標(biāo)準(zhǔn) QFP腳面焊點(diǎn)最小量 (主缺 Major) 面銲錫帶。1. Dewetting wetting, solder dosen’t cover around of lead.2. The solder height which cover lead is less than 189。SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)理想狀況 (TARGET CONDITION) 允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)No solder ball, residue or solder spike remain on M/B 不易被剝除者 L≦ 10mil 可被剝除者 D≦ 5mil or 面積 ≦ 600mm2 ,數(shù)目 5個(gè)D L1. Solder ball’s diameter or length of solder residue must be less than 5mil.2. The quantity which solder residue’s surface area is more than 600mm2 must be less than 5..PAGE 17SMT118 零件組裝標(biāo)準(zhǔn) Regulator功率電晶體 對(duì)準(zhǔn)度 (主缺 Major) SMT 外 觀 檢 驗(yàn) 規(guī) 範(fàn)理想狀況 (TARGET CONDITION) PAGE 18拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)Regular 的中央且未偏移 body at the center of padRegular , 但未超出 Layout白線 body is out of pad but inside of white line areaRegular Layout 白線 body is out white line areaDIP21 零件組裝標(biāo)準(zhǔn) 零件組裝之方向與極性 (主缺 Major) + C1 Q1 D2PAGE 1拒收狀況 (NONCONFORMING DEFECT) C1 + D2Q1DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn)允收狀況 (ACCEPTABLE CONDITION) ++ 1. 零件正確組裝於兩錫墊中央。 is over than . is over than isn’t protruded over solder.PCB最佳狀況 (TARGET CONDITION)DIP24 零件組裝標(biāo)準(zhǔn) 直立 電子零組件浮件、傾斜 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)Lh ≦ mm拒收狀況 (NONCONFORMING DEFECT)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 41500μF 10V1500μF 10VLh mm1500μF 10V。 ( Lh .Wh 0. 5mm )2. 錫面零件腳未出孔判定拒收。2. PIN表面光亮電鍍良好、無毛 邊扭曲不良現(xiàn)象。 插於腳座時(shí)不得浮高Component lead protrude over solder.理想狀況 (TARGET CONDITION)拒收狀況 (NONCONFORMING DEFECT)DIP214 零件組裝標(biāo)準(zhǔn) 零件腳與線路間距 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)≧ ( 4 mil ) ( 4 mil )DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 141. 零件如需彎腳方向應(yīng)與所在位 置 PCB線路平行。3. 無冷焊現(xiàn)象或其表面光亮。There solder residue contact two leads at the same time.PCB短路理想狀況 (TARGET CONDITION)DIP220 零件組裝標(biāo)準(zhǔn) ﹝ DIMM,SIMM,PCI CONNECTOR ﹞ 浮件、傾斜 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)拒收狀況 (NONCONFORMING DEFECT)Lh、 Wh≦DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 20PCBDIMM CONNECTORDIMM CONNECTORLh、 Wh≦Lh、 Wh Lh、 Wh1. 零件平貼於機(jī)板表面。 P is over than of pin.理想狀況 (TARGET CONDITION)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 24DIP224 零件組裝標(biāo)準(zhǔn) ﹝ 電解電容 ﹞ 浮件、傾斜 (次缺 Minor)1. 零件平貼於機(jī)板表面。 (電容 底座有突塊 )5. 零件腳未折腳與短路 is less than . is less than .3. LH is less than .(for Cap stand off)4. WH is less .(for Cap stand off) bent pin or short phenomenon for ponent1. 浮高高於 。 (DIMM底座有突塊 )5. 零件腳未折腳與短路 is less than . is less than .3. LH is less .(forDIMM stand off)4. WH is less .(for DIMM stand off) bent pin or short phenomenon for ponent1. 浮高高於 。5. 焊錫不超越過錫墊邊緣與觸 及零件或 PCB板面。 damage on Component body on surfac