【正文】 畢業(yè)設(shè)計（論文） 專 業(yè) 班 次 姓 名 指導(dǎo)老師 成都信息工程學(xué)院 二 零零九 年 六 月成都信息工程學(xué)院 光電學(xué)院畢業(yè)論文設(shè)計設(shè)計 2 集成電路封裝工藝 摘 要 集成電路封裝的目的 ,在于保護芯片不受或少受外界環(huán)境的影響 ,并為之提供一個發(fā)揮集成電路 芯片功能的良好環(huán)境 ,以使之穩(wěn)定 ,可靠 ,正常的完成電路功能 .但是集成電路芯片封裝只能限制而不能提高芯片的功能 . 了解了以上內(nèi)容，或許你大概還不是很清楚什么是封裝技術(shù) 。那么 芯片封裝技術(shù) 又是什么呢？讓我們來看下面的內(nèi)容。 集成電路芯片封裝是指利 用膜技術(shù)及微細(xì)連接技術(shù)，將芯片及其它要素在框架或基板上布置、粘貼固定及連接，引出接線端子并通過可塑性絕緣介質(zhì)灌封固定，構(gòu)成整體立體結(jié)構(gòu)的工藝。此概念稱為狹義的封裝。在更廣的意義上講的“封裝”是指封裝工程，是將封裝體與基板連接固定，裝配成完整的系統(tǒng)或電子機械設(shè)備，并確保整個系統(tǒng)綜合性能的工程。上面兩層封裝的含義結(jié)合起來，構(gòu)成了廣義的封裝概念。將基板技術(shù)、芯片封裝體、分立器件等全部要素，按電子設(shè)備整機要求進行連接和裝配，實現(xiàn)電子的、物理的功能，使之轉(zhuǎn)變?yōu)檫m用于機械或系統(tǒng)的形式，成為整機裝置或設(shè)備的工程稱為電子封 裝工程。 本文介紹了封裝測試工藝流程 ,詳細(xì)介紹了 CTL工藝流程及操作 ,為封裝測試工藝提供了參考 . 關(guān)鍵詞 : 芯片 封裝測試 Abstract The purpose of IC package, is to protect the chip from the outside or less environmental impact, and provide a functional integrated circuit chip to play a good environment to make it stable and reliable, the pletion of the normal circuit functions. However, IC chip package and not only restricted to enhance the function of the chip. Understanding of the content of the above, perhaps you do not is very clear about what the packaging technology. Chip packaging technology then what is? Let us look at the contents of the following. IC chip package refers to the use of membrane technology and microconnection technology, chips and other elements in the framework or substrate layout, paste fixed and connected to lead terminals through the plastic encapsulating dielectric constant, which constitute threedimensional structure of the overall 成都信息工程學(xué)院 光電學(xué)院畢業(yè)論文設(shè)計設(shè)計 3 process . The concept of the package known as the narrow sense. In the broader sense of the package means packaging engineering, package body is connected with a fixed substrate, the assembly into a plete system or electronic machinery and equipment, and to ensure that the integrated performance of the whole system works. The meaning of the above twotier package together constitute a generalized concept of the package. The substrate technology, chip packaging body, all of the elements such as discrete devices, in accordance with the requirements of electronic equipment to connect and the whole assembly, electronic and physical features, making it into the application or system in the form of machinery, as a whole unit or equipment referred to as electronic packaging engineering works. In this paper, packaging and testing process, detailed information on CTL process and operation for packaging and testing technology to provide a reference. Keywords: chip packaging and testing 成都信息工程學(xué)院 光電學(xué)院畢業(yè)論文設(shè)計設(shè)計 4 目 錄 第一章 近代芯片生產(chǎn)工藝技術(shù)的發(fā)展 集成電路在我國的發(fā)展概況 ............................................................................. 5 微電子產(chǎn)業(yè)的發(fā)展方向 ..................................................................................... 5 我國集成電路的發(fā)展 .......................................................................................... 6 第二章 集成電路芯片制作基本工藝流程簡介 ........................................................... 10 封裝的概念 ....................................................................................................... 10 芯片封裝的分類 ............................................................................................... 10 芯片生產(chǎn)工藝流程 ........................................................................................... 12 封裝的可靠性 .................................................................................................... 13 先進的封裝技術(shù) ................................................................................................. 14 第三章 CPU芯片的封裝工藝流程 ................................................................................ 17 CPU 封裝與測試概述 ....................................................................................... 17 CPU 測試的基本流程 ....................................................................................... 17 第四章 CTL工藝流程介紹 .......................................................................................... 18 CTL 工藝流程 .................................................................................................. 18 CTL 所使用的設(shè)備 ........................................................................................... 19 所需設(shè)備 |物料 .................................................................................................. 20 一般安全準(zhǔn)則 ................................................................................................... 21 啟動設(shè)備 ........................................................................................................... 25 熱停機 ............................................................................................................. 26 緊急停機 … ...................................................................................................... .26 開始生產(chǎn) ........................................................................................................... 27 批次結(jié)束 ........................................................................................................... 28 介紹及操作 ....................................................................................... 28 工藝 目的 … ..................................................................................................... 30 TMT1214 安全 準(zhǔn)則 .......................................................................................... 30 準(zhǔn)備程序 …… ................................................................................................. 32 開始生產(chǎn) ......................................................................................................... 32 第五章 TMT1214CTL 常見的問題及處理辦法 ........................................................ 35 致謝 ......