cb印刷電路板制程介紹-閱讀頁
2025-05-14 03:38本頁面
【正文】 eet 27 膜 銅 (堿性蝕刻 ) PCB Engineering Report Sheet 28 (液狀綠漆 ) PCB Engineering Report Sheet 29 22. 光源 S/M A/W PCB Engineering Report Sheet 30 (浸金 …… ) R105 WWEI 94V0 R105 WWEI 94V0 PCB Engineering Report Sheet 31 光分解反應(yīng) (正性工作 )→ 底片 ,STENCIL(網(wǎng)版 ) PCB Engineering Report Sheet 32 光聚合反應(yīng) (負性工作 )→ 底片 ,STENCIL(網(wǎng)版 ) PCB Engineering Report Sheet 33 BURIED VIA LAYUP A = THROUGH VIA HOLE (導(dǎo)通孔 ) B = BURIED VIA HOLE (埋孔 ) C = BLIND VIA HOLE (盲孔 ) D = BLIND HOLE MLB VIA (多層盲孔 ) BLIND VIA LAYUP BLIND VIA SEQUENTIAL LAYUP A B B A C C A RESIN BSTAGE BLIND AND BURIED VIA OPTION (盲 埋 孔 之 選 擇 ) D PCB Engineering Report Sheet 34 6 – Spindle Drilling Machine PCB Engineering Report Sheet 35 Black Hole Line Desmear PCB Engineering Report Sheet 36 Dry Film Laminator Automatic Exposure Machine PCB Engineering Report Sheet 37 Pattern Plating Line PCB Engineering Report Sheet 38 Etching Line PCB Engineering Report Sheet 39 Automatic S/M Printing Line Automatic Exposure Machine PCB Engineering Report Sheet 40 Post Cure Line Automatic Legend Printing Line PCB Engineering Report Sheet 41 Solder Leveling Machine O/S Tester The End
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