【正文】 L AND EXTERNAL LAYERS. ※ PLATO IS BUILDING VOLUME PRODUCTION WITH .005/.005 ON THE EXTERNAL AYERS. Design for Manufacture P 29 SINGLE PLY LAMINATE/PREPREG CONSTRUCTION TECHNICAL/COST/RELIABILITY ADVANTAGES (1) * SINGLE PLY CONSTRUCTION REDUCES BOARD COST * REDUCES ZAXIS EXPANSION DUE TO LOWER OVERALL RESIN CONTENT. (IMPROVED THERMAL RELIABILITY) * IMPROVED CONTROLLED IMPEDANCE CAPABILITY DUE TO REDUCED THICKNESS VARIATION. * REDUCED WARP AND TWISTDUE TO MORE HOMOGENOUS FABRIC STYLES. Design for Manufacture P 30 SINGLE PLY LAMINATE/PREPREG CONSTRUCTION TECHNICAL/COST/RELIABILITY ADVANTAGES (2) * THINNER DIELECTRIC THICKNESS AND OVERALL BOARD THICKNESS ARE OBTAINABLE. * INCREASE SIMPLICITY OF THE BOARD CONSTRUCTION. (REDUCE ERRORS IN LAYUP) * IMPROVED DIMENSIONAL STABILITY OF FINISHED PCBS DUE TO MORE HOMOGENOUS FABRIC CONSTRUCTION. Design for Manufacture P 31 HOLE SIZE AND DENSITY (1) THE RELATIONSHIP OF BOARD THICKNESS TO HOLE SIZE IS CALLED THE ASPECT RATIO. THE HIGHER THE ASPECT RATIO THE HIGHER THE POTENTIAL COST TO MANUFACTURE THE BOARD. HOLE SIZE DETERMINES THE NUMBER OF PANELS THAT CAN BE STACKED FOR THE PURPOSE OF DRILLING. CONSEQUENTLY, THERE IS AN INCREASE IN THE COST PER BOARD AS HOLE SIZE DECREASE. Design for Manufacture P 32 HOLE SIZE AND DENSITY (2) HOLE SIZE PANEL DEPTH ” ” GREATER 3 DEEP ” 2 DEEP OR LESS 1 DEEP * NUMBERS BASED ON STANDARD ” BOARD THICKNESS. * REDUCING FROM 3 DEEP TO 1 DEEP INCREASE COST BY APPROXIMATELY 15% * REDUCING FORM 3 DEEP TO 2 DEEP INCREASECOST BY APPROXIMATELY 45% ” GREATER 4 DEEP Design for Manufacture P 33 PAD SIZE VS. HOLE SIZE THE ANNULARS RING CALLOUT ON THE CHART DOES NOT APPLY TO REQUIREMENT AT THE JUNCTION. ALL VIA PADS SHOULD BE TEAT DROPPED AT THAT POINT CALLOUT APPLIES TO THE REMAINDER OF THE PAD. *DRILL SIZE = FINISHED SIZE + 46 mil Tang. .002 .002 PAD .012DR .010DR .008DR .008DR PAD .014DR .012DR .010DR .010DR PAD .016DR .014DR .012DR .012DR PAD .018DR .016DR .014DR .014DR PAD .020DR .018DR .016DR .016DR PAD .022DR .020DR .018DR .018DR Design for Manufacture P 34 SOLDER MASK AVAILABLE TYPES: * TAIYO PSR4000(LPI) * PLATO HAS CAPABILITY TO PLACE SOLDERMASK DAMS ON .016 AND .020” PITCH DEVICE. Design for Manufacture P 35 NOMENCLATURE ※ MOST FAB SPECS CALL FOR NO SILKSCREEN ALLOWED ON SMD PADS. ※ ACHIEVE THIS REQUIREMENT, THE LETTER CHARACTER OR LINE MUSTBE .008 MINIUM FROM SMD PAD. ※ PREFERRED LETTER WIDTH .008(DO NOT LESS THAN .006) ※ PREFERRED LETTER HEIGHT .100 ※ ABSOLUTE MINIMUM Design for Manufacture P 36 GOLD PLATING THE FOLLOWING DESIGN PARAMETERS AFFECT THE GOLD PLATING PROCESS. VIA HOLE TOO CLOSE TO THE GOLD FINGER. PLATO PREFERS TO SEE .025” MINIMUM FROM EDGE OF VIA PAD TO EDGE OF TAB FINGER. THIS ALLOWS ROOM FOR TAPING OFF THE REMAINDER OF THE BOARD PRIOR TO GOLD. IT ALSO ELIMINATES THE VIA HOLES WHICH MAY RESULT IN A DARK HOLE CONDITION. 2. GOLD THICKNESS : 30 μ (MAX.) NICKLE THICKNESS : 100μ (MIN.) Design for Manufacture P 37 .(TAPE CARRIER PACKAGE) .(TAPE AUTOMATED BONDING) TCP IS AN ASSEMBLY TECHNIQUE IN WHICH A SILICON DIE IS DIRECTLY TTACHED TO AN ETCHED FRAME THAT IS BACKED BY A POLYIMIDE TYPE OF BOARD DESIGN HAS GAINED IN POPULARITY IN PART BECAUSE OF THE FOLLOWING ADVANTAGE PITCH .25MM (.0098) PAD SIZE .005*.060 FINISHED PAD WIDTH +/ .0005(OR .0045 MIN.) SUPER SOLDER THICKNESS 800μ +/ 200μ AFTER REFLOW Design for Manufacture P 38 ENTEK WPF207 (1) DESCRIPTION: ENTEK PLUS 106A IS A WATER BASED