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MANUFACTURING SYSTEMS ENGINEERING ? 1. 超聲波基礎(chǔ)知識(shí) ? ? 3. 超聲檢測(cè)設(shè)備的參數(shù)和軟件介紹 ? 4. 超聲波成像應(yīng)用舉例 ? X射線檢測(cè) SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING 超聲波基礎(chǔ)知識(shí) SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING ULF 20 Hz Audible 20 Hz – 20 KHz SOUND Ultrasound 20 KHz 超聲的應(yīng)用:清洗 , 焊接 , 治療 , 成像和傳感 超聲波清洗和焊接: 20KHz~40KHz 超聲波成像: 5MHz Basics of Ultrasound (超聲波基礎(chǔ) ) SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING ? Ultrasound is an elastic disturbance that propagates through materials (mainly solids and liquids) at frequencies above 20 KHz. (超聲波的頻率在 20KHz以上,人不能聽到 ) ? An ultrasonic wave cannot propagate through a vacuum at any frequency or through air at frequencies above 10 MHz. (任何頻率超聲波都不能穿透真空。當(dāng)超聲波頻率大于 10MHz時(shí),也不能穿透空氣 ) ? The pressures generated at the focal spot are in the micro Joule range and are not harmful to even moderately delicate samples. ? The pulse in the acoustic microscope has very low energy in parison. (CSAM使用的超聲波的頻率和能量不會(huì)對(duì)人體和樣品有害。 ) ? The relative strength of the transmitted (T) and reflected (R) ultrasound at an interface is governed by the acoustic impedance of the materials on each side of the interface. (在界面處超聲波反射和穿過的相對(duì)強(qiáng)度是由界面兩邊物質(zhì)的聲阻抗決定的。 ) SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING M a te r i a l 1 M a te r i a l 2 R ( % ) T ( % )P l a sti c A i r 1 0 0 0C e r a m i c P l a sti c 8 2 18C o p p e r P l a sti c 8 7 131212ZZZZR???1222ZZZT??1 Material 2 Transmitted wave (穿透波 ) Reflected wave (反射波 ) Reflection Coefficient (R) (反射系數(shù) R) Transmission Coefficient (T) (穿透系數(shù) T) Ultrasound at Interfaces (界面處的超聲波 ) Z 1 Z 2 SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING Acoustic Impedance of Materials (聲阻抗值 ) ? Acoustic Impedance (Z) is the product of a materials density times its ultrasonic velocity Z = ? V ? In practical terms Acoustic Impedance is a materials characteristic property that determines the amount of reflected and transmitted energy that occurs when an ultrasonic wave encounters a boundary or interface between two materials. SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING 5 MHz 15 MHz 30 MHz 50 MHz 75 MHz 100 MHz 150 MHz 230 MHz 300 MHz Low Frequency Greater Peration High Frequency Higher Resolution Sample Back Surface Sample Surface Frequency, Resolution and Peration (頻率、分辨率和穿透力 ) SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING 1 Si Metallization 10 MHz 100 MHz 1 GHz Flip Chips Wafer Bonding BGAs Thick Film Adhesion Thin Films Plastic ICs CSP Porosity amp。 其優(yōu)點(diǎn)如下: ? Non Destructive (無損檢測(cè),非破壞性 ) ? Sensitive inspection technique for bond evaluation (對(duì)粘結(jié)層面非常敏感 ) ? Perates most materials (能穿透大多數(shù)的材料 ) ? Subsurface structures (淺表層結(jié)構(gòu)的分析 ) ? Mechanical properties (材料力學(xué)性能的檢測(cè) 非線性超聲測(cè)試 ) SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING Grain boundary structures, Textures 材料的晶格結(jié)構(gòu) Cracks 裂紋 Delamination, Adhesion, Artefact 分層缺陷、附著物以及其他夾雜物 Particles, inclusions, Precipitations 雜質(zhì)顆粒、夾雜物、沉淀物等 Voids, Holes,bubbles, 空洞、空隙、氣泡等 Detection and Application of AMI (超聲波微成像的 主要用途 ) SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING 超聲波掃描微成像工作原理 SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING CASE 1 Z2 Z1 (由軟 硬是正波 ) CASE 2 Z2 Z1 (由硬 軟是負(fù)波 ) CASE 3 Z2 = Z1 (材質(zhì)沒有變化 ) (Z2 Z1) (Z2 + Z1) R/I = 兩種物質(zhì)的聲阻抗的差異決定反射波(回聲 )的正負(fù)極性和幅值 Incident Reflected Z1 Z2 Determining Echo Polarity (確定回聲正負(fù)極性 ) SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING Large Positive Positive No Signal Negative Large Negative Symmetric Or 對(duì)稱 Amplitude Asymmetric Or 非對(duì)稱 Polarity Color Mapping (著色圖 ) SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING Ultrasound is either Reflected or Absorbed or Scattered or Blocked by flaws differently than by the surrounding material. (超聲波會(huì)被材料反射、散射、吸收或是阻擋。 linear encoders 線性驅(qū)動(dòng)系統(tǒng)和編碼器 ?X/Y/Z 工作臺(tái)和 軸系 ?快速移動(dòng)和專利平衡和防震系統(tǒng) ?探頭裝置和連接系統(tǒng) ?power supply units 供電系統(tǒng) ?electronic boards 電控系統(tǒng) ?ADC 數(shù)模轉(zhuǎn)換 ?HF electronics ?脈沖發(fā)生器 / 接收器裝置 ?A, B, C, Q, M, T, LOBE, STAR, 3D, ZIP等等多種掃描模式 Transducer 探頭 Electronics 電子控制系統(tǒng) Mechanical Parts 機(jī)械系統(tǒng) 特定配置 Stages 平臺(tái) Software 軟件 ?Window XP control software ?VHR software ?user licenses ? Menu setup ? Image setup ?1575 MHz ?100300 MHz ? GHz更高頻率 ?各種不同聚焦長(zhǎng)度的探頭 ?水槽 ?探頭固定架 ?其他保護(hù)裝置和自動(dòng)系統(tǒng) ?2個(gè)硬盤和電腦配置 ?客制化設(shè)計(jì) ?軟件設(shè)置包 ?軟件分析包 ?圖像分析包 ?軟件保護(hù)包 ?軟件幫助包 ?更明亮的掃描觀測(cè)范圍 ?ThruScan穿透式掃描樣品支架 ?應(yīng)用特別設(shè)計(jì) ?水槽水溫恒加熱和保持裝置 Shared and Specific Components 超聲波顯微鏡主要組成部分 配置圖 SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING Printer / CD /U盤 打印機(jī) /CD刻錄 /U盤 Monitor 1 設(shè)置顯示器 parallel port grafic interface AD converter RFinterface video scan interface X//Z Motor controller XYZ機(jī)械移動(dòng)控制單元 scanner system 掃描系統(tǒng) Encoder 編碼器 Sample 樣品 Transducer 探頭 Pulser / Receiver高頻發(fā)射接收器 Echo 回波 PC Workstation 計(jì)算機(jī)工作站 Trigger Unit 信號(hào)觸發(fā)器 Acoustic Microscope Systems 超聲波掃描顯微鏡系統(tǒng)配置 Monitor 2 圖像顯示器 SKLMS 機(jī)械制造系統(tǒng)工程國(guó)家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING High Frequency Ultrasonic Transducers 不同頻率超聲波探頭 低頻: 5 MHz – 50 MHz 中頻: 75MHz – 100MHz 高頻: