半導(dǎo)體封裝制程與設(shè)備材料知識(shí)介紹-fe-展示頁(yè)
2025-05-22 12:03本頁(yè)面
【正文】 ttach 芯片粘貼 Wafer IQC 來(lái)料檢驗(yàn) Plasma Clean 清洗 Plasma Clean 清洗 Saw Singulation 切割成型 SMT 表面貼裝 PMC 模塑后烘烤 SMT（表面貼裝） 包括錫膏印刷 (Solder paste printing),置件 (Chip shooting),回流焊 (Reflow),DI水清洗 (DI water cleaning),自動(dòng)光學(xué)檢查 (Automatic optical inspection),使貼片零件牢固焊接在 substrate上 Stencil Substrate Solder paste pringting Chip shooting Reflow Oven DI water cleaning Automatic optical inpection Capacitor DI water Camera Hot wind Nozzle PAD PAD Solder paste Die Prepare(芯片預(yù)處理 ) To Grind the wafer to target thickness then separate to single chip 包括來(lái)片目檢 (Wafer Ining), 貼膜 (Wafer Tape),磨片 (Back Grind),剝膜 (Detape),貼片 (Wafer Mount),切割 (Wafer Saw)等系列工序 ,使芯片達(dá)到工藝所要求的形狀 ,厚度和尺寸 ,并經(jīng)過(guò)芯片目檢 (DVI)檢測(cè)出所有由于芯片生產(chǎn) ,分類或處理不當(dāng)造成的廢品 . Wafer tape Back Grind Wafer Detape Wafer Saw Inline Grinding amp。 POLISH ACCRETECH PG300RM STANDALONE GRINDER DISCO 8560 DETAPING NITTO MA3000 WAFER MOUNTER NITTO MA3000 DICING SAW DISCO DFD 6361 TSK AWD300T PROCESS VENDOR MODEL DIE BOND HITACHI DB700 ESEC ESEC2021/2021 ASM ASM889898 CURE OVEN CSUN QDM4S WIRE BONDER Kamp。 Dicing (晶圓 研磨及 切割 ) Die Attach (上片 ) WireBonding (焊線 ) Molding (塑封 ) Package (包裝 ) Wafer Cutting (晶圓切斷 ) Wafer Reduce (晶圓減薄 ) Laser Cut amp。半導(dǎo)體封裝制程與設(shè)備材料知識(shí)簡(jiǎn)介 Prepare By： William Guo 2021 . 11 Update 半導(dǎo)體封裝制程概述 半導(dǎo)體前段晶圓 wafer制程 半導(dǎo)體后段封裝測(cè)試 封裝前段（ B/GMOLD）－ 封裝后段（ MARKPLANT）－ 測(cè)試 封裝就 是將前製程加工完成後所提供晶圓中之每一顆 IC晶粒獨(dú)立分離，並外接信號(hào)線至導(dǎo)線架上 分離 而予以包覆 包裝測(cè)試直至 IC成品 。 半 導(dǎo) 體 制 程 Oxidization (氧化處理 ) Lithography (微影 ) Etching (蝕刻 ) Diffusion Ion Implantation (擴(kuò)散離子植入 ) Deposition (沉積 ) Wafer Inspection (晶圓檢查 ) Grind amp。 package saw (切割 成型 ) Testing (測(cè)試 ) Laser mark (激光印字 ) IC制造開始 前段結(jié)束 后段封裝開始 製造完成 封 裝 型 式 (PACKAGE) Through Hole Mount Shape Material Lead Pitch No of I/O Typical Features Ceramic Plastic mm (100miles) 8 ~64 DIP Dual Inline Package Plastic mm (100miles) 1 direction lead 3~25 SIP Single Inline Package 封 裝 型 式 Through Hole Mount Shape Material Lead Pitch No of I/O Typical Features Plastic mm (100miles) 1 direction lead 16~24 ZIP Zigzag Inline Package Plastic mm (70miles) 20 ~64 SDIP Shrink Dual Inline Package 封 裝 型 式 Through Hole Mount Shape Material Lead Pitch No of I/O Typical Features Ceramic Plastic mm (100miles) halfsize pitch in the width direction 24~32 SKDIP Skinny Dual Inline Package Ceramic Plastic mm (100miles) PBGA Pin Grid Array 封 裝 型 式 Surface Mount Shape Material Lead Pitch No of I/O Typical Features Plastic mm (50miles) 2 direction lead 8 ~40 SOP Small Out
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