0402chiprlc制程與不良品分析流程-版本2-文庫吧資料
2025-01-18 23:20本頁面
【正文】 cut layer (epoxy) 25 ?m termination (AgPd or Ag or NiCr) ~ ?m9. Diffusion barrier (Ni) 8 ?m plating(Sn) 8 ?m ? 網(wǎng)印 Resistive layer的厚度及精準(zhǔn)度為 25+/4um. AMBIT Microsystems CorporationChip resistor 製造流程RAW MaterialsIQC Primary Electrode Printing DryingResistor Body PrintingInprocess InspectionLaserTrimmingInprocessInspectionOver coating PrintingInprocessInspectionDryingDrying Marking DryingFiringInprocessInspectionDryingFiringInprocessInspection“B” BreakInprocessInspection Electrode NiPlatingSputteringElectrode TinPlatingInprocessInspection TestingPackagingFQCStockInprocess Inspection“A” Break(CB) Backside Electrode printing Drying Secondary Electrode PrintingMagic screenInprocess Inspection FiringFiring?Laser切割是整排先量再切 ,切完後再量其電阻值 . AMBIT Microsystems CorporationChip Capacitor信賴性試驗(yàn) AMBIT Microsystems CorporationChip Resistor信賴性試驗(yàn) AMBIT Microsystems CorporationTesting substrate:Bending Test AMBIT Microsystems CorporationPCB Pad 設(shè)計(jì) (0402 Chip)A = pad to pad 外距長B = pad長C = pad寬D = pad to pad內(nèi)距長b = 開孔 pad長c = 開孔 pad寬d = 開孔 pad to pad內(nèi)距長e = 半圓直徑長 (1/3)*Cf = 半圓直徑長 (1/3)*bADCBdfebc AMBIT Microsystems CorporationModel of Chip R/C Solder Wetting Good Poor Solder Cold Solder DewettingReflow temp.175~183 oC183? oCFinalChip is pushed up Unequal solder wetting balance Lift up TensionNo intermetallic pound layerh1/4 h AMBIT Microsystems CorporationChip R/C不良之改善Consideration to achieve zero defect: design mass issue misalign mask design orientation damage and Mechanical Damage不良主要來源 AMBIT Microsystems Corporation DesignPad大小不同造成 chip零件兩端不平衡的可能因素 :a.
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