杜邦產(chǎn)品介紹(2)-文庫吧資料
2025-01-10 15:53本頁面
【正文】 eable Coverlay (PIC) – Dry Film – FineLine Application ? Camera ? Automotive ? Others 軟性電路板之主要基材 m Dielectric Substrates ? Definition – A base film on which the printed conductors are laid. – A film which provides electrical insulation between conductors. – A film which provides mechanical strength of the circuit. m ? 必備之特性 – Mechanical Strength – Flexibility – Dimensional Stability – Dielectric Properties – Thermal Properties – Chemical Resistance – Moisture Absorption – Cost Dielectric Substrates m ? Substrates 之種類 – Polyimide – Polyester – Fluorocarbon – Aramid Paper – Composite Dielectric Substrates m ? Polyimide: – Popularized by DuPont under “Kapton” – Also known as PI – First choice of film in most FPC – Infusible and flame retardant – High Tg (約 260C 280C) – Good dimensional stability Substrates m Substrates ? Polyester: – Popularized by DuPont under “Mylar” – Also known as PET – Lowest cost dielectric material – Mostly used in lowcost consumer application – Good mechanical properties – Bad thermal properties m Substrates ? Aramid Paper: – Sold under DuPont trade name “Nomex” – Used in specialized application – Good thermal insulation material m Property Polyester Polyimide Fluorocarbon Aramid Paper Composite Tensile Strength Excellent Excellent Fair Good Best Flexibility Excellent Excellent Excellent Good Fair/Good Dim. Stability Fair/Good Good Fair Good Fair/Good Dielectric Str. Good
教學(xué)課件相關(guān)推薦
鄂ICP備17016276號-1