ipc-a-610國際標(biāo)準(zhǔn)中英文對照-文庫吧資料
2025-07-20 15:57本頁面
【正文】 511 Figure圖 5121. Lead forms 引腳形狀DefectClass 1,2,3缺點(diǎn)——等級 1，2，3?Components required to be mounted off the board are not provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land.Figure圖 513 需要離開面板安裝的組件在線路板表面未利用引腳的形狀或其它機(jī)械支撐來防止焊盤翹起?surface Components required to be mounted above the board are less than [ in].（ in）Figure圖 514 MountingHorizontalRadial Leaded安裝——水平——徑向引腳TargetClass 1,2,3目標(biāo)——等級 1，2，3?The ponent body is in flat contact with the board39。DefectClass 1,2,3缺點(diǎn)——等級 1，2，3?Components required to be mounted above the board surface are less than [ in] （ in）. MountingHorizontalAxial LeadedUnsupported Holes安裝——水平——軸向引腳——無支撐的孔TargetClass 1,2,3目標(biāo)——等級 ?The entire body length of the ponent is in contact with the board surface.整個(gè)組件本體長度與線路板表面完全接觸.?Components required to be mounted off the board areat minimum [ in] from the boardFigure圖 510 surface 。 ., high heat dissipating.需要離開線路板表面安裝的組件至少要離開線路板Figure圖 57 （ in），如高散熱器件. Figure圖 58 MountingHorizontalAxial LeadedSupported Holes(cont.)安裝——水平——軸對稱引腳——有支撐孔AcceptableClass 1,2可接受的——等級 1，2，3?The maximum space between the ponent and theboard surface does not violate the requirements for lead protrusion(see )or ponent height(H).
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