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qc常用單詞-中英對(duì)照-文庫(kù)吧資料

2025-05-19 22:35本頁(yè)面
  

【正文】 elationship Management 客戶關(guān)係管理: Work in process半成品 :特別採(cǎi)用—CEO: Chief Executive Office首 COO :Chief Operating OfficeCFO: Chief Finance Officer CBO: Chief Business OfficerCTO: Chief Technology Officer CIO: Chief Information OfficerCGO: Chief Government Officer : 納斯達(dá)克證券市場(chǎng)NASDAQ Automated Quotation system :Venture Capital 風(fēng)險(xiǎn)投資:Personal Date Assistant個(gè)人數(shù)字助理 PLA: Personal Information Assistant個(gè)人信息助理:Advanced Product Quality Planning and Control Plan 生產(chǎn)性零組件核準(zhǔn)程序:Protentical Failure Mode and Effects Analysis失效模式與效應(yīng)分析: Measurement Systems Analysis 量測(cè)系統(tǒng)分析:Quality System Assessment 品質(zhì)系統(tǒng)評(píng)鑑: 累計(jì)總合圖 Equipment Effectiveness設(shè)備移動(dòng)率:競(jìng)爭(zhēng)標(biāo)竿 Analysis of motion/Ergonomics動(dòng)作分析/人體工程學(xué) Yoke 防錯(cuò)法 MCR: machine capability ratio 機(jī)器利用率 Proofing 防呆法 Taguchi methods田口式方法224,Vertical integration垂直整合 Surveillance定期追蹤審查: Electronics Manufacturing Supplychainamp。 品 質(zhì) 系 統(tǒng) 常 見(jiàn) 英 文 簡(jiǎn) 介 1. QC : quality control 品質(zhì)管制 : ining quality control 進(jìn)料品質(zhì)管制 : output quality control 出貨品質(zhì)管制 : process quality control 製程品質(zhì)管制也稱IPQC : in process quality control .5 . AQL : acceptable quality level 允收標(biāo)準(zhǔn) : customer quality assurance 客戶品質(zhì)保証 : major defeat 主要缺點(diǎn) 8. MI : minor defeat 次要缺點(diǎn)9. CR :critical defeat 關(guān)鍵缺點(diǎn) 10. SMT : surface mounting technology 表面粘貼技術(shù)11 . SMD : surface mounting device SMC : surface mounting ponent 表面粘貼元件12 . ECN : engineering change notice 工程變更通知 13 . DCN : design change notice 設(shè)計(jì)變更通知14 . PCB : printed circuit board 印刷電路板 15 . PCBA : printed circuit board assembly裝配印刷電路板16 . BOM : bill of material 材料清單 17. BIOS : basically input and output system 基本輸入輸出系統(tǒng)18. MILSTD105E : 美國(guó)陸軍標(biāo)準(zhǔn),也稱單次抽樣計(jì)劃.19 . ISO : international standard organization 國(guó)際標(biāo)準(zhǔn)化組織20 . DRAM: 內(nèi)存條 21 . Polarity : 電性 22 . Icicles : 錫尖 23 . Nonwetting : 空焊24 . Short circuit : 短路 25 . Missing ponent : 缺件 26 . Wrong ponent : 錯(cuò)件 27 . Excess ponent : 多件 28 . Insufficient solder : 錫少 29 . Excessive solder : 錫多30 . Solder residue : 錫渣 31 . Solder ball : 錫球 32 . Tombstone : 墓碑 33 . Sideward : 側(cè)立 34 . Component damage : 零件破損 35 . Gold finger : 金手指36 . SOP : standard operation process 標(biāo)準(zhǔn)操作流程 37 . SIP : standard inspection process 標(biāo)準(zhǔn)檢驗(yàn)流程38 . The good and not good segregation :良品和不良品區(qū)分39 . OBW : on board writer 熸錄BIOS 40 . Simple random sampling : 簡(jiǎn)單隨機(jī)抽樣41 . Histogram : 直方圖 42 . Standard deviation :
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