【正文】 Paddle Die Attach Backside Paddle ThruScan? Bulk Scan The following interfaces and scanning modes are generally of interest: ? Top Side Surface – orientation, surface cracks, and chips ? Die Surface – delaminations and die surface cracks ? Die Attach – delaminations, voids, and subsurface die cracks ? Top Side Leadframe – cracks and delaminations ? Top Side Paddle – cracks and delaminations ? Bulk Scan – voids and cracks in the encapsulant ? Backside Surface – orientation, surface cracks, and chips ? Backside Paddle – cracks and delaminations ? Backside Leadframe – cracks and delaminations ? ThruScan? – confirmation of defects SKLMS 機(jī)械制造系統(tǒng)工程國家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING PBGA (塑料焊球陣列封裝 ) Die Surface Encapsulant to Substrate ThruScan? THRUScan? Die Attach ?The following interfaces and scanning modes are generally of interest: ? Top Side Surface – orientation, surface cracks, and chips ? Backside Surface – orientation, surface cracks, and chips ? Die Surface – delaminations and die surface cracks ? Die Attach – delaminations, voids, and subsurface die cracks ? Encapsulant–Substrate Interface voids, cracks and delaminations ? Bulk Scan – voids and cracks in the encapsulant ? Thru can? – confirmation of defects SKLMS 機(jī)械制造系統(tǒng)工程國家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING PGA (引腳網(wǎng)格陣列封裝 ) Heatsink Attach Lid Seals Die Attach The following interfaces and scanning modes are generally of interest: ? Top Side Surface – orientation, surface cracks, and chips ? Die Attach – delaminations, voids, and subsurface die cracks ? Heatsink Attach – delaminations ? Backside Surface – orientation, surface cracks, and chips ? Lid Seals – delaminations, voids, misplacement SKLMS 機(jī)械制造系統(tǒng)工程國家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING CSP (芯片尺寸封裝 ) ThruScan? Die Attach Die Surface Encapsulant to Substrate Bulk Scan The following interfaces and scanning modes are generally of interest: ? Top Side Surface – orientation, surface cracks, and chips ? Die Surface – delaminations and die surface cracks ? Die Attach – delaminations, voids, and subsurface die cracks ? Encapsulant–Substrate Interface – voids, cracks and delaminations ? Bulk Scan – voids and cracks in the encapsulant ? ThruScan? – confirmation of defects SKLMS 機(jī)械制造系統(tǒng)工程國家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING MLCC (片式多層陶瓷電容 ) Loss of Back Echo (LOBE) Scan Bulk Scan Active Area Termination Scan Type: BulkScan Interface Scanned: Bulk Scan of Entire thickness of capacitor Defects (Red Arrow): Delamination in ceramic Defects (Yellow Arrow): Void in ceramic The following interfaces and scanning modes are generally of interest: ? Top Side Surface – orientation, cracks, and surface chipouts. Cracks and voids for the active area, and cracks for the termination ? Bulk Scan – voids and cracks in the encapsulant ? Loss of Back Echo (LOBE) Scan – confirmation of defects ? Backside Surface – orientation, cracks, and surface chipouts. Cracks and voids in the active area, and cracks within the terminations SKLMS 機(jī)械制造系統(tǒng)工程國家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING Heat Sinks（散熱片） Substrate Attach Die Attach The following interfaces and scanning modes are generally of interest: ? Surface – orientation, surface cracks, and chips ? Heatsink Attach – delaminations and voids ? Substrate Attach – delaminations and voids ? Die Attach – delaminations and voids SKLMS 機(jī)械制造系統(tǒng)工程國家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING Thyristors and IGBT（晶閘管） ceramic to copper or metal plating The following interfaces and scanning modes are generally of interest: ? Surface – orientation, surface cracks, and chips ? Heatsink Attach – delaminations and voids ? Substrate Attach – delaminations and voids ? Die Attach – delaminations and voids SKLMS 機(jī)械制造系統(tǒng)工程國家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING Wafer（晶片） Loss of Back Echo (LOBE) Scan WaferWafer Interface The following interfaces and scanning modes are generally of interest: ? Surface – orientation, surface cracks, and chips ? Wafer to Waf。 Paddle The following interfaces and scanning modes are generally of interest: ? Top Side Surface – orientation, surface cracks, and chips ? Die Surface – delaminations and die surface cracks ? Die Attach – delaminations, voids, and subsurface die cracks ? Top Side Leadframe – cracks and delaminations ? Top Side Paddle – cracks and delaminations ? Bulk Scan – voids and cracks in the encapsulant ? Backside Surface – orientation, surface cracks, and chips ? Backside Paddle – cracks and delaminations ? Backside Leadframe – cracks and delaminations ? ThruScan? – confirmation of defects SKLMS 機(jī)械制造系統(tǒng)工程國家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING 塑料四邊引線封裝 Die Surface, Topside Leadframe amp。 Paddle Die Attach Backside Leadframe Backside Paddle ThruScan? The following interfaces and scanning modes are generally of interest: ? Top Side Surface – orientation, surface cracks, and chips ? Die Surface – delaminations and die surface cracks ? Die Attach – delaminations, voids, and subsurface die cracks ? Top Side Leadframe – cracks and delaminations ? Top Side Paddle – cracks and delaminations ? Bulk Scan – voids and cracks in the encapsulant ? Backside Surface – orientation, surface cracks, and chips ? Backside Paddle – cracks and delaminations ? Backside Leadframe – cracks and delaminations ? ThruScan? – confirmation of defects SKLMS 機(jī)械制造系統(tǒng)工程國家重點(diǎn)實(shí)驗(yàn)室 STATE KEY LABORATORY FOR MANUFACTURING SYSTEMS ENGINEERING Die Surface, Topside Leadframe amp。 Paddle Die Attach Backside Leadframe amp。 Paddle Die Attach ThruScan? Back