創(chuàng)新的玻璃輔助二氧化碳雷射對矽的加工技術(shù)-資料下載頁
2025-03-29 04:22本頁面
【正文】 to be a hole pattern and a heartshaped hollow. 4. We could mark on top or back side of silicon wafer. Summary 15 Laser Related Patent List ? 鍾震桂 、林育全，“切割脆性材料之方法及裝置”，臺灣發(fā)明第 250911號， 2023/032024/12。 CK Chung, and YC Lin, “ Method and apparatus for machining a brittle material”, TW 250911, 2023/032024/12. ? 鍾震桂 、吳孟諭、蕭恩柔，“加工硬脆材料之方法”審查中 CK Chung, MY Wu and E J Hsiao, “ Method for machining a brittle material”, patent filed. ? 鍾震桂 、吳孟諭、宋雲(yún)傑，“矽晶圓之切割和加工方法”審查中 CK Chung, MY Wu and YC Sung, “Method of cutting and processing a silicon wafer”, patent filed. ? 鍾震桂 、吳孟諭、蕭恩柔，“表面上具有標記之矽材料及其形成方法”審查中 CK Chung, MY Wu and E J Hsiao, “ Silicon material having a mark on the surface thereof and the method for making the same”, patent filed. 16 17 演講完畢，謝謝觀看！
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