【正文】 saic Pattern(8 X 6) 10 4 Hours Pass Wistron Mobile Reliability Test LCD C4 工作重點(diǎn)及檢核項(xiàng)目 階段 C4工程試作階段 (ENG Pilot Run Phase) 負(fù)責(zé)單位 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門 工程部門 目的 *工程試作與驗(yàn)證 *依驗(yàn)證結(jié)果改善設(shè)計(jì) *準(zhǔn)備技術(shù)資料以便技術(shù)移轉(zhuǎn)、授權(quán)或移轉(zhuǎn)技術(shù)至相關(guān)生產(chǎn)單位 工作重點(diǎn) 完成系統(tǒng)軟體或應(yīng)用軟體之設(shè)計(jì)、測試及除錯(cuò) 提出軟體之程式碼 (Source Code) 正式發(fā)出電路圖 (Schematics)、 料表清單 (BOM)及已驗(yàn)證料表供應(yīng)商清單 (QVL) 進(jìn)行工程試作階段之測試、驗(yàn)證及除錯(cuò)並提出測試驗(yàn)證報(bào)告 提出工程試作階段之試作報(bào)告及改善建議 完成生產(chǎn)或技術(shù)移轉(zhuǎn)所需之相關(guān)測試程式及程序 法務(wù) ﹕ 完成專利、著作權(quán)、商標(biāo)申請 審核會(huì)議 C4 目的 檢討工程試作結(jié)果，並決定是否進(jìn)入試產(chǎn)階段 完成各項(xiàng)技術(shù)移轉(zhuǎn)或生產(chǎn)所需之文件，並進(jìn)行系統(tǒng)殘留問題之檢討與對(duì)策驗(yàn)證 檢核項(xiàng)目 *S/W Firmware release *BOM *ME ENG P/R report *EE ENG P/R report *Test Program *PCB artwork *C4 Test report *Schematics *SW source code *Transfer plan New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C5 checklist ?Service Guide ?EMC Safety report ?PD P/R yield rate analysis rpt ?PCBA inspection instruction ?Product inspection instruction ?MTBF DEMO test report C5/NPI C5 Meeting C5 工作重點(diǎn)及檢核項(xiàng)目 階段 C5試產(chǎn)階段 ( Production Pilot Run Phase) 負(fù)責(zé)單位 生產(chǎn)部門 (Production) 物管部門 (Material Management) 工程部門 (Engineering) 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門 (RD) 目的 預(yù)為建立量產(chǎn)之準(zhǔn)備 , 完成各項(xiàng)生產(chǎn)必備之文件 , 並進(jìn)行產(chǎn)品殘留問題之檢討與對(duì)策驗(yàn)證 工作重點(diǎn) * 提出 FDI 及 MTBF DEMO TEST REPORT. * 提出 ACT(ACCEPT TEST REPORT) * 提出 PD PILOT RUN YIELD RATE ANALYSIS REPORT * 殘存 ISSUE 之追蹤與結(jié)果 * REVIEW 量產(chǎn)材料狀況 * 取得各項(xiàng)安全規(guī)格之合格證明 * 取得 REQUEST OS 認(rèn)證之合格證明 * Service Guide Spare Parts List 審核會(huì)議 C5 目的 檢討試產(chǎn)結(jié)果及生產(chǎn)作業(yè)與流程 , 並決定是否進(jìn)入量產(chǎn) . 檢核項(xiàng)目 試產(chǎn)階段之問題與對(duì)策研討 . SCHEDULE檢討 . 量產(chǎn)計(jì)劃及備料狀況研討 . 試產(chǎn)階段 YEILD RATE分析與改善對(duì)策 New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting C6/GCSD ?C6 checklist ?Product phase out notice C6 Meeting C6 工作重點(diǎn)及檢核項(xiàng)目 階段 C6 量產(chǎn)階段 (Mass Production Phase) 負(fù)責(zé)單位 生產(chǎn)部門 (Production) 物管部門 (Material Management) 工程部門 (Engineering) 業(yè)務(wù)部門 (Account Manager AM) 客服部門 (GCSD) 目的 配合行銷與客戶需求 產(chǎn)品之品質(zhì)再確認(rèn)及持續(xù)改善 產(chǎn)品停產(chǎn)後 , 後續(xù)服務(wù)需求滿足 產(chǎn)品研發(fā)與銷售成本營收之比較 工作重點(diǎn) 產(chǎn)品品質(zhì)持續(xù)改善 (CIP – Continuous Improve Process) 提出 Product EOF Service Plan 執(zhí)行 Early Warning 機(jī)制及產(chǎn)品相關(guān)品質(zhì)資料收集 提出 Field Quality 及 Service Cost Summary Report 提供客戶回饋之主要問題的經(jīng)驗(yàn)學(xué)習(xí)及掌握 通告產(chǎn)品 Phase Out Notice 產(chǎn)品停產(chǎn)之 Service Information Pack Update Release 執(zhí)行客戶滿意度相關(guān)事宜 審核會(huì)議 C6 目的 對(duì) Project 開發(fā)活動(dòng)作通盤開發(fā)檢討及提出改進(jìn)意見及產(chǎn)品停產(chǎn)後客戶後續(xù)服務(wù)需求及未來殘留問題的職責(zé)之研討 檢核項(xiàng)目 量產(chǎn)階段之問題與對(duì)策研討 客戶回饋問題 停產(chǎn)後客戶服務(wù)後續(xù)事宜 經(jīng)驗(yàn)學(xué)習(xí)與掌握 (lessons learned)