倒裝焊與芯片級封裝技術的研究-資料下載頁
2024-12-31 22:40本頁面
【正文】 屬 (UBM)和絲網(wǎng)印刷凸點工藝 (低成本倒裝焊技術 不需用光刻和真空制造工藝 ) ? WaferLevel Input/output Redistribution. 晶片級輸入 /輸出再發(fā)布工藝 Commercial Applications商業(yè)應用 ? For Integrated Circuit Wafer Foundry 集成電路晶片制造廠 ? Wafer bumping – advanced integrated circuit chips for highspeed, high input/output counts, and for chips going into advanced packages such as Ball Grid Array (BGA) and Chip Size Package (CSP). 晶片凸點制備：用于高速高輸入 /輸出端口的先進集成電路芯片，及先進芯片封裝技術，如 球形焊點陣列和芯片尺寸封裝 . ? Redistribution of perimeter I/O (designed for wirebonding) to array I/O for advanced packaging. 先進封裝技術中再分布工藝 (由周邊輸入 /輸出至面分布 ). ? For Packaging and Assembly Foundry IC封裝和裝配廠 ? Assembly of Advanced packages such as Ball Grid Array (BGA) and Chip Size Package (CSP). 先進封裝的裝配，如 球形焊點陣列和芯片尺寸封裝 . 謝謝觀看 /歡迎下載 BY FAITH I MEAN A VISION OF GOOD ONE CHERISHES AND THE ENTHUSIASM THAT PUSHES ONE TO SEEK ITS FULFILLMENT REGARDLESS OF OBSTACLES. BY FAITH I BY FAITH
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