消除免洗pcb中的錫珠-資料下載頁
2025-08-04 17:23本頁面
【正文】 的錫膏，最終產(chǎn)品的品質(zhì)可以大大提高。為片狀元件結(jié)合使用U形開孔，大大地減少錫珠的發(fā)生。對(duì)QFP焊盤的減小，消除了相鄰焊盤之間的錫塵。結(jié)合適當(dāng)?shù)暮副P尺寸與形狀可為PCB裝配的生產(chǎn)形成較高品質(zhì)的工藝。References 1. IPC. 2000. Surface mount solder joint evaluation. Desk Reference Manual. Northbrook, IL。 IPC Association Connecting Electronics Industries. (Figure 1 reference). 2. IPC. 2000. IPCA610C Acceptability of Electronic Assemblies. Northbrook, IL, p. 12, pp. 1288. 3. Unpublished work of the authors. 4. Hance, W., et al. 1991. Solder beading in SMT, cause and cure. Surface Mount International. 5. Lee, N. 1998. Optimizing reflow profile via defect mechanisms analysis. IPC Printed Circuit Expo. 6. Wheeler, D. 1990. Understanding Industrial Experimentation. pp. 83, 150, 205, 206, 207. Terry Basye, is a senior process engineer。 Walt Beltz is an advisory engineer, printed circuit board design。 Terry Rose is a senior production engineer。 Mary Smoot is a senior process engineer。 and Cary Williams is a senior quality engineer。 all with Lexmark International Inc., Ross B. Berntson is manager, technical service。 Kelvin Ho is an applications engineer。 and David W. Sbiroli is a product specialist, interconnect mterials。 all with Indium Corp. of America, Utica, NY。 dsbiroli@ (A 08/13/2001)
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