【正文】 information given in this presentation is given as a hint for the implementation of the Infineon Technologies ponents only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies ponents. The statements contained in this munication, including any remendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of noninfringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6Mar08BaginskiCopyright 169。 Infineon Technologies 2006. All rights reserved.Page 17Considerations of phase change materialAfter heating up(phase change)Foil workslike distancespacersF=?NmLoose of pressureBaseplateHeatsinkF=?NmThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies ponents only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies ponents. The statements contained in this munication, including any remendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of noninfringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6Mar08BaginskiCopyright 169。 Infineon Technologies 2006. All rights reserved.Page 18Conclusion of considerationsThe grease has to fill only the roughness of the baseplate andthe roughness of the heatsinkThis do not prevent metal to metal contact where possibleThe grease has to be fluid enough to spread and to flow outThis guarantees small thickness of grease between baseplateand heatsinkThis guarantees a good thermal contactThe roughness of the heatsink should be under considerationsThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies ponents only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies ponents. The statements contained in this munication, including any remendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of noninfringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6Mar08BaginskiCopyright 169。 Infineon Technologies 2006. All rights reserved.Page 19The information given in this presentation is given as a hint for the implementation of the Infineon Technologies ponents only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies ponents. The statements contained in this munication, including any remendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of noninfringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6Mar08BaginskiCopyright 169。 Infineon Technologies 2006. All rights reserved.Page 20