【正文】 plasticizers3 不飽和聚酯：unsatuiated polyester3 聚酯薄膜：polyester3 聚酰亞胺薄膜：polyimide film (PI)3 聚四氟乙烯：polytetrafluoetylene (PTFE)3 聚全氟乙烯丙烯薄膜：perfluorinated ethylenepropylene copolymer film (FEP) 增強(qiáng)材料：reinforcing material4 玻璃纖維：glass fiber4 E玻璃纖維：Eglass fibre4 D玻璃纖維：Dglass fibre4 S玻璃纖維：Sglass fibre4 玻璃布：glass fabric4 非織布：nonwoven fabric4 玻璃纖維墊：glass mats4 紗線：yarn4 單絲：filament50、 絞股：strand5 緯紗：weft yarn5 經(jīng)紗：warp yarn5 但尼爾：denier5 經(jīng)向：warpwise5 緯向：weftwise, fillingwise5 織物經(jīng)緯密度：thread count5 織物組織：weave structure5 平紋組織：plain structure5 壞布：grey fabric60、 稀松織物：woven scrim6 弓緯：bow of weave6 斷經(jīng)：end missing6 缺緯：mispicks6 緯斜：bias6 折痕：crease6 云織：waviness6 魚眼：fish eye6 毛圈長(zhǎng)：feather length6 厚薄段：mark70、 裂縫：split7 捻度：twist of yarn7 浸潤(rùn)劑含量：size content7 浸潤(rùn)劑殘留量：size residue7 處理劑含量：finish level7 浸潤(rùn)劑：size7 偶聯(lián)劑：couplint agent7 處理織物：finished fabric7 聚酰胺纖維：polyarmide fiber7 聚酯纖維非織布：nonwoven polyester fabric80、 浸漬絕緣縱紙：impregnating insulation paper8 聚芳酰胺纖維紙：aromatic polyamide paper8 斷裂長(zhǎng)：breaking length8 吸水高度：height of capillary rise8 濕強(qiáng)度保留率：wet strength retention8 白度：whitenness8 陶瓷：ceramics8 導(dǎo)電箔：conductive foil8 銅箔：copper foil8 電解銅箔：electrodeposited copper foil (ED copper foil)90、 壓延銅箔：rolled copper foil9 退火銅箔：annealed copper foil9 壓延退火銅箔：rolled annealed copper foil (RA copper foil)9 薄銅箔：thin copper foil9 涂膠銅箔：adhesive coated foil9 涂膠脂銅箔：resin coated copper foil (RCC)9 復(fù)合金屬箔：posite metallic material9 載體箔：carrier foil9 殷瓦：invar9 箔（剖面）輪廓：foil profile100、 光面：shiny side10 粗糙面：matte side10 處理面：treated side10 防銹處理：stain proofing10 雙面處理銅箔：double treated foil四、 設(shè)計(jì) 原理圖：shematic diagram 邏輯圖：logic diagram 印制線路布設(shè)：printed wire layout 布設(shè)總圖：master drawing 可制造性設(shè)計(jì)：designformanufacturability 計(jì)算機(jī)輔助設(shè)計(jì)：puteraided design.(CAD) 計(jì)算機(jī)輔助制造：puteraided manufacturing.(CAM) 計(jì)算機(jī)集成制造：puter integrat manufacturing.(CIM) 計(jì)算機(jī)輔助工程：puteraided engineering.(CAE) 計(jì)算機(jī)輔助測(cè)試：puteraided test.(CAT)1 電子設(shè)計(jì)自動(dòng)化：electric design automation .(EDA)1 工程設(shè)計(jì)自動(dòng)化：engineering design automaton .(EDA2)1 組裝設(shè)計(jì)自動(dòng)化：assembly aided architectural design. (AAAD)1 計(jì)算機(jī)輔助制圖：puter aided drawing1 計(jì)算機(jī)控制顯示：puter controlled display .(CCD)1 布局：placement1 布線：routing1 布圖設(shè)計(jì)：layout1 重布：rerouting 模擬：simulation2 邏輯模擬：logic simulation2 電路模擬：circit simulation2 時(shí)序模擬：timing simulation2 模塊化：modularization2 布線完成率：layout effeciency2 機(jī)器描述格式：machine descriptionm format .(MDF)2 機(jī)器描述格式數(shù)據(jù)庫(kù)：MDF databse2 設(shè)計(jì)數(shù)據(jù)庫(kù)：design database2 設(shè)計(jì)原點(diǎn)：design origin 優(yōu)化（設(shè)計(jì)）：optimization (design)3 供設(shè)計(jì)優(yōu)化坐標(biāo)軸：predominant axis3 表格原點(diǎn)：table origin3 鏡像：mirroring3 驅(qū)動(dòng)文件：drive file3 中間文件：intermediate file3 制造文件：manufacturing documentation3 隊(duì)列支撐數(shù)據(jù)庫(kù)：queue support database3 元件安置：ponent positioning3 圖形顯示：graphics dispaly 比例因子：scaling factor4 掃描填充：scan filling4 矩形填充：rectangle filling4 填充域：region filling4 實(shí)體設(shè)計(jì)：physical design4 邏輯設(shè)計(jì)：logic design4 邏輯電路：logic circuit4 層次設(shè)計(jì)：hierarchical design4 自頂向下設(shè)計(jì)：topdown design4 自底向上設(shè)計(jì)：bottomup design50、 線網(wǎng)：net5 數(shù)字化：digitzing5 設(shè)計(jì)規(guī)則檢查：design rule checking5 走（布）線器：router (CAD)5 網(wǎng)絡(luò)表：net list5 計(jì)算機(jī)輔助電路分析：puteraided circuit analysis5 子線網(wǎng)：subnet5 目標(biāo)函數(shù)：objective function5 設(shè)計(jì)后處理：post design processing (PDP)5 交互式制圖設(shè)計(jì)：interactive drawing design60、 費(fèi)用矩陣：cost metrix6 工程圖：engineering drawing6 方塊框圖：block diagram6 迷宮：moze6 元件密度：ponent density6 巡回售貨員問(wèn)題：traveling salesman problem6 自由度：degrees freedom6 入度：out going degree6 出度：ining degree6 曼哈頓距離：manhatton distance70、 歐幾里德距離：euclidean distance7 網(wǎng)絡(luò)：network7 陣列：array7 段：segment7 邏輯：logic7 邏輯設(shè)計(jì)自動(dòng)化：logic design automation7 分線：separated time7 分層：separated layer7 定順序：definite sequence五、 形狀與尺寸： 導(dǎo)線（通道）：conduction (track) 導(dǎo)線（體）寬度：conductor width 導(dǎo)線距離：conductor spacing 導(dǎo)線層：conductor layer 導(dǎo)線寬度/間距：conductor line/space 第一導(dǎo)線層：conductor layer 圓形盤：round pad 方形盤：square pad 菱形盤：diamond pad 長(zhǎng)方形焊盤：oblong pad1 子彈形盤：bullet pad1 淚滴盤：teardrop pad1 雪人盤：snowman pad1 V形盤：Vshaped pad1 環(huán)形盤：annular pad1 非圓形盤：noncircular pad1 隔離盤：isolation pad1 非功能連接盤：monfunctional pad1 偏置連接盤：offset land 腹（背）裸盤：backbard land2 盤址：anchoring spaur2 連接盤圖形：land pattern2 連接盤網(wǎng)格陣列：land grid array2 孔環(huán)：annular ring2 元件孔：ponent hole2 安裝孔：mounting hole2 支撐孔：supported hole2 非支撐孔：unsupported hole2 導(dǎo)通孔：via 鍍通孔：plated through hole (PTH)3 余隙孔：access hole3 盲孔：blind via (hole)3 埋孔：buried via hole3 埋/盲孔：buried /blind via3 任意層內(nèi)部導(dǎo)通孔：any layer inner via hole (ALIVH)3 全部鉆孔：all drilled hole3 定位孔：toaling hole3 無(wú)連接盤孔：landless hole3 中間孔：interstitial hole 無(wú)連接盤導(dǎo)通孔：landless via hole4 引導(dǎo)孔：pilot hole4 端接全隙孔：terminal clearomee hole4 準(zhǔn)表面間鍍覆孔：quasiinterfacing platedthrough hole4 準(zhǔn)尺寸孔：dimensioned hole4 在連接盤中導(dǎo)通孔：viainpad4 孔位：hole location4 孔密度：hole density4 孔圖：hole pattern4 鉆孔圖：drill drawing50、 裝配圖：assembly drawing5 印制板組裝圖：printed board assembly drawing5 參考基準(zhǔn)：datum referan