【文章內(nèi)容簡(jiǎn)介】 置及錢的重要性或影響性?可幫助我們確定要解決問題的次序?20/80%原則?最常發(fā)生的問題不總是造成損失最大的問題SPCbasic training course? 一個(gè)團(tuán)隊(duì)使用的工具 ,而不能用于個(gè)人? 一個(gè)得到許多主意的方法? 眾人的知識(shí)和智慧遠(yuǎn)多于一兩個(gè)人?為作魚骨圖作準(zhǔn)備???? ?在最短的時(shí) 間內(nèi) ,擴(kuò)展思想群策群力 ,集思廣義腦風(fēng)暴法?結(jié)構(gòu)化的每個(gè)人輪流發(fā)言 ,使每個(gè)人發(fā)表見解?非結(jié)構(gòu)化的有主意就說 ,氣氛輕松 ,但可能被善言人壟斷?會(huì)議準(zhǔn)則不許批評(píng)任何意見記下所有意見 ,使大家一目了然達(dá)成共識(shí) ,記下大家一致的意見記錄原話 ,不重新表達(dá)時(shí)間要短 (515分鐘 )?SPCbasic training course匿名小組法使每個(gè)人有平等的發(fā)言權(quán)步驟 :?小組的每個(gè)人寫出他 /她認(rèn)為最重要得問題 , 放到大家都看得到的地方?把重復(fù)的問題合并 ,放到一起?將問題編號(hào) ,投票打分 ,找出大家普遍認(rèn)定的最重要的問題A. 2,5,2,4,1B. 1,4,5,5,5C. 4,1,3,3,4D. 5,2,1,1,2E. 3,3,4,2,3總分1420151115當(dāng)有大量問題時(shí) ,只要列出前 10個(gè)問題的順序B為最重要得問題SPCbasic training courseCause Effect Diagram(魚 骨圖 )方法材料機(jī)器 人力質(zhì)量C/N/XC = Control FactorN = Noise factorX = Factor for DOEc ccccn nnnn因 果環(huán)境測(cè)量以圖表作為工具，以人、機(jī)器、物料、方法、測(cè)量及環(huán)境列出潛在問題的成因SPCbasic training courseMachineManpowerDrop to the groundTransportation ShockMaterialChipped BlankWrong HandlingHardness of Base Tabs Poor Slot roughness of baseLead Cutter ShockUltrasonic Levelof Blank WasherHandling brokenLarge Welding PressureStamping ShockMethodUnsafe PackageCement VolumeMount RotationLow viscosity of AdhesiveDead/Broken 魚骨圖示例Dead/BrokenProduct mixPattern alignmentinsufficient epoxy amountAdhesivecontaminationBubble in epoxySlut knife of lead cutter/formerB/P plate deadLarge spot sizefor some modelUM5 shieldwith poor edgeNot optimized BP maskdesign for MS modelSPCbasic training courseStation1Step1Sation3Step1Station4Step2Step3Final Measuremet最終輸出Step2 Step3Step4 Step5型號(hào) 1型號(hào) 2型號(hào) 3123etc.123etc.123etc.機(jī)器123etc.材料批次Lot1Lot2Lot3etc.輸入 /輸出變量分析方法ABCStation2魚骨圖 +流程圖SPCbasic training courseQFD矩陣FMEA防錯(cuò)防誤防呆統(tǒng)計(jì)過程控制工具 的 關(guān) 系SPCbasic training courseInputI InputII InputIII InputIV InputV ResponseFinal TesttWhy5 Why4 Why3 Why2 Why1PhenomenaIndependent factor Guessed causes Observation during processMachine 1. N2 flow rate 1. Solder oxidization 1. Dark solder surfaceFlow rate meter after Reflow2. O2 ppm level 2. Not plete cure for solder 2. Yellow flux vestigeO2 detecting meter (Organic contamination)3. Cure profilea. Belt speed(Cure TTL time)b. Temp set(Max Temp its duration)Super modeMan 1. Material mix2. Contamination dueto wrong handlingMaterial 1. Solder Flux activator amount1. Solder flux andactivator remained Solder melt at 230C2. X39。talAu thickness 2. Ag mixed in DSC meterX39。tal shortXray fluorescent meter 3. Pb mixed in Electric short3. Cap1. Ag/Pb in terminal (SEM) 4. Too much Au Final testeron both PCB2. Ni layer thickness (Microscope) X39。tal pad Cap short4. PCB 1. Au thicknessXray fluorescent meter2. Mask layout thicknessMicro UVmeter3. Mask cleanliness Solder has following path4. Mask adhesion Decap visual inspection5. Molding material 1. Filler size2. Viscosity when meltingMethod 1. Stencil size thickness 1. Not align with PCB electrode Solder ball2. Mold process Not pleted mold3. Singulation process 3. Singulation cutter blunt due to Too much bending force Crack due to singulationdie ware outMeasurement to meet spec* Do not jump to conclusion* All measurement system should be calibrated and correlated.Template of Root Cause IdentificationFailure analysisMeasure to know failure mechanismMeasure Measure for ining process control to reduce variation將正交相關(guān)矩陣表同問 5個(gè)為什么結(jié)合起來的方法Environment1. High humidity2. Shock during transportation1. Plastic absorb moisture2. External force interact with internal stress2. Filler not pletely fill the gap* Link with the outputPlastic crack whenheatingSPCbasic training course隨時(shí)間的趨勢(shì)圖追蹤趨勢(shì)為什么用它 ?? 用來觀察數(shù)據(jù)的趨勢(shì)或形態(tài) ,了解工藝參數(shù)在一定時(shí)間內(nèi)的變化它用來做什么用 ?? 在一段時(shí)期內(nèi) ,監(jiān)測(cè)工藝隨時(shí)間變化的趨勢(shì)和形態(tài)? 當(dāng)一個(gè)改善行動(dòng)落實(shí)后 , 它能使我們看到改善的結(jié)果? 注重于工藝的重要變化? 追蹤有用的信息 ,預(yù)測(cè)其變化情況? ? ? ? ? SPCbasic training course趨勢(shì)圖SPCbasic training course控制圖為什么用它 ??通過研究變量隨時(shí)間的變化及其差異來源 ,監(jiān)測(cè)和控制工藝性能它做什么用 ??著眼于監(jiān)測(cè)和控制工藝參數(shù)隨時(shí)間的變化?區(qū)分特殊變因和普通變因造成的差異 ,指導(dǎo)行動(dòng)方案的采用?做為工藝實(shí)時(shí)控制的工具 .?幫助向更加一致性 ,可預(yù)測(cè)性行高品質(zhì) ,低成本和高效產(chǎn)能方向改進(jìn)工藝?為討論工藝性能提供了一個(gè)通用語言UCL_XLCLUCL_XLCL控制圖是以表達(dá)與時(shí)間有關(guān)或與批量表現(xiàn)有關(guān)的過程，並找出過程是否在統(tǒng)計(jì)控制範(fàn)圍內(nèi)操作。在眾多的控