smtmanufactureprocess英文版(編輯修改稿)
2025-03-02 11:10 本頁面
【文章內(nèi)容簡介】 rol system to control the consistency of O2 in 500PPM heat convection make BGA and CSP heat pletely. heating zone could offer better temperature profile (8 zones and 12 zones)SMT Reflow (ETC)Method Reflow profile (example : Lead free)25~150℃ 150~217℃ Over217℃ Over230℃ below217℃Rampup:6℃ /sec(max)Rampdown:6℃ /sec(max)25℃150℃217℃230℃Preheat Soaking Reflow CoolingPeaktemp=235~255℃TempTimeSMT profile – Preheat zone? This heating zone cause the uniformtemperature in all part of PCBA, that can reduce PCB warped ,and avoid solderpaste heating disproportion ally to cause splash down to get another failure? Preheat zone temperature setting : ( generally setting, actually constant follow vendor’s data specification ) Leadfree – 25(room temp) ~ 150 ℃ : SMT profile – Soaking zone? Solderpaste include solder alloy and Flux.? Commonly, Flux content include Rosin, Activation, Solvent, and Rchological addition.? Fluxheating can cause the content of Flux deoxidize solder to raise the soldering of the joint.? Soaking zone temperature setting : (generally setting, actually constant follow vendor’s data specification Leadfree – 150 ℃ ~ 220 ℃ :SMT profile – Reflow zone? In the Reflow zone, solderjoint es into be
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