【文章內(nèi)容簡(jiǎn)介】 C0 meeting C1 meeting PM ? C0 Checklist ? MRS ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C1 checklist ?Invention disclosure ?Time schedule ?Project team ?Model number define ?Green design guide and review check list ?Non QVL/Sample approval request form C1/PM C1 Meeting C1工作重點(diǎn)及檢核項(xiàng)目 階段 C1規(guī)劃階段 (Planning Phase) 負(fù)責(zé)單位 計(jì)畫經(jīng)理 (Project Manager) 或產(chǎn)品經(jīng)理 (Product Manager) 目的 * 規(guī)格的擬訂 * 專案組織的成立 * 專案時(shí)程的規(guī)劃 工作重點(diǎn) * 選任技術(shù)經(jīng)理 (Technical Manager, 簡(jiǎn)稱 TM) 並成立專案組織 * 計(jì)畫專案經(jīng)理 (Project Manager)或產(chǎn)品經(jīng)理，規(guī)劃專案時(shí)程 * 召開(kāi) C1審核會(huì)議 * 法務(wù)確認(rèn) Legal Concern、 如 Potential Patent List, Invention Disclosure * 成立專案團(tuán)隊(duì) 審核會(huì)議 C1 目的 成立專案團(tuán)隊(duì)、確定開(kāi)發(fā)時(shí)程 檢核項(xiàng)目 Time Schedule Project Team Invention Disclosure Green Design Check List Sample Request Form Case bottle Coca in England 開(kāi)採(cǎi)鋁礦 一噸鋁土提鍊半噸氧化鋁 半小時(shí)加工 半噸氧化鋁熔煉成 1/4噸金屬鋁 再加工二週成鋁錠 瑞典或梛威 熔爐工廠 澳大利亞 澳大利亞 化學(xué)還原工廠 加熱至華氏 900度 壓延成 1/8 inch薄片 瑞典和德國(guó) 壓延廠 船運(yùn)一個(gè)月 冷軋成 1/80 inch薄片 冷軋廠 英國(guó)易開(kāi)罐廠 成型，清洗，烘乾，防鏽 裝填，印刷 英國(guó)可樂(lè)廠 消費(fèi) 鋁罐回收儘 16% Ecological Rucksack (生態(tài)包袱 ) – 生產(chǎn)一片半導(dǎo)體晶片所產(chǎn)生之廢料為產(chǎn)品重量之 十萬(wàn)倍 – 生產(chǎn)一臺(tái)筆記型電腦所產(chǎn)生之廢料為產(chǎn)品重量之 四千倍 – 生產(chǎn)一公升佛羅里達(dá)橘子汁需要 兩公升汽油及一千公升之水 – 生產(chǎn)一噸紙需用掉 九十八噸 之其他資源 資料來(lái)源 : 綠色資本主義 ─ 天下出版社 EU RoHS Directive ? 指令期程 – 指令發(fā)布 – 歐盟公報(bào)發(fā)行 ,指令生效 – 轉(zhuǎn)為會(huì)員國(guó)當(dāng)?shù)胤?,法規(guī)或行政指令 – 新投入之產(chǎn)品不得含有禁用物質(zhì) ? 指令要求 /禁用項(xiàng)目 – 鉛 (Pb) – 鎘 (Cd) – 汞 (Hg) – 六價(jià)鉻 (Cr6+) – 多溴聯(lián)苯 (PBB) – 多溴化二苯乙醚 (PBDE) (The restriction of the use of certain hazardous substances in electrical and electronic equipment) EU RoHS 管制規(guī)格 Substances . 建議值 Lead (Pb) 鉛 。 銲錫 1000 PPM Lead (Pb) 鉛 。 塑膠 ,線材 ,塗料 1000 PPM Cadmium (Cd) 鎘 100 PPM Mercury (Hg) 汞 1000 PPM Hex. Chromium (Cr6+) 六價(jià)鉻 1000 PPM PBB (聚溴聯(lián)苯 ) 1000 PPM PBDE (聚溴二苯醚 ) 1000 PPM ?重金屬： 汞、鉛、鎘、六價(jià)鉻 ?溴性耐燃劑：聚溴聯(lián)苯 (PBBs)、 溴聯(lián)苯醚 (PBDEs) 註：另有 管制規(guī)範(fàn)外 的項(xiàng)目 EU WEEE Directive ? Directive 2023/96/EC期程 – 指令發(fā)布 – 歐盟公報(bào)發(fā)行，指令生效 – 轉(zhuǎn)為會(huì)員國(guó)當(dāng)?shù)胤?,法規(guī)或行政指令 – 完成回收系統(tǒng)建構(gòu) ,製造商因應(yīng)回收之 財(cái)務(wù)規(guī)劃就緒 – 回收再利用率達(dá)每人每年 4kg – 訂定下階段目標(biāo) ? 回收 Target of Recovery and Recycling (Waste Electrical and Electronic Equipment) WEEE Category Large household appliances Small household appliances IT telemunications appliances Consumer equipment Lighting equipment Electrical and electronic tools Toys, leisure sports equipment Medical devices Monitoring and control instruments Automatic dispensers Rate of Recovery Rate of Recycling 80% 75% 70% 50% 75% 65% 75% 65% 70% 50% 70% 50% 70% 50% * * 70% 50% 80% 75% * To be determined by 31 December 2023 New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C2 checklist ?PES ?EMC/Safety Request Form ?BOM/QVL(Prel.) ?PCB Layout (prel.) ?Outsourcing module specification C2/PM C2 Meeting C2 工作重點(diǎn)及檢核項(xiàng)目 階段 C2設(shè)計(jì)階段 (RD Design Phase) 負(fù)責(zé)單位 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門 目的 * 軟、硬體、機(jī)構(gòu)設(shè)計(jì) * 証實(shí)設(shè)計(jì)可行性 * 修正軟、硬體、機(jī)構(gòu)規(guī)格 工作重點(diǎn) * 電路設(shè)計(jì)並完成電路圖 * 機(jī)構(gòu)設(shè)計(jì)並完成機(jī)構(gòu)設(shè)計(jì)圖 * 機(jī)電整合設(shè)計(jì)並完成機(jī)電介面設(shè)計(jì) * 軟體設(shè)計(jì)並完成初步版本 * 電路設(shè)計(jì) Review * 機(jī)構(gòu)設(shè)計(jì) Review * 機(jī)電整合設(shè)計(jì) Review * 建立初步之測(cè)試計(jì)畫 (硬體、軟體、機(jī)構(gòu) ) 審核會(huì)議 C2 目的 * 確定計(jì)畫規(guī)格 * 檢討設(shè)計(jì)階段之工作成效 * 決定是否進(jìn)入樣品試作 * 查核是否發(fā)出專利之申請(qǐng) 檢核項(xiàng)目 Schematics (Preliminary) S/W Specification Mechanical Thermal Test Plan Invention Disclosure Invention Disclosure New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C4 checklist ? BOM ? QVL ? Time standard ? System B