【正文】 height of ponent long axis side above the land is maximum 3 point of 4 corner touch the PCB . The height of the other point above the land is maximum protrusion can be identified on solder side 允收狀況 (Accept Condition) CARD Wh≦ CARD Wh CARD a b c d a b c d a b c d a,c兩點(diǎn)平貼 PCB或垂直 上浮，但 b,d兩點(diǎn)傾斜高度 ＞ (MI)。 (Wh＞ ) 組裝性之干涉 (MA)。 (X≦) Z≦ (被固定零件平貼於 PCB時(shí) ) height of jumper wire above the land is Maximum wire used for fixing ponent is maximum shift length of reflection of jumper wire used for fixing ponent on the board is maximum measuring from the edge of PTH height of jumper wire above the ponent is maximum since ponent lay flat 允收狀況 (Accept Condition) Lh≦ mm Wh≦ mm X≦ Lh,Wh＞ (MI)。 (L≦ ) ： Coil零件腳最長長度 (Lmax)低於 3mm(L≦ 3mm) X’ TAL/電容腳距 (含 )以下之零件，腳最 長長度 (Lmax)低於 2mm (L≦ 2mm) lead protrusion lead be identified on solder side of trimed protrusion lead Minimum length is the protrusion lead profile be identified ≦ (for general ponents) spwc of ponents: Coil Lmax≦ 3mm X’ tal Lmax≦ 2mm(the clearance between two lead is less width) 允收狀況 (Accept Condition) Lmin :零件腳出錫面 Lmax ~ Lmin Lmax :L≦ mm Lmin :零件腳未出錫面 Lmax ~ Lmin Lmax :L＞ mm(特殊零件依特殊零件規(guī)定 ) L L (MI)。 (MA)。 。 。 。 (S≧5mil) The lead had shifted off the land length of lead shifted off the land (X) shall less 1/4 width of lead (W) clearance distance between shifted lead and land edge shall over 5 mil 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) SMT焊點(diǎn)性工藝標(biāo)準(zhǔn) 鷗翼 (GullWing)腳面與腳跟焊點(diǎn)最小量 SMD solder joint workmanship criteriaMinimum solder of Gull Wing footprint ,腳跟吃錫良好 焊錫帶。 (S≧5mil()) length of the lead footprint shifted off the land(X)shall less 1/4 width of lead clearance(S)between lead shifted off and land shall over 5 mil() 允收狀況 (Accept Condition) W S X≦ 1/4W S≧ 5mil() X X1/4W S＜ 5mil() ，所偏 出焊墊以外的接腳，已超 過接腳本身寬度的 1/4W (MI)。 Handling with clean gloves and full ESD protection 允收狀況（ Accept Condition）： 配帶良好靜電防護(hù)措施，握持 PCB板邊或板角執(zhí)行檢驗(yàn)。 Note:In order to clarify the figure , the solder joint be eliminated D 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) SMT零件組裝工藝標(biāo)準(zhǔn) 鷗翼 (GullWing)零件腳面之對(duì)準(zhǔn)度 SMD Assembly workmanship criteriaGullWing footprint alignment 墊的中央，而未發(fā)生偏 滑。 (X＞ 1/4W ) 緣之垂直距離＜ 5mil ()以下 (MI)。 the edge of footprint and pad without solder。 concave fillet on the 3 face of lead of solder flowup on the lead angle(h) shall over 1/2 angle height(T) 下 (MI)。 flow up from land (bottom of ponent solder termination to the 2/3 Height of ponent (T) solder fillet on the all solder able terminations (face) 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) SMT焊點(diǎn)性工藝標(biāo)準(zhǔn) 晶片狀 (Chip)零件之最大焊點(diǎn) (三面或五面焊點(diǎn) ) SMD solder joint workmanship criteriaMaximum solder fillet of chip ponent ( 3 or 5 face terminations) 片端電極底部延伸到頂部 。 ,能辨識(shí)出零件之極性符號(hào) 位置。 protrusion length of ponent meet the spec even this parts tilted or floating protrusion length(L)be measured from land to tip of lead ,目視 零件腳露出錫面。 wire lay flat and touch the board wire used for fixing ponent shall touch the ponent body Lh,Wh≦ 。 is perpendicular and base is parallel to board surface floating height is measured from face of PCB substrate to the lowest point of ponent PCB零件面之 最大距離 ≦ 。 floating height is measure from face of PCB substrate to the lowest point of ponent base of constructive ponent shall touch the face of PCB substrate (a,b,c,d point touch PCB) a,c兩點(diǎn)平貼 PCB或垂直 上浮，但 b,d兩點(diǎn)傾斜高度 ≦ 。 is rejected . 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Jumper Pins,Box Header)浮件 DIP ponent Assembly workmanship criteriaFloating of constructive ponent ( Jumper Pins , Box header ) PCB零件面。 PCB零件面 ，無浮高傾斜。 (X＞ ) Z＞ (被固定零件平貼於 PCB時(shí) )(MI) 5. Whichever is rejected Lh＞ mm Wh＞ mm X＞ Y≦ Y＞ Z≦ Z Z Z 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) DIP零件組裝工藝標(biāo)準(zhǔn) 立式電子零組件 (C,F,L,Buzzer)浮件 DIP ponent Assembly workmanship criteriaFloating of vertical electronic ponent ( C , F , L , Buzzer ) 。 Lmax判定拒收(MI) 。 (缺件 ) is rejected。 (MI) 。 。 。 。 the leads footprint is centered on the lands ，所偏 出焊墊以外的接腳，尚未 超過焊墊側(cè)端外緣。 is centered on both sides of the land . All the solder terminations shall pletely touch pad. ，但 尚未大於其零件寬度的 50% 。 (Y10 mil),(Y20 mil) length of ponent shifted off the pad(X) shall less the 1/3 Diameter of ponent toward the longest part of the ponent , the solder terminations still on the land (短邊 )突出焊墊端 部份是組件端直徑 33%以上 (MI)。 lead had shifted and footprint not over the end of land 允收狀況 (Accept Condition) ，已超過焊墊側(cè)端外