【正文】 CARD Lh CARD Lh≦ a b c d a,b兩點(diǎn)平貼 PCB或垂直 上浮 ,但 c,d兩點(diǎn)浮高＞ (MI)。 maximum height of ponent above the land is maximum touch neighboring ponent or No. interfering with neighbor ponent assembly 允收狀況 (Accept Condition) 1000μ F 10μ 16 + Wh≦ Wh＞ PCB零件面之 最大距離＞ (MI)。 。 (Y≦) PCB後左右 偏移量 ≦ 零件孔邊緣 。 (Lh≦ ) 。 (Lmax) 低於 。 。 and multilead ponents are oriented correctly symbols are visible after assembly ponents are as specified and terminate to correct lands ponents need not be oriented (錯(cuò)件 )(MA)。 solder ball and solder dross leave on PCB 、錫渣不論可被剝除者 或不易被剝除者 ,直徑 D或長(zhǎng) 度 L≦8mil() 。 。 is rejected . had touched the body (profile) of lead angle can not be visible clearly solder on the side of solder land 允收狀況 (Accept Condition) A B 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) SMT焊點(diǎn)性工藝標(biāo)準(zhǔn) 晶片狀 (Chip)零件之最小焊點(diǎn) (三面或五面焊點(diǎn) ) SMD solder joint workmanship criteriaMinimum solder fillet of chip ponent( 3 or 5 face terminations) 高度的 25%以上。 is rejected . concave fillet is less 3 face of solder flowup on the lead angle(h) under 1/2 angle height(T) is rejected 允收狀況 (Accept Condition) h1/2T A T B h ≧ 1/2T 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) SMT焊點(diǎn)性工藝標(biāo)準(zhǔn) J型接腳零件之焊點(diǎn)最大量工藝水準(zhǔn)點(diǎn) SMD solder joint workmanship criteriaMaximum solder of J type lead 兩側(cè)的頂部 (A,B)。 註： Ａ：引線上彎頂部 Ｂ：引線上彎底部 Ｃ：引線下彎頂部 Ｄ：引線下彎底部 flow up to the center between B,C point on the heel of lead 上彎曲處的底部 (B)。 焊錫帶。 joint around the edge of footprint without gap. solder fillet flows up end more than 1/2 thickness of lead on heel angle ＜ 90°on heel (U)低於引線腳周長(zhǎng) (2L+2W)的 1/2以上(U(L+W))。 (X≦ 1/4W ) 緣之垂直距離 ≧5mil ()以上。 lead had shifted the length from lead heel to end of land (X) shall be over the thickness of lead (T) ，腳跟剩 餘焊墊的寬度，已小於接腳 厚度 (XT)(MI)。 (X≦ 1/4W ) 緣之垂直距離 ≧5mil ()。 (Y1 ≧ 1/4W) Component is shifted towards longest part of the chip , but the termiuad end of chip still on the land to form. ，但零件端 電極蓋住焊墊小於其零件 寬度的 25%。華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Slot,Socket,DIM,Heat sink)傾斜 128 DIP ponent Assembly workmanship criteriaTilt of constructive ponent ( slot , socket , Dim , Heat sink ) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Jumper Pins,Box Header)浮件 129 DIP ponent Assembly workmanship criteriaFloating of constructive ponent ( Jumper Pins , Box header ) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Jumper Pins,Box Header)傾斜 130 DIP ponent Assembly workmanship criteriaTilt of constructive ponent ( Jumper Pins , Box header ) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (CPU Socket)浮件與傾斜 131 DIP ponent Assembly workmanship criteriaTilt and floating of constructive ponent ( CPU Socket ) DIP零件組裝工藝標(biāo)準(zhǔn)－ 機(jī)構(gòu)零件 (USB,DSUB,PS/2,K/B general con. Jack)浮件與傾斜 132 DIP ponent Assembly workmanship criteriaTilt and floating of constructive ponent ( USB , Dsub , PS/2 , K/B general connector Jack ) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Power Connector)浮件與傾斜 133 DIP ponent Assembly workmanship criteriaTilt and floating of constructive ponent ( Power Connector ) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Jumper Pins,Box Header)組裝外觀 (1)134 DIP ponent Assembly workmanship criteriaWorkmanship (1) of constructive ponent(Jumper Pin,Box header) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Jumper Pins,Box Header)組裝外觀 (2)135 DIP ponent Assembly workmanship criteriaWorkmanship(2) of constructive ponent(Jumper Pins,Box header) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (BIOS Socket)組裝外觀 (3） 136 DIP ponent Assembly workmanship criteriaWorkmanship (3) of constructive ponent ( BIOS Socket ) DIP零件組裝工藝標(biāo)準(zhǔn) 組裝零件腳折腳、未入孔 (1) 137 DIP ponent Assembly workmanship criteriaLead bend and noinside the hole (1) of assembley DIP零件組裝工藝標(biāo)準(zhǔn) 零件腳折腳、未入孔、未出孔 (2) 138 DIP ponent Assembly workmanship criteriaLead bend noinside nothrough (2) of the hole DIP零件組裝工藝標(biāo)準(zhǔn) 板彎、板翹、板扭 (平面度 ) 139 DIP ponent Assembly workmanship criteriaboard wrapage DIP零件組裝工藝標(biāo)準(zhǔn) 零件腳與線路間距 140 DIP ponent Assembly workmanship criteriathe space between lead to trace DIP零件組裝工藝標(biāo)準(zhǔn) 零件破損 (1) 141 DIP ponent Assembly workmanship criteriaponent broken (1) DIP零件組裝工藝標(biāo)準(zhǔn) 零件破損 (2) 142 DIP ponent Assembly workmanship criteriaponent broken (2) DIP零件組裝工藝標(biāo)準(zhǔn) 零件破損 (3) 143 DIP ponent Assembly workmanship criteriaponent broken (3) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (USB)偏移率 144 DIP ponent Assembly workmanship criteriaShifted rate of constructive ponent ( USB connector) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (DC Jack)對(duì)準(zhǔn)度 145 DIP ponent Assembly workmanship criteriaShifted rate of constructive ponent ( DC_In connector) DIP焊錫性工藝標(biāo)準(zhǔn) 零件面孔填錫與切面焊錫性標(biāo)準(zhǔn) (1) 146 DIP soldering workmanship the solder fillet in the PTH by crosssection (1) DIP焊錫性工藝標(biāo)準(zhǔn) 零件面孔填錫與切面焊錫性標(biāo)準(zhǔn) (2) 147 DIP soldering workmanship the solder fillet in the PTH by crosssection (2) DIP焊錫性工藝標(biāo)準(zhǔn) 焊錫面焊錫性標(biāo)準(zhǔn) (1) 148 DIP soldering workmanship soldering standard on solder side (1) DIP焊錫性工藝標(biāo)準(zhǔn) 焊錫面焊錫性標(biāo)準(zhǔn) (2) 149 DIP soldering workmanship soldering standard on solder side (2) DIP焊錫性工藝標(biāo)準(zhǔn) 焊錫面焊錫性標(biāo)準(zhǔn) (3) 150 DIP soldering workmanship soldering standard on solder side (3) DIP焊錫性工藝標(biāo)準(zhǔn) DIP插件孔焊錫性檢驗(yàn)圖示 151 DIP soldering workmanship Figure of PTH solder fillet evaluation DIP焊錫性工藝標(biāo)準(zhǔn) 焊錫性問(wèn)題 (錫橋、短路、錫裂 ) 152 DIP soldering workmanship soldering issue ( Bridge , short , crack ) DIP焊錫性工藝標(biāo)準(zhǔn) 焊錫性問(wèn)題 (空焊、錫珠、錫渣、錫尖 ) 153 DIP soldering workmanship soldering issue ( missing solder , solder b