【正文】 X≦1/3D X≦1/3D Y2＞ 0mil Y1＞ 0mil X＞ 1/3D X＞ 1/3D Y2≦ 0 mil Y1≦ 0 mil 註：為明瞭起見 ,焊點(diǎn)上的錫已 省去。 the leads footprint is centered on the lands ，所偏 出焊墊以外的接腳，尚未 超過(guò)接腳本身寬度的 1/4W 。 (S≧5mil()) length of the lead footprint shifted off the land(X)shall less 1/4 width of lead clearance(S)between lead shifted off and land shall over 5 mil() 允收狀況 (Accept Condition) W S X≦ 1/4W S≧ 5mil() X X1/4W S＜ 5mil() ，所偏 出焊墊以外的接腳，已超 過(guò)接腳本身寬度的 1/4W (MI)。 (S＜ 5mil()) is rejected . 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) SMT零件組裝工藝標(biāo)準(zhǔn) 鷗翼 (GullWing)零件腳趾之對(duì)準(zhǔn)度 SMD Assembly workmanship criteriaGullWing toe alingnment 墊的中央，而未發(fā)生偏 滑。 lead had shifted and footprint not over the end of land ，已 超過(guò)焊墊側(cè)端外緣 (MI)。 the leads footprint is centered on the lands ，腳跟 剩餘焊墊的寬度，最少保 有一個(gè)接腳厚度 (X≧T) 。 lead had shifted the length from lead heel to end of land (X) less the thickness of lead (T) 允收狀況 (Accept Condition) T X T X ≧T T XT 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) SMT零件組裝工藝標(biāo)準(zhǔn) 零件腳面 (Latch of CN2302) 之對(duì)準(zhǔn)度 SMD Assembly workmanship criteriaComponent footprint(Latch of CN2302) alignment ，而未發(fā)生偏滑。 lead had shifted and footprint not over the end of land 允收狀況 (Accept Condition) ，已超過(guò)焊墊側(cè)端外緣 A0mm or B0mm (MI)。 the leads footprint is centered on the lands 允收狀況 (Accept Condition) S W S≧ 5mil X≦ 1/4W S5mil X 1/4W ，所偏 出焊墊以外的接腳，已超 過(guò)接腳本身寬度的 1/4W (MI)。 (S＜ 5mil) is rejected . ，所偏 出焊墊以外的接腳，尚未 超過(guò)接腳本身寬度的 1/4W 。 (S≧5mil) The lead had shifted off the land length of lead shifted off the land (X) shall less 1/4 width of lead (W) clearance distance between shifted lead and land edge shall over 5 mil 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) SMT焊點(diǎn)性工藝標(biāo)準(zhǔn) 鷗翼 (GullWing)腳面與腳跟焊點(diǎn)最小量 SMD solder joint workmanship criteriaMinimum solder of Gull Wing footprint ,腳跟吃錫良好 焊錫帶。 face and footprint have good solder fillet fillet between land and lead shape(profile)of lead be clearly visible (U)至少涵蓋引線腳周長(zhǎng) (2L+2W)的 1/2以上(U≧ (L+W))。 (Heel)焊錫帶涵蓋高度 h大於零件腳 1/2厚度 (h≧ 1/2T)。 (U) of solder fillet between lead and land shall over 1/2 length of around the footprint(2L+2W) 。 。 (h1/2T) 。 (U) of solder fillet between lead and land less than 1/2 length of around the footprint(2L+2W) 。 solder fillet flows up end less than 1/2 thickness of lead on heel angle 90°on heel 允收狀況 (Accept Condition) L L h≧ 1/2T T h1/2T T w Edge of footprint 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) SMT焊點(diǎn)性工藝標(biāo)準(zhǔn) 鷗翼 (GullWing)腳面焊點(diǎn)最大量 SMD solder joint workmanship criteriaMaximum solder of Gull Wing footprint ,腳跟吃錫良好。 。 凸的焊錫帶。 solder flow up and concave fillet between land and lead solder fillet between side face of lead and land shape (profile) of lead (footprint) be clearly visible 頂部 (MI)。 is rejected . flow cover the end (TIP) of lead shape (profile) of lead not be visible clearly is rejected 拒收狀況 (Reject Condition) 允收狀況 (Accept Condition) 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) SMT焊點(diǎn)性工藝標(biāo)準(zhǔn) 鷗翼 (GullWing)腳跟焊點(diǎn)最大量 SMD solder joint workmanship criteriaMaximum solder of Gull Wing Heel 曲處底部 (B)與下彎曲處頂部 (C)間的中心點(diǎn)。 flow up to B point on the heel 彎曲處的底部 (B)，延伸過(guò) 高，且沾錫角超過(guò) 90度，才 拒收 (MI)。 。 concave fillet on the 4 face of lead flow up to the angle high point A,B shape(profile)can be clearly visible soldering joint at every solder contact 側(cè)的 50%以上 (h≧1/2T) 。 的 50%以下 (h1/2T)(MI)。 。 concave fillet on the 4 face of lead flow up to the angle high point A,B shape(profile)can be clearly visible soldering joint at every solder contact 曲處的上方 ,但在組件本 體的下方。 flow up to top of lead angle and not touch the body (profile)of lead angle can be visible clearly (MI)。 (MI)。 (h≧1/4T) 伸到焊墊的距離為晶片高 度的 25%以上。 (h＜ 1/4T) 伸到焊墊端的距離為晶片 高度的 25%以下 (MI)。 焊接面。 部的上方。 。 (MI)。 is rejected . 允收狀況 (Accept Condition) H