【正文】 第 頁 共 頁 是 在個人電腦內(nèi)進行。 （ 8）振蕩器和時鐘產(chǎn)生電路， 需要考慮 石英晶體微調(diào)能力。 諸如此類的單芯片電腦有很多種 ，如 8051，8031， 8751， 80C51BH， 80C31BH 等，其基本組成，基本性能和指令系統(tǒng)都是相同的。 球柵陣列（ BGA）封裝出現(xiàn)于 20 世紀 70 年代。商用電路封裝很快就發(fā)展到雙列直插式封裝（ dual inline package DIP） ,開始是陶瓷，之后是塑料。 在制造一個自排列 CMOS 的過程中，門層（多晶硅或金屬）穿過擴散層形成晶體管 。 19 世紀 30 年代始，研究者如貝爾實驗室的 William Shockley 通過研究，認為在化學(xué)元素周期表中的半導(dǎo)體硅元素是構(gòu)成固態(tài)真空管最可能的原料。現(xiàn)代計算，通信，制造和交通系統(tǒng)，包括互聯(lián)網(wǎng)，全 都依賴于集成電路的存在。由摩爾定律的現(xiàn)代釋義可知，集成電路中的晶體管數(shù)量，每兩年增加一倍。每 mm178。 20 世紀中期半導(dǎo)體制造技術(shù)的進步，使得集成電路成為可能。s law which, in its modern interpretation, states that the number of transistors in an integrated circuit doubles every two years. In general, as the 第 頁 共 頁 feature size shrinks, almost everything improves—the cost per unit and the switching power consumption go down, and the speed goes up. However, ICs with nanometerscale devices are not without their problems, principal among which is leakage current (see subthreshold leakage for a discussion of this), although these problems are not insurmo untable and will likely be solved or at least ameliorated by the introduction of highk dielectrics. Since these speed and power consumption gains are apparent to the end user, there is fierce petition among the manufacturers to use finer geometries. This process, and the expected progress over the next few years, is well described by the International Technology Roadmap for Semiconductors (ITRS). Only a half century after their development was initiated, integrated circuits have bee ubiquitous. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies. That is, modern puting, munications, manufacturing and transport systems, including the Inter, all depend on the existence of integrated circuits. Integrated circuits can be classified into analog, digital and mixed signal (both analog and digital on the same chip). Digital integrated circuits can contain anything from one to millions of logic gates, flipflops, multiplexers, and other circuits in a few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reduced manufacturing cost pared with boardlevel integration. These digital ICs, typically microprocessors, DSPs, and micro controllers work using binary mathematics to process one and zero signals. Analog ICs, such as sensors, power management circuits, and operational amplifiers, work by processing continuous signals. They perform functions like amplification, active filtering, demodulation, mixing, etc. ICs can also bine analog and digital circuits on a single chip to create functions such as A/D converters and D/A converters. Such circuits offer smaller size and lower cost, but must carefully account for signal interference. The semiconductors of the periodic table of the chemical elements were identified as the most likely materials for a solid state vacuum tube by researchers like William Shockley at Bell Laboratories starting in the 1930s. Starting with copper oxide, proceeding to germanium, then silicon, the materials were systematically studied in the 1940s and 1950s. Today, silicon monocrystals are the main substrate used for integrated circuits (ICs) although some IIIV pounds of the periodic table such as gallium arsenide are used for specialized applications like LEDs, lasers, solar cells and the highestspeed integrated circuits. It took decades to perfect methods of creating crystals without defects in the crystalline structure of the