【正文】 HOLE IN THE GROUND IS ㎜ . Ground A︰ S/M 圈 B︰ HOLE R 敬鵬 (蘇州 )電子有限公司 ACP. ELECTRONICS CO., LTD. F:\EN\002 6 LEGEND amp。 COLOR： BLACK、 WHITE、 BLUE AND GREEN。 THICKNESS OF HOT AIR LEVELING： m～ 50μ m。 SPECIAL SPEC.： m（ 1μ inch）～ m（ 20μ inch）。０．１㎜ 。０．０５ 方孔 SLOTS 177。０．０５㎜ 熱 沖 PAPER PHENOLIC Ｍｉｎ．177。 ㎜。 ㎜。 PUSHBACK 1) 開模 PUNCHING PROCESS 最小板厚要求 MIN THK 孔徑公差要求 TOOL. OF HOLE LOCATION 模具套數(shù) TOOLS REQUIRED １．２㎜ ≧０．３０㎜ 兩套 （２ SET） １．２㎜ 177。 WIDTH OF THE OUTLINE SUPPORTING FRAME： Min. 8 ㎜ 4) 單片外形設(shè)計為方者易板彎，故須加透氣孔於轉(zhuǎn)角處，以防板彎。 。 177。 177。 177。 177。 板厚 ㎜， VCUT 深度須≧ ㎜。０．３以上 177。 SPACING TO CONDUCTORS Min： ㎜。 ㎜。 EDGE OF BOARD TO VCUT Min： 5 ㎜。(即θ =15176。 IF THE CUTTING LINE IS SKIPPINGCUT, THE SPEC. MUST BE ADD ㎜ IN THE ABOVE LIST. VCUT 上下刀準確度 ︰177。 THE EDGE OF DIRECTION IS PARALLEL WITH VCUT LINE. Y X X︰ 50~450 ㎜ Y︰ 50~450 ㎜ D θ 176。2)℃ 95%.(500177。 2℃ )30 mins}10 cycles 測試後電阻值變化率小於 50% VARIATION OF RESISTANCE LESS THAN 50% 四 焊錫性試驗 SOLDER DIPPING TEST (260177。2℃， 90～ 95％ .) (500177。 50％ 耐熱特性試驗 (HEAT RESIST TEST) PRIOR TO RESISTANCE TESTING， THE SPECIMEN SHALL BE PROCESSED AS FOLLOWING PROCEDURE. 1)STORE IN A CHAMBER WITH (100177。 50％ 冷熱循環(huán)特性試驗 (HEAT CYCLE TEST) PRIOR TO RESISTANCE TESTING， THE SPECIMEN SHALL BE PROCESSED AS FOLLOWING PROCEDURE. 1)A CYCLE OF (40177。 50％ 敬鵬 (蘇州 )電子有限公司 ACP. ELECTRONICS CO., LTD. F:\EN\002 24 焊錫性試驗 (SOLDER DIPPING) PRIOR TO RESISTANCE TESTING， THE SPECIMEN SHALL BE PROCESSED AS FOLLOWING PROCEDURE. 1)A CYCLE OF [ WAVE SOLDERING AT (260177。 10) ℃ AND STAYS AT THE TEMPERATURE FOR 80 SECS. 2)HEATING TO 240℃ MAX. AT A STATED FREQUENCY. STAY AT THE TEMP. FOR 10 SECS MAX. 3) COOLING TO ROOM TEMP. AT A STATED FREQUENCY. 4) THE TOTAL TESTING TIME SHALL BE LESS THAN 180 SECS. VARIANCE OF RESISTANCE ON CARBON JUMPER MUST BE LESS THAN 177。 50％ 耐溶劑試驗 (RESISTANCE VARIANCE ON SOLVENT DIPPING) PRIOR TO RESISTANCE TESTING， THE SPECIMEN IS TO BE PROCESSED AS FOLLOWING PROCEDURE. 1) DIPPED IN ANY ONE OF THE FOLLOWING CHEMICALS FOR 10 MINS. FLUOROTRICHLOROETHYLENE ACETOBENZENCHLORIDE 100 ㎜ 3 ㎜3 ㎜ 敬鵬 (蘇州 )電子有限公司 ACP. ELECTRONICS CO., LTD. F:\EN\002 26 METHANOL ACETONE 2) WIPED TO DRY. 3) PUT IN ROOM TEMP. FOR (24177。 50 ％ 。 50 ％ 耐撞擊試驗 (HITS LIFE TEST) TEST CONDITION 1) TEMPERATURE ： ROOM TEMP. 2) RELATIVE HUMIDITY ： 70～ 80 ％ 3) HITS FORCE ： 450177。10 ROOM TEMP 80 SECS 10 SEC 180 SEC MAX. 敬鵬 (蘇州 )電子有限公司 ACP. ELECTRONICS CO., LTD. F:\EN\002 25 A PIECE OF 3M TRANSPARENT TAPE， LONGER THAN 50 mm， MUST BE STICKED ONTO THE CARBON JUMPER WITHOUT ANY BUBBLE UNDER THE TAPE. 10 SECS AFTER STICKKING THE TAPE， PEEL IT UP WITH A RIGHT ANGLE. THERE SHOULD BE NO CARBON PEELED OFF. 彎曲特性試驗 (BENDING TEST) AS SHOWN IN THE FOLLOWING FIGURE ， A PIECE OR PCB， WITH 100 mm LENGTH ， IS TO BE BEND 3 mm UP AND DOWN FOR TEN TIMES PRIOR TO RESISTANCE TESTING. VARIANCE OF RESISTANCE ON BENDING MUST BE LESS THAN 177。 15) MINS. VARIANCE OF RESISTANCE ON CARBON JUMPER MUST BE LESS THAN 177。2) ℃ 30 MINS FOR 10 TIMES. 2) PUT IN ROOM TEMP. FOR (60177。12) HRS. 2) COOLING AT ROOM TEMP. FOR (60177。2) ℃ (60177。 AS SHOWN ON PAGE 28 ITEM 。2)℃ (500177。 W 圖 切槽示