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手機(jī)結(jié)構(gòu)2d圖技術(shù)標(biāo)注參考規(guī)范-wenkub

2023-04-22 23:09:32 本頁(yè)面
 

【正文】 NS透明部分要求在黑色背景檢查,要求表面無(wú)變形,無(wú)黑白點(diǎn)及其它瑕疵。 Unspecified dimensions refer to Pro/e 3D model data。 Texture: polished to mirror .1環(huán)境要求:產(chǎn)品應(yīng)在十萬(wàn)級(jí)以上工作室清潔、包裝. Environment requirement: Product should be made and packaged in clean condition.12. 包裝與運(yùn)輸: 零件需獨(dú)立包裝,產(chǎn)品兩表面需有靜電保護(hù)膜, 放入托盤對(duì)應(yīng)的凹穴,托盤層堆放入紙箱。 LENS transparent area should be checked in black background, no flaws. 5)印刷部分要求色彩均勻、無(wú)劃傷、黑白點(diǎn)、瑕疵。 Material: PMMA VRL40(Mutusubishi), transparent color and with 100% virgin material.5. 外觀: Appearance: 1)所有圓角半徑和脫模斜度按照Pro/e 3D Data。Unspecified dimensions refer to Pro/e 3D model data。 Package and Transport: Product should be packaged independent, and lay in tray, finally put the trays in the paper box。C 48h 5% NaCl salt fog concentration, it can not be rusty after 48hs 跌落試驗(yàn):,6面3棱1角分別跌落,水泥地面, 兩輪共20次跌落,電池功能正常,外觀無(wú)明顯損傷。 Specified dimensions with marked ring are critical dimensions, need to be checked every shipment, and must do CP/CPK check in the Qualification stage.。After ultrasonic welt,burr is forbidden around battery。 Package of product should be quantitative, sealed, dustless and dampproof .04. BATTERY。 and must do CP/CPK check in the Qualification stage。4. 螺絲孔做(不做)銅化處理。 The vertex of the rightangle indicate the center of the ponets . Location of IO Conn /Audio jack etc. base on the PCB orientation holes。放置屏蔽罩時(shí),罩內(nèi)元件限高; (No Shielding)指可以放置屏蔽罩區(qū)域。 performance shall be according to spec: violet1Antenna : 范圍:見(jiàn)噴漆圖; 油漆顏色及色差:△E≤1; 噴漆厚度: 底漆810 um;UV1012 um; 油漆硬度:2H,500gf; 油漆耐磨:RCA 300 cycles; 油漆附著力:百格實(shí)驗(yàn),脫落面積≤3%.:Painting range:refer to the painting drawing.Paint color and aberration: △E≤1 Paint thickness:BC 810 um;UV1012 um;Paint hardness test: 2H,500gfPaint abrasion test: RCA 300 cyclesPaint peeling test: area of peeling≤3%.:零件獨(dú)立包裝,放入托盤對(duì)應(yīng)的凹穴,托盤層堆放入紙箱。澆口凸出≤。 Specified dimensions with marked ring are critical dimensions, need to be checked every shipment, and must do CP/CPK check in the Qualification stage.:未注公差依照?qǐng)D面公差表。 標(biāo)有環(huán)形圈的是重點(diǎn)尺寸,每批次出貨均需檢查,Qualify時(shí)需要做CP/CPK;: Specified dimensions in the drawing are used to check outside shape, function and assembly。 gate trim should be less than 。 外觀皮紋: VDI 24。 飛邊及分型線段差≤。 Unspecified dimensions refer to Pro/e 3D model data。 標(biāo)有環(huán)形圈:每批次出貨均需檢查;Qualify時(shí)需要做CP/CPK。文件類型文件編號(hào)版本結(jié)構(gòu)2D NOTE頁(yè)數(shù)有效期限保密級(jí)管理辦法28/282005/07/01—2008/07/01保密德信無(wú)限通訊科技(上海)有限公司TechFaith Wireless Communication Technology (Shanghai) Co.,LTD.結(jié)構(gòu)2D圖 技術(shù)標(biāo)注參考規(guī)范文件編號(hào) :QC1001保密等級(jí) :保密文件類型 :管理辦法有效期 :3年頁(yè)數(shù) :1/28版本 : 編制日期 :2004/05/24開(kāi)始執(zhí)行日:2005/07/01NO編制/變更日期變更理由變更內(nèi)容版本編制/修改人批準(zhǔn)12004/05/24新編沈林王迅22006/01/04修改將2D標(biāo)準(zhǔn)樣板圖中技術(shù)標(biāo)注更新到本文件中蔣偉鵬丁勇目錄索引01. Latch02. Antenna PCBA limited drawing PCBA outline drawing04. Battery Lens(注塑) Lens(CNC) Audio cover RF_switch_cover Shielding cover Shielding frame Spring08. Metal dome09. Stop TPU10. Light guide 11. Fpcba 金屬裝飾件 Logo Plating plastic Electroform 雙面膠 泡棉 銅箔 絕緣片 Keypad asm keypad rubber Keypad 電鍍鍵帽 Keypad 數(shù)字鍵 外觀漆噴漆圖 導(dǎo)電漆噴漆圖16. Housing part drawing17. Housing Assembly18. Explode01. Latch技術(shù)要求(Notes):1. 材料:POM Dupont500, 用100%原材料。 Dimension: Specified dimensions in the drawing are used to check outside shape, function and assembly。 Specified dimensions with marked ring are critical dimensions, need to be checked every shipment, and must do CP/CPK check in the Qualification stage.3. 公差:未注公差依照?qǐng)D面公差表。頂桿痕≤。 Appearance:Product should be tidy and purity, no nick, no shrinkage and other blemish。 Cavity number shall be located low on the surface. Appearance require:VDI 24.5. 檢測(cè)須滿足德信質(zhì)量標(biāo)準(zhǔn):《》 Product should be satisfied with quality standard of Techfaith Wireless:《》02. Antenna1. 材料:見(jiàn)圖,用100%原材料。返回索引目錄 Unspecified round: 。3. Tolerance: Unspecified tolerance should ply with tolerance table in the drawing。穴號(hào)應(yīng)刻在模具上,標(biāo)志不得高于表面。 and Transport: Product should be packaged independent, and lay in tray, finally put the trays in the paper box。不放置屏蔽罩時(shí)元件限高; Limiting Height for shielding area is only for electronic ponets inside , not including shielding and the mechanical electronic ponents been included in this drawing。3. 器件布置時(shí)元件PAD 不能超出限高區(qū)域邊界線。 Screw hole is PTH(NPTH) type. PCBA outline drawing1. 圖面尺寸用于檢驗(yàn)PCB外形、功能和裝配。3. 未注公差參照?qǐng)D面公差表。Using double adhesive between battery rear cover and cell。The welding should be fastness and dependable, no falsewelding,deformation in heignt should be less than .: 圖面尺寸用于檢驗(yàn)零件外形、功能和裝配。 Batt_conn must be gilt, coating thickness must be no less than 鹽霧試驗(yàn):35℃,5% 氯化鈉溶液,48小時(shí)后無(wú)腐蝕。 drop test: 6 faces (Left Back Right Bottom Top Front) , 3 edges 1corner ,1 drop per face,edge 。: Product should be satisfied with quality standard of Techfaith Wireless: 《部品檢驗(yàn)標(biāo)準(zhǔn)_注塑件》V 。2. 重點(diǎn)尺寸:標(biāo)有環(huán)形圈。 Round and draft should ply with Pro/e 3D Data 2)未注脫模斜度為1度,。 Print area shoudle be uniformity, no nick , no flaws. 6)印刷字體及顏色請(qǐng)參照右下腳表。 Package and Transport: Product should be packaged independent, and lay in tray, 返回索引目錄 finally put the trays in the paper box。 2. 重點(diǎn)尺寸:標(biāo)有環(huán)形圈。 LENS transparent area should be checked in black background, no flaws. 2)印刷部分要求色彩均勻、無(wú)劃傷、黑白點(diǎn)、瑕疵。 The ply adhesion of printing ink : ≤3% ,no hwale pane desquamate.環(huán)境要求:產(chǎn)品應(yīng)在十萬(wàn)級(jí)以上工作室清潔、包裝. Environment requirement: Product should be made and packaged in clean condition.11. 包裝與運(yùn)輸:返回索引目錄 零件需獨(dú)立包裝,產(chǎn)品兩表面需有靜電保護(hù)膜, 放入托盤對(duì)應(yīng)的凹穴,托盤層堆放入紙箱。3SHA,用100%原材料。 標(biāo)有環(huán)形圈的是重點(diǎn)尺寸,每批次出貨均需檢查,Qualify時(shí)需要做CP/CPK。 Unspecified dimensions refer to Pro/e 3D model data。
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