【正文】 .................................................................................................................. 5 11 市場(chǎng)分析 ..................................................................................................... 5 12 設(shè)計(jì)要求 ..................................................................................................... 6 121 功能要求： ............................................................................................................ 6 122 性能要求： ............................................................................................................. 7 123 成本要求： ............................................................................................................. 7 13 設(shè)計(jì)意義 ..................................................................................................... 7 二 .方案論證 ...................................................................................................................................... 8 方案一： ............................................................................................................. 8 方案二： ............................................................................................................. 8 三．方案選定 ................................................................................................................................... 8 四．總體設(shè)計(jì)方案 ......................................................................................................................... 8 41 系統(tǒng)設(shè)計(jì)思路： ....................................................................................... 8 42 系統(tǒng)框圖如下： ....................................................................................... 9 43 系統(tǒng)運(yùn)行過(guò)程： .................................................................................... 10 五．詳細(xì)設(shè)計(jì)方案 .......................................................................................................................10 51 硬件設(shè)計(jì)方案 ....................................................................................... 10 511 音控模塊設(shè)計(jì) .......................................................................................................10 512 密碼輸入及 LCD 顯示模塊設(shè)計(jì) ....................................................................28 513 HCSR501 紅外感應(yīng)模塊設(shè)計(jì) ......................................................................28 514 DS3231 萬(wàn)年歷及 EEPROM AT24C32 外存設(shè)計(jì) .....................................30 515 電源模塊設(shè)計(jì) .....................................................................................................32 516 電機(jī)驅(qū)動(dòng)模塊設(shè)計(jì) ............................................................................................32 517 LM393 紅外接近開(kāi)關(guān)模塊設(shè)計(jì) .....................................................................34 518 總體硬件設(shè)計(jì) .....................................................................................................36 52 軟件設(shè)計(jì)方案 ..................................................................................... 36 521 音控模塊驅(qū)動(dòng)程序設(shè)計(jì) ....................................................................................36 522 密碼輸入及 LCD 顯示模塊驅(qū)動(dòng)程序設(shè)計(jì) .................................................36 523 紅外感應(yīng)模塊驅(qū)動(dòng)程序設(shè)計(jì) .........................................................................36 524 萬(wàn)年歷及 LCD 顯示模塊驅(qū)動(dòng)程序設(shè)計(jì) ......................................................36 525 電機(jī)驅(qū)動(dòng)與傳感模塊程序設(shè)計(jì) .....................................................................36 526 用戶(hù) 程序設(shè)計(jì) .....................................................................................................36 六．調(diào)試 ..........................................................................................................................................36 61 硬件和軟件分別調(diào)試 ......................................................................... 36 62 硬件和軟件模擬聯(lián)調(diào) ......................................................................... 36 63 制作樣品及調(diào)試 .................................................................................. 36 64 樣品在不同環(huán)境中使用測(cè)試（無(wú)） ............................................. 36 七．量產(chǎn)型成品設(shè)計(jì)（無(wú)） .....................................................................................................36 71 成品外觀設(shè)計(jì) ....................................................................................... 36 72 成品調(diào)試 ................................................................................................ 36 73 成品的使用環(huán)境和功能測(cè)試 ........................................................... 36 八．成品定型和編寫(xiě)用戶(hù)手冊(cè)（無(wú)） ..................................................................................37 九．結(jié)束語(yǔ) .....................................................................................................................................37 十．參考文獻(xiàn)及教程 ...................................................................................................................37 十一 .致 謝 ..................................................................................................................................38 十二 .附錄 .........................................................................................................................................38 附錄一：系統(tǒng)電路圖 .................................................................................. 38 附錄二：控制程序 ...............................