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品質(zhì)管理英文術(shù)語(yǔ)大全(已修改)

2025-04-30 09:00 本頁(yè)面
 

【正文】 品質(zhì)管理 的英文術(shù)語(yǔ)大全從事品質(zhì)工作以來積累的常用英語(yǔ),希望對(duì)有需要的朋友有所幫助!品質(zhì)專業(yè)英語(yǔ)大全零件材料類的專有名詞CPU: central processing unit(中央處理器)IC: Integrated circuit(集成電路)Memory IC: Memory Integrated circuit(記憶集成電路)RAM: Random Access Memory(隨機(jī)存取存儲(chǔ)器)DRAM: Dynamic Random Access Memory(動(dòng)態(tài)隨機(jī)存取存儲(chǔ)器)SRAM: Staic Random Access Memory(靜態(tài)隨機(jī)存儲(chǔ)器)ROM: Readonly Memory(只讀存儲(chǔ)器)EPROM:Electrical Programmable Readonly Memory(電可抹只讀存諸器)EEPROM: Electrical Erasbale Programmable Readonly Memory(電可抹可編程只讀存儲(chǔ)器)CMOS: Complementary MetalOxideSemiconductor(互補(bǔ)金屬氧化物半導(dǎo)體)BIOS: Basic Input Output System(基本輸入輸出系統(tǒng))Transistor:電晶體LED:發(fā)光二極體Resistor:電阻Variator:可變電阻Capacitor:電容Capacitor array:排容Diode:二極體Transistor:三極體Transformer:變壓器(ADP)Oscillator:頻率振蕩器(0sc)Crystal:石英振蕩器XTAL/OSC:振蕩產(chǎn)生器(X)Relay:延時(shí)器Sensor:感應(yīng)器Bead core:磁珠Filter:濾波器Flat Cable:排線Inductor:電感Buzzer:蜂鳴器Socket:插座Slot:插槽Fuse:熔斷器Current:電流表Solder iron:電烙鐵Magnifying glass:放大鏡Caliper:游標(biāo)卡尺Driver:螺絲起子Oven:烤箱TFT:液晶顯示器Oscilloscope:示波器Connector:連接器PCB:printed circuit board(印刷電路板)PCBA: printed circuit board assembly(電路板成品)PP:并行接口HDD:硬盤FDD:軟盤PSU:power supply unit(電源供應(yīng)器)SPEC:規(guī)格Attach:附件Case: 機(jī)箱,蓋子Cover:上蓋Base:下蓋Bazel:面板(panel)Bracket:支架,鐵片Lable:貼紙Guide:手冊(cè)Manual:手冊(cè),指南Card:網(wǎng)卡Switch:交換機(jī)Hub:集線器Router:路由器Sample:樣品Gap:間隙Sponge:海綿Pallet:棧板Foam:保利龍F(tuán)iber:光纖Disk:磁盤片PROG:程序Barcode:條碼System:系統(tǒng)System Barcode:系統(tǒng)條碼M/B:mother board:主板CDROM:光驅(qū)FAN:風(fēng)扇Cable:線材Audio:音效K/B:Keyboard(鍵盤)Mouse:鼠標(biāo)Riser card:轉(zhuǎn)接卡Card reader:讀卡器Screw:螺絲Thermal pad:散熱墊Heat sink:散熱片Rubber:橡膠墊Rubber foot:腳墊Bag:袋子Washer:墊圈Sleeve:袖套Config:機(jī)構(gòu)Label hipot:高壓標(biāo)簽Firmware label:燒錄標(biāo)簽Metal cover:金屬蓋子Plastic cover:塑膠蓋子Tape for packing:包裝帶Bar code:條碼Tray:托盤Collecto:集線夾Holder:固定器,L鐵Connecter:連接器IDE:集成電路設(shè)備,智能磁盤設(shè)備SCSI:小型計(jì)算機(jī)系統(tǒng)接口Gasket:導(dǎo)電泡棉AGP:加速圖形接口PCI:周邊組件擴(kuò)展接口LAN:局域網(wǎng)USB:通用串形總線架構(gòu)Slim:小型化COM:串型通訊端口LPT:打印口,并行口Power cord:電源線I/O:輸入,輸出Speaker:揚(yáng)聲器EPE:泡棉Carton:紙箱Button:按鍵,按鈕Foot stand:腳架部門名稱的專有名詞QS:Quality system品質(zhì)系統(tǒng)CS:Coutomer Sevice 客戶服務(wù)QC:Quality control品質(zhì)管理IQC:Ining quality control 進(jìn)料檢驗(yàn)LQC:Line Quality Control 生產(chǎn)線品質(zhì)控制IPQC:In process quality control 制程檢驗(yàn)FQC:Final quality control 最終檢驗(yàn)OQC:Outgoing quality control 出貨檢驗(yàn)QA:Quality assurance 品質(zhì)保證 SQA:Source(supplier) Quality Assurance 供應(yīng)商品質(zhì)保證(VQA)CQA:Customer Quality Assurance客戶質(zhì)量保證PQA rocess Quality Assurance 制程品質(zhì)保證QE:Quality engineer 品質(zhì)工程CE:ponent engineering零件工程EE:equipment engineering設(shè)備工程ME:manufacturing engineering制造工程TE:testing engineering測(cè)試工程PPE roduct Engineer 產(chǎn)品工程IE:Industrial engineer 工業(yè)工程ADM: Administration Department行政部RMA:客戶退回維修CSDI:檢修PC:producing control生管MC:mater control物管GAD: General Affairs Dept總務(wù)部A/D: Accountant /Finance Dept會(huì)計(jì)LAB: Laboratory實(shí)驗(yàn)室DOE:實(shí)驗(yàn)設(shè)計(jì)HR:人資PMC:企劃RD:研發(fā)W/H:倉(cāng)庫(kù)SI:客驗(yàn)PD: Product Department生產(chǎn)部PA:采購(gòu)(PUR: Purchaing Dept)SMT:Surface mount technology 表面粘著技術(shù)MFG:Manufacturing 制造MIS:Management information system 資迅管理系統(tǒng)DCC:document control center 文件管制中心廠內(nèi)作業(yè)中的專有名詞QT:Quality target品質(zhì)目標(biāo)QP:Quality policy目標(biāo)方針QI:Quality improvement品質(zhì)改善CRITICAL DEFECT:嚴(yán)重缺點(diǎn)(CR)MAJOR DEFECT:主要缺點(diǎn)(MA)MINOR DEFECT:次要缺點(diǎn)(MI)MAX:Maximum最大值MIN:Minimum最小值DIA iameter直徑DIM imension尺寸LCL:Lower control limit管制下限UCL:Upper control limit管制上限EMI:電磁干擾ESD:靜電防護(hù)EPA:靜電保護(hù)區(qū)域ECN:工程變更ECO:Engineering change order工程改動(dòng)要求(客戶)ECR:工程變更需求單CPI:Continuous Process Improvement 連續(xù)工序改善Compatibility:兼容性Marking:標(biāo)記DWG rawing圖面Standardization:標(biāo)準(zhǔn)化Consensus:一致Code:代碼ZD:Zero defect零缺點(diǎn)Tolerance:公差Subject matter:主要事項(xiàng)Auditor:審核員BOM:Bill of material物料清單Rework:重工ID:identification識(shí)別,鑒別,證明PILOT RUN: (試投產(chǎn))FAI:首件檢查FPIR:First Piece Inspection Report首件檢查報(bào)告FAA:首件確認(rèn)SPC:統(tǒng)計(jì)制程管制CP: capability index(準(zhǔn)確度)CPK: capability index of process(制程能力)PMP:制程管理計(jì)劃(生產(chǎn)管制計(jì)劃)MPI:制程分析DAS efects Analysis System 缺陷分析系統(tǒng)PPB:十億分之一Flux:助焊劑P/N:料號(hào)L/N:Lot Number批號(hào)Version:版本Quantity:數(shù)量Valid date:有效日期MILSTD:MilitaryStandard軍用標(biāo)準(zhǔn)ICT: In Circuit Test (線路測(cè)試)ATE:Automatic Test Equipment自動(dòng)測(cè)試設(shè)備MO: Manafacture Order生產(chǎn)單T/U: Touch Up (錫面修補(bǔ))I/N:手插件P/T:初測(cè)F/T: Function Test (功能測(cè)試終測(cè))AS 組立P/K:包裝TQM:Total quality control全面品質(zhì)管理MDA:manufacturing defect analysis制程不良分析(ICT)RUNIN:老化實(shí)驗(yàn)HIpot:高壓測(cè)試FMI:Frequency Modulation Inspect高頻測(cè)試DPPM: Defect Part Per Million (不良率的一種表達(dá)方式:百萬(wàn)分之一) %Corrective Action: (CAR改善對(duì)策)ACC:允收REJ:拒收S/S:Sample size抽樣檢驗(yàn)樣本大小SISIV:Special ISpecial IV特殊抽樣水平等級(jí)CON:Concession / Waive特采ISO:國(guó)際標(biāo)準(zhǔn)化組織ISA:Industry Standard Architecture工業(yè)標(biāo)準(zhǔn)體制結(jié)構(gòu)OBA:開箱稽核FIFO:先進(jìn)先出PDCA:管理循環(huán)Plan do check action計(jì)劃,執(zhí)行,檢查,總結(jié)(計(jì)劃,實(shí)施,檢查,處置)WIP:在制品(半成品)S/O: Sales Order (業(yè)務(wù)訂單)P/O: Purchase Order (采購(gòu)訂單)P/R: Purchase Request (請(qǐng)購(gòu)單)AQL:acceptable quality level允收品質(zhì)水準(zhǔn)LQL。Limiting quality level最低品質(zhì)水準(zhǔn)QVL:qualified vendor list合格供應(yīng)商名冊(cè)AVL :認(rèn)可的供貨商清單(Approved Vendor List)QCD: Quality cost delivery(品質(zhì),交期,成本)MPM:Manufacturing project management制造專案管理KPI:Key performance indicate重要績(jī)效指標(biāo)MVT:Manufacturing Verification Test制造驗(yàn)證試產(chǎn)Q/R/S:Quality/Reliability/Service質(zhì)量/可靠度/服務(wù)STL:ship to line(料到上線)NTF:No trouble found誤判CIP:capacity improvement plan(產(chǎn)能改善計(jì)劃)MRB:material review board(物料審核小組)MRB:Material reject bill退貨單JIT:just in time(即時(shí)管理)5S:seiri seiton seiso seiketsu shitsuke(整理,整頓,清掃,清潔,修養(yǎng))SOP:standard operation process(標(biāo)準(zhǔn)作業(yè)程序)SIP:Specification inspection process制程檢驗(yàn)規(guī)格TOP: Test Operation Process (測(cè)試作業(yè)流程)WI: working instruction(作業(yè)指導(dǎo)書)SMD:surface mounting device(表面粘著原件)FAR:failure aualysis report故障分析報(bào)告CAR:Corrective action report改善報(bào)告BPR: 企業(yè)流程再造 (Business Process Reengineering)ISAR :首批樣品認(rèn)可(Initial Sample Approval Request)JIT:實(shí)時(shí)管理 (Just In Time)QCC :品管圈 (Quality Control Circle)Engineering Department (工程部)TQEM: Total Quality Environment Management(全面品質(zhì)環(huán)境管理)PD: Production Department (制造)LOG: Logistics (后勤支持) Shipping: (進(jìn)出口)AOQ:Average Output Quality平均出貨質(zhì)量AOQL:Average Output Quality Level平均出貨質(zhì)量水平FMEA:failure model effectiveness analysis失效模式分析CRB: Change Review Board (工程變更
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