軟硬結(jié)合板設(shè)計(jì)制作指引與生產(chǎn)控制要點(diǎn)-文庫(kù)吧
2025-02-17 15:23 本頁(yè)面
【正文】 v e 25 181。mCopp er 3 12 181。mP I f l ex Core P ol y i m i de 50 181。mCopp er 4 12 181。mA dh en s i v e 25 181。mCov erla y P I s ti f f erner 13 181。mNo f l ow prepreg 45 181。m No f l ow P PCopp er 5 12 181。m31 181。mNo f l ow prepreg 58 181。m No f l ow P PCopp er 6 12 181。m41 181。mS ol de r Res i s t 20 181。m s ol de r m as kT ota l 512 181。mF CCLc ov erla yc ov erla y常見(jiàn)結(jié)構(gòu)及工藝流程（ 2+HDI 6L） ? 1+1F+2F+1F+1 ： 2+HDI結(jié)構(gòu) L3L4 Board cutting –Mech. Drill–Shadow Button Image– Button plate I/L D/F – I/L exposure – DES –– AOI– . – Sticking Cover lay – Pressing cover lay – ENIG– Punch FingerMeasuring expansion Coefficient –PE Punch FQC L2/L5 Board cutting (Single side FCCL Preparation) L25 NF PP Open – Plasma – . – Pressing(L2L34L5) – Laser Drill –– Desmear – PTH+ Flash –Panel Plate—IL D/F – DES –UV Cut PI AOI —B/O L16 Pressing—Laser Drill—Mech. Drill – Deburr – Desmear – PTH+ Flash —Panel Plate—D/F DES—AOI—S/M – C/M – ENIG –PreRouting – Laser Decap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing L a y e r T y p eC u s t.D e s i g nMa te r i a l ty p e C o p p e r c o n te n t F i n i s h e ds o l d e r m a s k 20um PS R 4 0 0 0 30umL1 F o i l +p l a t i n g 30um H 4 6 . 2 0 % 35umN o rm a l PP 60um 1 0 8 0 R C 6 2 % 44um R1566WL2 Copper 30um H 5 5 . 3 0 % 35umco re 100um 4 m i l 100umL3 Copper 18um H 5 0 . 3 0 % 15umC o v e rl a y 13um R1566VAD 15umL4 Copper Copper 18um 18um H 5 7 . 8 0 % 15umPI PI 25um 25um 1 m i l 25umL5 Copper Copper 18um 18um H 3 2 . 4 0 % 15umAD 15um R1566VC o v e rl a y 13umL6 Copper 18um H 5 4 . 4 0 % 15umco re 100um 4 m i l 100umL7 Copper 30um H 5 4 . 8 0 % 35umN o rm a l PP 60um 1 0 8 0 R C 6 2 % 44um R1566WL8 F o i l +p l a t i n g 30um H 4 5 . 9 0 % 35ums o l d e r m a s k 20um PS R 4 0 0 0 30umT o t a l : 777um 743umSta c k u p100um100umN o F l o w PPN o F l o w PP 2 1 1 6 R C 4 7 %2 1 1 6 R C 4 7 %83um86um1+HDI硬板夾軟板的層壓結(jié)構(gòu) 常見(jiàn)結(jié)構(gòu)及工藝流程（ 1+HDI 8L） L4L5 Board cutting –I/L D/F – I/L exposure – DES –AOI – . – Sticking Cover lay – Pressing cover lay –Measuring expansion Coefficient – PE Punch FQC L23/L67 Board cutting – I/L DF– IL exposure– DES– PE Punch AOI—. L27 NF PP Open – Plasma – . – Pressing(L23L45L67) – Mech. Drill –– Desmear – PTH+ Flash –Panel Plate—IL D/F – DES – AOI —B/O L16 Pressing—Laser Drill—Mech. Drill – Deburr – Desmear – PTH+ Flash —Panel Plate—D/F DES—AOI—S/M – C/M – ENIG –PreRouting – Laser Decap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing 兩次壓合 2+HDI 硬板夾軟板的結(jié)構(gòu) 常見(jiàn)結(jié)構(gòu)及工藝流程（ 2+HDI 8L） L4L5 Board cutting –I/L D/F – I/L exposure – DES–– AOI– . – Sticking Cover lay – Pressing cover lay – Measuring expansion Coefficient PE Punch – FQC L3/L6 Board cutting—I/L D/F—DES（蝕刻單面） — PE Punch—AOI—B/O L25 NF PP Open – Plasma – . – Pressing(L2L34L5) – Mech. Drill – Deburr – Desmear – PTH+ Flash –Panel Plate—IL D/F – DES – AOI —B/O L27 Pressing—Laser Drill— Deburr – Desmear – PTH+ Flash Panel Plate— IDF DES—AOI— L16 Pressing—Laser Drill—Mech. Drill – Deburr – Desmear – PTH+ Flash —Panel plate DF—DES—AOI—S/M – C/M – ENIG –PreRouting – Laser Decap Adhere Shielding Film Press shielding film– Laser Routing – Routing – ET – FQC – Packing 三次壓合 +一次屏蔽膜壓板 L a y e r T y p eG M E p r o p o s a lM a t e r i a l t y p eFi n i s h e dS o l d e r m a s k P S R 4 0 0 0 25umL1 C o p p e r H 35umC o v e r l a y 12umAD 25umL2 C o p p e r C o p p e r 12um 2 1 + / 6 u mPI PI 25um 25umL3 C o p p e r C o p p e r 12um 2 1 + / 6 u mAD 25umC o v
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