【正文】 ABLE CONDITION)接腳表面吃錫良好。足夠的錫將引線腳焊住Must have sufficient solder to form a properly wetted fillet拒收標準 (NONCONFORMING DEFECT) not sufficient solder to form a properly wetted fillet DewettingPAGE 9Have sufficient solder to form aproperly wetted filletSMT110 焊點性標準 QFP腳面焊點最大量 (次缺 Minor) SMT 外 觀 檢 驗 規(guī) 範圓的凸焊錫帶延伸過引線腳的頂部焊墊邊且碰觸到零件本體理想狀況 (TARGET CONDITION) 接腳表面吃錫良好，引線腳的輪 廓清楚可見，但不能接觸零件本體High profile device solder may extend to ,but must not touch the package body or end seal允收標準 (ACCEPTABLE CONDITION)錫多，連接很好且呈一凹面焊 錫帶但不能接觸零件本體拒收標準 (NONCONFORMING DEFECT)High profile device solder may extend to ,but touch the package body or end sealPAGE 10High profile device solder may extend to ,but must not touch the package body or end sealSMT111 焊點性標準 QFP腳跟焊點最小量 (次缺 Minor)SMT 外 觀 檢 驗 規(guī) 範TPCBHTPCBH ≧ 1/2T 允收標準 (ACCEPTABLE CONDITION)TPCBH ＜ 1/2T 拒收標準 (NONCONFORMING DEFECT)理想狀況 (TARGET CONDITION) 接腳前端的焊錫帶延伸到引線上,且超過腳厚 1/2。The height of wetting solder must be greater than 1/2 of lead’s thickness.接腳前端的焊錫帶延伸到引線上,且超過腳厚 1/2 (H ≧ 1/2T )。The height of wetting solder must be greater than or equal to 1/2 of lead’s thickness.接腳前端的焊錫帶延伸到引線上,且未及腳厚 1/2(H ＜ 1/2T )。The height of wetting solder is less than 1/2 of lead’s thickness.PAGE 11SMT112 焊點性標準 QFP腳跟焊點最大量 (次缺 Minor)腳跟的焊錫帶延伸到引線上彎曲處底部的上方，延伸過 高碰觸零件本體。SMT 外 觀 檢 驗 規(guī) 範PCB理想狀況 (TARGET CONDITION) 1. 腳跟的焊錫帶延伸到引線上彎 曲處與下彎曲處間的中心點。 wetting and solder is extended to the middle point of lead. 腳跟的焊錫帶延伸到引線上彎曲處的底部。Solder is over the middle point of lead but not touch package body.PCB允收標準 (ACCEPTABLE CONDITION)PAGE 12High profile device solder may extend to ,but must not touch the package body or end sealPCB拒收標準 (NONCONFORMING DEFECT)SMT113 焊點性標準 J型接腳零件之焊點最小量 (次缺 Minor)1. 焊錫帶存在於引線的三側(cè)。2. 焊錫帶涵蓋引線彎曲處兩側(cè)的 50% 以上 (H≧ 1/2T)。SMT 外 觀 檢 驗 規(guī) 範理想狀況 (TARGET CONDITION) T允收標準 (ACCEPTABLE CONDITION)拒收標準 (NONCONFORMING DEFECT)TH≧ 1/2TH。 wetting of lead is clear。1. Good wetting, solder is around of lead.2. The solder height which cover lead must greater than or equal to 189。 T.1. 焊錫帶存在於引線的三側(cè)。2. 焊錫帶涵蓋未及引線彎曲處兩 側(cè)的 50% (H 1/2T)。1. Dewetting wetting, solder dosen’t cover around of lead.2. The solder height which cover lead is less than 189。 T.PAGE 13SMT114 焊點性標準 J型接腳零件之焊點最大量 (次缺 Minor)焊錫帶接觸到組件本體。SMT 外 觀 檢 驗 規(guī) 範理想狀況 (TARGET CONDITION) T。 wetting of lead is clear。允收標準 (ACCEPTABLE CONDITION)。 3. 凹面焊錫帶延伸到引線彎 曲處 的上方 ,但在組件本體的下方。 wetting of lead is clear。 covers lead fully but dosen’t touch package body.拒收標準 (NONCONFORMING DEFECT)PAGE 14High profile device solder may extend to ,but must not touch the package body or end sealSMT115 焊點性標準 晶片狀零件之最小焊點 (主缺 Major)SMT 外 觀 檢 驗 規(guī) 範H理想狀況 (TARGET CONDITION) 允收標準 (ACCEPTABLE CONDITION)拒收標準 (NONCONFORMING DEFECT)P 1/4HPWP ≧ 1/4HP。2. 焊錫從銲墊端延伸到組件端。 wetting of lead is clear。1..焊錫延伸到組件端的 25% 以上2..焊錫從組件端向外延伸 到焊墊 的距離為組件高度 的 25% 以上1 Length covered by solder must be over 1/4 width of solder pad.2 Height covered by solder must be over 1/4 height of ponent terminator.1..焊錫量未及焊墊的 25%2..焊錫量未及組件高度 的 25%1 Length covered by solder is less than 1/4 width of solder pad.2 Height covered by solder is less than 1/4 height of ponent terminator.PAGE 15SMT116 焊點性標準 晶片狀零件之最大焊點 (次缺 Minor)SMT 外 觀 檢 驗 規(guī) 範H理想狀況 (TARGET CONDITION) 允收標準 (ACCEPTABLE CONDITION)拒收標準 (NONCONFORMING DEFECT)W， 焊錫從銲 墊端延伸到組件端。 fillet height(E) is the solder thickness(G) plus ponent termination height(H)焊錫延伸到零件上端但不超過上端碰觸到本體Maximum fillet height(E) may overhang the land or extend onto the top of the end cap metallization however,the solder shall not extend further onto the ponent body 焊錫延伸到零件上端超過上端碰觸到本體Maximum fillet height(E) may overhang the land or extend onto the top of the end cap metallization however,the solder extend further onto the ponent bodyPAGE 16GEHW GESMT117 焊錫性標準 焊錫性問題 ( 錫珠、錫渣 ) (主缺 Major)無任何錫珠、錫渣、錫尖 殘留於PCB。1..零件面錫珠、錫渣允收狀況可 被剝除者 ,直徑 D或長度 L 小於 等於 5mil ,非沾於零件腳上不 造成短路的錫珠。 (渣 )面積小於等於 600mm2 或數(shù)目為 5個，判定允收。SMT 外 觀 檢 驗 規(guī) 範理想狀況 (TARGET CONDITION) 允收標準 (ACCEPTABLE CONDITION)拒收標準 (NONCONFORMING DEFECT)No solder ball, residue or solder spike remain on M/B 不易被剝除者 L≦ 10mil 可被剝除者 D≦ 5mil or 面積 ≦ 600mm2 ,數(shù)目 5個D L1. Solder ball’s diameter or length of solder residue must be less than 5mil.2. The quantity which solder residue’s surface area is more than 600mm2 must be less than 5..PAGE 17SMT118 零件組裝標準 Regulator功率電晶體 對準度 (主缺 Major) SMT 外 觀 檢 驗 規(guī) 範理想狀況 (TARGET CONDITION) PAGE 18拒收標準 (NONCONFORMING DEFECT)允收標準 (ACCEPTABLE CONDIT