【正文】 IOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C3 checklist ?HW DV test report ?SW FV test report ?ME test report ?Reliability test report (prel.) ?ME/Artwork packing drawing ?PAL/ROM data listing ?C3 manufacturability review report ?Sample approve status bug list review C3/PM C3 Meeting C3 工作重點及檢核項目 階段 C3樣品試作階段 (Lab Pilot Run Phase) 負責單位 技術經(jīng)理 (Technical Manager) 研發(fā)部門 目的 * 設計驗證 * 依測試結果修改、變更設計 工作重點 * 樣品試作材料準備 * 樣品試作 * 針對樣品進行測試及驗證 * 搜集 Project成本資料 * 擬定 C3品質(zhì)量化目標 * 機構設計問題檢討及除錯 (Debug)， 測試報告檢討 * 電路設計問題檢討及除錯 (Debug)， 測試報告檢討 * 軟體設計問題檢討除錯 (Debug)， 測試報告檢討 * 法務 稽核文件之形成要件是否符合法定要件或工程規(guī)範 專利著作權、商標等智慧財產(chǎn)權之申請準備 審核會議 C3 目的 檢討樣品測試驗證之結果、並決定是否進入工程試作階段 檢核項目 * HW design verification report * Micro processor/EEPROM data listing * Mechanical test report * SW function verification test report * Mechanical Drawing (Preliminary) * C3 Test Report * C4 Test Plan New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status bug list review ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/Utility/Diagnostic release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list C4/PM C4 Meeting Wistron Mobile Reliability Test Plan Environment ? Thermal Profile Test ? Temperature and Humidity Test ? Vibration, Shock, Drop Tests ? Altitude Test, Acoustics Tests ? MTBF Prediction EMC ? Lightning/Surge Test ? Voltage Dip Test ? EFT, ESD Test ? Harmonic Test ? IEC10004XX ? EMI/EMS Power Line Interference ? Line Voltage/Frequency Test ? Power Surge Test ? Voltage Dip and Interruption ? Power On/Off Test ? EFT/B Immunity Test ? Complex Margin Test Transportation ? Vibration Test ? Altitude Test ? Shock Test ? Drop Test User ? Incline Operation Test ? Bench Handling Test ? Power Saving Test ? Pressure Test ? Audio Quality ? Torture Test Reliability Test – LCD Module Wistron Mobile Reliability Test Plan Item Test Condition Sample Size Time Result High Temp / High Humid Op 50℃ 80%RH Dynamin 20 500 Hours Pass Low Temp Op 0℃ , Dynamic 5 500 Hours Pass High Temp Op 60℃ , Dynamic 10 500 Hours Pass High Temp / High Humid storage 60℃ , 90%RH, Storage 2 240 Hours Pass Low Temp storage 20℃ , Storage 2 240 Hours Pass T/C ( NonOp ) 20℃ (30Min) ~ 60℃ (30Min), Storage 3 100cycle Pass Altitude test Operating Storage 2 72 Hours Pass ELP 20℃ , Dynamic 50 72 Hours Pass Vibration(NonOp) 5~500Hz, , , X/Y/Z 3 Pass Shock(NonOp) 180G, 2msec, Half Sine, 177。 X, 177。 Y, 177。 Z 3 Pass Box Vibration 5~500Hz, , Box Drop 76㎝ drop 15 Pass ESD Operating Top_Case : 177。 12kV Panel Ⅰ : 177。 15kV Panel Ⅱ : 177。 15kV 5 Pass NonOperating User connector : 177。 2kV Bottom cover :177。 12kV 5 Pass Panel (ref) 177。 3kV 5 Pass Push 5kgf (result After 24Hours) 2 Pass Image Sticking Mo