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qfn封裝工藝(已改無錯(cuò)字)

2022-08-20 13:01:22 本頁面
  

【正文】 pound膠體 Leadframe 導(dǎo)綫架 Gold wire 金綫 Die晶片 Epoxy (Silver paste) 環(huán)氧樹脂(銀膠) Die attach pad 貼 Die 墊 Molding pound模壓膠體 Epoxy (Silver paste)銀膠 Die晶片 Gold wire金綫 Solder ball錫球 BT resin 樹脂基片 Through hole貫穿孔 Die晶片 Gold wire金綫 LOC tape LOC膠帶 ? Leadframe with Downset導(dǎo)綫架下置 ? LOC (Leadonchip)導(dǎo)綫架上置 Package Types and Applications封裝類型及應(yīng)用 Stacked wiring Multilayer 1st bond Wire Bonding Examples焊綫 視圖 Lead bonding on chip引腳 焊在 晶片上 Solder bonds on chip錫球植在晶片上 Connection Examples 接綫舉例 Epoxy pound 流動(dòng)模擬圖 1 Epoxy pound 流動(dòng)模擬圖 2 Epoxy pound 流動(dòng)模擬圖 3 Epoxy pound 流動(dòng)模擬圖 4 Wafer backside grinding Die sawing Epoxy paste Die attach Wire bonding Molding 傳統(tǒng) IC PACKAGE 工藝一 Backside Marking (Laser/ink) ABC World Leading Wafer FAB Trimming Solder plating Forming 傳統(tǒng) IC PACKAGE 工藝二 Marking ABC World Leading Wafer FAB ABC World Leading Wafer FAB ABC World Leading Wafer FAB ABC World Leading Wafe
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