esdprotectiondesignseminar英文版-閱讀頁
2025-02-05 10:54本頁面
【正文】 4 22Component and System Specifications4 There is no simple formula to translate system specifications into ponent specifications IEC 100042 Specification is more severe than HBM Line capacitance and inductance shape the ESD pulse, reducing its peak value Poor device placement can degrade performance If there are multiple devices on a line, decide which to protect The relationship between downstream clamp voltage and downstream protection is not exact2023/3/4 23Validating the Design4 Define the practical limits of functional failure (. Data integrity, recovery time)4 Test only at those places subject to touch during normal operation4 Use Contact ES Discharges to coupling planes conductive surfaces, I/O pins, flex pads, and power pins 4 Use Air ES Discharges to insulating surfaces, openings at edges of keys, flex cables, vent areas, seams, slots, apertures2023/3/4 24Total Solution Cost4 ESD failure is a question of statistics4 One cannot eliminate all reliability issues4 Goal is to minimize total solution cost Cost of reliability Cost of protection4 Must find proper minimum2023/3/4 25Lightning vs. ESD 200MV 30kA 30us 15kV 45A 80nS2023/3/4 26演講完畢，謝謝觀看！
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