【正文】 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Flip Chip Attach (if applicable)Equipment Make and Model numberProvide Reflow Profile Graph of Qual lot (repeat for qualification lot 2 and 3) if different from SMT reflow profile. Profile to be obtained pre lot for all qual lots.Provide data:Time above liquidousTime to 150176。CReflow profile nameNitrogen Oven O2 ppmZone SettingsZ1Z2Z3Z4Z5Z6Z7Z8Z9Z10Z11Z12TopBTMAttach MethodParametersNeedle (per die) Tolerance Transfer SpeedStage 1 Start Position mm/s Stage 1 Start Position mm/s Mold Cure Time Flange Packages (if applicable)Post Flange Flatness Measurement – Data per ten flanges Measure five locations per flange, center and four corners.Flange Flatness, (repeat for lot 2 and 3) 1 2 3 4 5 Min Max Avg F1F2F3F4F5F6F7F8F9F10MoldMake and Model of machine:Mold Compound Transfer Program:Position of plunger at start (mm Pellet Height, PS (PS = Position Start)):mm: Speed of plunger (mm/sec from start to next position, PS to P1):mm/sec:Position of plunger for next position (mm P1):mm: Speed of plunger (mm/sec from P1 to P2):mm/sec:Position of plunger for next position (mm P2):mm: Speed of plunger (mm/sec from P2 to P3):mm/sec:Position of plunger for next position (mm P3):mm: Speed of plunger (mm/sec from P3 to P4):mm/sec:Position of plunger at final end position (PE = Position End):mm:*Cull Height setting amp。 actual PSI:PSI Setting: PSI Actual:Transfer Time (time from PS to PE):Sec:**Mold Temperature setting amp。C Setting:186。C Setting:186。C:Sec:Clamp Force:Ton:Pellets per plunger sleeve:Quantity:Pellet size:Length mm:Gram weight:Cavity vacuum degree:Torr, mBar, or other*Cull height setting is from machine program. Actual mm is full cull piece height as measured from extreme top to bottom. Please note if a top cull setting feature is added or subtracted from any position setting(s) – (positive or negative cull). Cull height是在機(jī)臺(tái)程序中設(shè)定。注意top cull的設(shè)定特性參數(shù)為正數(shù)還是負(fù)數(shù)。 laminate/leadframe e in contact with mold die. 模溫區(qū)域：包括所有與料餅，基板/引線框相接觸的模具表面。預(yù)熱時(shí)間是從料餅放入套筒中到頂桿開(kāi)始移動(dòng)的時(shí)間。使用秒表進(jìn)行測(cè)量。 Form (Use if Applicable)Make and Model numberStroke per/minPackage Tip to Tip, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg TTPackage Standoff, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg PSPackage Coplanarity, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg CLead Integrity, (repeat for lot 2 and 3)Pass/fail End of Line Inspection and Yield ReportSMT (If Applicable)Defect Breakdown Qty in Qty out Yield Die Attach Defect Breakdown Qty in Qty out Yield Flip Chip Atach Defect Breakdown Qty in Qty out Yield Wire Bond Defect Breakdown Qty in Qty out Yield 3rd Optical Defect Breakdown Qty in Qty out Yield Mold Defect Breakdown Qty in Qty out Yield Lid Attach Defect Breakdown Qty in Qty out Yield Gross amp。 Form (If Applicable) Defect Breakdown Qty in Qty out Yield 4th Optical Defect Breakdown Qty in Qty out Yield 批考試驗(yàn)的其他報(bào)告需求/Additional Report Requirements Per Qualification LotAccelerated MSL Testing (Module Package only), follow Module Assembly PKG211013 and MSL Report Format PKG211035加速M(fèi)SL測(cè)試(僅模塊封裝產(chǎn)品有此需求)， 參考RFMD文件PKG211013和MSL報(bào)告格式PKG211035Supply 5 XRays of Total Package所有產(chǎn)品提供5張XRay圖片Supply 5 Solder Joint Crack Cross Section, Provide photo of all cross sections. (If Applicable)提供5個(gè)切片檢驗(yàn)錫膏焊接裂痕的問(wèn)題，并提供切片的照片(如果需要)Supply 5 Flip Chip Solder Joint Crack Cross Section, Provide photo of all cross sections. (If Applicable)提供5個(gè)切片檢驗(yàn)倒裝芯片錫球焊接裂痕的問(wèn)題，并提供切片的照片(如果需要)Supply 5 Underfill Back Grind (for inspection of underfill of SMD’s and Flip Chip), Provide photos and analysis of back grinds. (If Applicable)提供研磨后的5顆產(chǎn)品檢驗(yàn)元器件和倒裝芯片的底部填充問(wèn)題，并提供研磨后的照片和分析。Perform silicon die bond pad crack inspection post wirebond for 10 pads / lot. Attach 1 worst case picture per lot.每批產(chǎn)品球焊完成后檢驗(yàn)硅片的10個(gè)pad的彈坑，并附pad受損最嚴(yán)重的照片Supply 1 open faced strip per lot as require in the purchase order按客戶訂單要求每批產(chǎn)品中提供一條未塑封的產(chǎn)品Comprehensive Yield Report綜合的良率報(bào)告改善計(jì)劃/Corrective Action Plan for top 5 Rejects1.2.3.4.5.24 / 2