【正文】 mechanical structure design, appearance design three major areas. At the same time, mobile phone design is gradually being mobile phone manufacturing industry value chain important one annulus. This paper introduces the basic structure of GSM work and current situation, the basic operation of LabView module and characteristic and function, wireless munication chip GTM900C function and characteristic, the use of AT mand, using LabView software to build the PC machine and the wireless munication module interface and program debugging. The design mainly uses the virtual mobile phone interface procedures, through the virtual mobile phone interface control hardware circuit for realizing mobile phone dialing call, call, send and receive text messages and other basic munication function. The hardware is posed of GTM900C module, power supply module, control module. Keywords: GSM munication； mobile terminals； wireless munication system platform； GTM900C 目 錄 第一章 前言 ............................................................................................................................... 1 課題的研究目的及其意義 .............................................................................................. 1 GSM 系統(tǒng)歷史背景 ....................................................................................................... 1 移動通信的發(fā)展?fàn)顩r及未來 ........................................................................................... 3 GSM 移動通信系統(tǒng)基本 組成原理簡述 ........................................................................... 4 系統(tǒng)組成結(jié)構(gòu) .............................................................................................. 4 系統(tǒng)的接口 ................................................................................................. 4 手機(jī)終端的發(fā)展 ............................................................................................................ 6 目前手機(jī) ............................................................................................................ 6 未來手機(jī) ............................................................................................................ 7 LabView 發(fā)展及其優(yōu)點(diǎn) .................................................................................................. 8 的發(fā)展 ................................................................................................... 8 虛擬儀器的功能和特點(diǎn) ....................................................................................... 9 第二章 LabView 圖形化編程語言 ...............................................................................................11 LabView 簡介 ...............................................................................................................11 LabView 構(gòu)建程序框圖 .................................................................................................11 前面板 ...............................................................................................................11 流程圖 .............................................................................................................. 12 圖標(biāo)與連接器 ................................................................................................... 13 LabView 的操作模板 .................................................................................................... 13 工具模板（ Tools Palette） ................................................................................. 13 控制模板（ Control Palette） .............................................................................. 14 功能模板 (Functions Palette)................................................................................ 15 虛擬儀器的構(gòu)成 .......................................................................................................... 17 通用儀器硬件平臺 ............................................................................................ 17 軟件結(jié)構(gòu) .......................................................................................................... 18 創(chuàng)建手機(jī)界面的 VI 程序 .............................................................................................. 19 前面板 .............................................................................................................. 19 程序框圖設(shè)計 ................................................................................................... 20 最終程序（函數(shù)面板部 分） .............................................................................. 25 程序調(diào)試方法 .............................................................................................................. 25 第三章 無線通訊模塊的設(shè)計與開發(fā) .......................................................................................... 27 硬件介紹及原理圖 ...................................................................................................... 27 硬件體系結(jié)構(gòu)介紹 ............................................................................................ 27 硬件介紹 .......................................................................................................... 27 硬件接口設(shè)計 ............................................................................................................. 30 電源接口 .......................................................................................................... 31 串行接口 ......................................................................................................... 31 SIM 卡接口 ....................................................................................................... 32 硬件各模塊電路設(shè)計 .................................................................................................. 33 穩(wěn)壓模塊 ......................................................................................................... 33 單片機(jī)控制模塊 ............................................................................................... 34 MAX232 控制模塊 .....................................................